IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0787498
(1999-09-17)
|
국제출원번호 |
PCT/US99/021509
(1999-09-17)
|
§371/§102 date |
20010316
(20010316)
|
국제공개번호 |
WO00/016833
(2000-03-30)
|
발명자
/ 주소 |
- Frazier,A. Bruno
- Brazzle,John D.
|
출원인 / 주소 |
- The University of Utah Research Foundation
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
41 인용 특허 :
37 |
초록
▼
Surface micro-machined micro-needles (32) are formed as single needles (32) or in two-dimensional or three-dimensional micro-needle arrays (30). The micro-needles (32) are fabricated on a substrate (12) which can remain attached to the micro-needles (32) or can be subsequently removed. The two-dimen
Surface micro-machined micro-needles (32) are formed as single needles (32) or in two-dimensional or three-dimensional micro-needle arrays (30). The micro-needles (32) are fabricated on a substrate (12) which can remain attached to the micro-needles (32) or can be subsequently removed. The two-dimensional or three-dimensional micro-needle arrays (30) can have cross-coupling flow channels (36) which allow for pressure equalization, and balance of fluid flow within the micro-needle arrays (30). Each of the micro-needles (32) has a micro-channel (36) therethrough that provides communication between at least one input port (37) at a proximal end of the micro-needles (32), and at least on output port (39) at an opposite distal end.
대표청구항
▼
What is claimed is: 1. A microneedle array device, comprising: a substrate having a substantially planar first surface and an edge adjacent said substantially planar first surface; and a plurality of hollow non-silicon microneedles positioned on said substantially planar first surface of said subst
What is claimed is: 1. A microneedle array device, comprising: a substrate having a substantially planar first surface and an edge adjacent said substantially planar first surface; and a plurality of hollow non-silicon microneedles positioned on said substantially planar first surface of said substrate, each of said hollow non-silicon microneedles having a microchannel therethrough providing communication between at least one input port at a proximal end of each of said hollow non-silicon microneedles and at least one output port at a distal end of each of said hollow non-silicon microneedles, wherein said hollow non-silicon microneedles extend beyond said edge of said substrate and extend in a direction substantially parallel to said substantially planar first surface. 2. The microneedle array device of claim 1, wherein said hollow non-silicon microneedles each have a bottom wall, two side walls, and a top wall defining a microchannel. 3. The microneedle array device of claim 2, wherein said bottom wall is formed at least partially on top of said substantially planar first surface of said substrate and said side walls and top wall are formed around a removable molding material. 4. The microneedle array device of claim 1, wherein said hollow non-silicon microneedles comprise a two dimensional array. 5. The microneedle array device of claim 1, wherein said hollow non-silicon microneedles comprise a three dimensional array. 6. The microneedle array device of claim 5, wherein said three dimensional array comprises a plurality of two dimensional arrays with spacers therebetween. 7. The microneedle array device of claim 6, wherein said three dimensional array is bonded together by a material selected from the group consisting of molding materials, polymeric adhesives, and combinations thereof. 8. The microneedle array device of claim 1, wherein said hollow non-silicon microneedles are aligned substantially parallel to each other on said substrate. 9. The microneedle array device of claim 1, wherein the distal end of each said hollow non-silicon microneedle extends beyond said edge of said substrate a distance from about 10 μm to about 100 mm. 10. The microneedle array device of claim 1, wherein said microchannel in each of said hollow non-silicon microneedles has a cross-sectional area in the range from about 25 μm2 to about 5000 μm2. 11. The microneedle array device of claim 1, wherein the length of each said hollow non-silicon microneedle is from about 0.05 μ m to about 5 mm, and the width of each said hollow non-silicon microneedle is from about 0.05 μm to about 1 mm. 12. The microneedle array device of claim 1, wherein the center-to-center spacing between individual said hollow non-silicon microneedles is from about 50 μm to about 200 μm. 13. The microneedle array device of claim 1, wherein said substrate comprises a material selected from the group consisting of glass, semiconductor materials, metals, ceramics, plastics, and composites or combinations thereof. 14. The microneedle array device of claim 1, wherein said hollow non-silicon microneedles comprise a material selected from the group consisting of metals, plastics, ceramics, glass, carbon black, and composites or combinations thereof. 15. The microneedle array device of claim 1, wherein said hollow non-silicon microneedles comprise a metal material selected from the group consisting of nickel, copper, gold, palladium, titanium, chromium, and alloys or combinations thereof. 16. The microneedle array device of claim 1, wherein said hollow non-silicon microneedles can withstand flow rates of up to about 1. 5 cc/sec. 17. The microneedle array device of claim 1, further comprising a coupling channel member providing fluid communication between said hollow non-silicon microneedles. 18. The microneedle array device of claim 17, wherein said coupling channel member is composed of the same material as said hollow non-silicon microneedles. 19. The microneedle array device of claim 1, further comprising a pair of structural support members mechanically interconnecting said hollow non-silicon microneedles and precisely controlling penetration depth of said hollow non-silicon microneedles. 20. The microneedle array device of claim 1, wherein said hollow non-silicon microneedles have a plurality of input ports. 21. The microneedle array device of claim 1, wherein said hollow non-silicon microneedles have a plurality of output ports. 22. A microneedle device, comprising: a substrate having a substantially planar first surface and an edge adjacent said substantially planar first surface; and a single hollow non-silicon microneedle positioned on said substantially planar first surface of substrate, said hollow non-silicon microneedle having at least one microchannel therethrough providing communication between at least one input port at a proximal end of said hollow non-silicon microneedle and at least one output port at distal end of said hollow non-silicon microneedle, the distal end of said hollow non-silicon microneedle extending beyond said edge of said substrate, wherein said hollow non-silicon microneedle extends in a direction substantially parallel to said substantially parallel first surface. 23. The microneedle device of claim 22, wherein the distal end of said hollow non-silicon microneedle extends beyond said edge of said substrate a distance from about 10 μm to about 100 mm. 24. The microneedle device of claim 22, wherein said microchannel in said hollow non-silicon microneedle has a cross-sectional area in the range from about 25 μm2 to about 5000 μm 2. 25. The microneedle device of claim 22, wherein said substrate comprises a material selected from the group consisting of glass, semiconductor materials, metals, ceramics, plastics, and composites or combinations thereof. 26. The microneedle device of claim 22, wherein said hollow non-silicon microneedle comprises a metal material selected from the group consisting of nickel, copper, gold, palladium, titanium, chromium, and alloys or combinations thereof. 27. The microneedle device of claim 22, wherein the distal end has a plurality of output ports. 28. The microneedle device of claim 22, further comprising a structural support to control penetration depth. 29. The microneedle device of claim 28, wherein said structural support is adapted to mechanically fix the microneedle device to a surface that is penetrated by said hollow non-silicon microneedle. 30. A method of fabricating a microneedle, comprising: providing a substrate with a substantially planar first surface; depositing a metal material on said substantially planar first surface to form one or more bottom walls for one or more microneedles; coating a top surface of said one or more bottom walls with a photoresist layer to a height corresponding to a selected inner height of a microchannel for said one or more microneedles; depositing a metal material to form side walls and a top wall upon said one or more bottom walls and around said photoresist layer; and removing said photoresist layer from said microchannel of said one or more microneedles; wherein said one or more microneedles are formed on said substantially planar first surface of said substrate and extend in a direction substantially parallel to said substantially planar first surface. 31. The method of claim 30, wherein the metal material is deposited by an electroplating process. 32. The method of claim 30, wherein the metal material is selected from the group consisting of palladium, titanium, chromium, nickel, gold, copper, and alloys thereof.
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