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Systems and methods are provided for delivering solid precursors. In certain embodiments of the present application, a flow monitor is used to measure and regulate the flow of vaporized solid precursor material from a vaporization chamber to a deposition chamber. The flow monitor chokes the supply

Systems and methods are provided for delivering solid precursors. In certain embodiments of the present application, a flow monitor is used to measure and regulate the flow of vaporized solid precursor material from a vaporization chamber to a deposition chamber. The flow monitor chokes the supply of vapor into the deposition chamber to regulate vapor flow. To avoid condensation of the solid precursor material in the delivery lines or flow monitor, a controller is placed in a feed back loop to monitor the flow rate and make adjustments to the amount of vapor available at the inlet of the flow monitor. Additional embodiments are disclosed and claimed.

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What is claimed is: 1. A device comprising a vapor delivery system, said vapor delivery system comprising: a vaporization chamber; a first surface within said vaporization chamber; a solid precursor material supported by said first surface within said chamber; a heating device configured to transfe

What is claimed is: 1. A device comprising a vapor delivery system, said vapor delivery system comprising: a vaporization chamber; a first surface within said vaporization chamber; a solid precursor material supported by said first surface within said chamber; a heating device configured to transfer heat to said first surface, said heating device comprising a temperature control configured to vary the temperature of said first surface to a temperature sufficient to transform said solid precursor material to a vapor; a vapor delivery line coupled to said vaporization chamber; a flow monitor arranged to measure the flow of said vapor through said vapor delivery line; and a controller configured to control the temperature of said heating device as a function of said measured flow of vapor through said vapor delivery line. 2. A device as claimed in claim 1, wherein said temperature control is configured to vary the temperature of said first surface to a temperature sufficient to sublimate said solid precursor material. 3. A device as claimed in claim 1 wherein said device further comprises a deposition chamber and said vapor delivery line is arranged to couple said vaporization chamber to said deposition chamber. 4. A device comprising a vapor delivery system, said vapor delivery system comprising: a vaporization chamber; a first surface within said vaporization chamber; a solid precursor material supported by said first surface within said chamber; a heating device configured to transfer heat to said first surface, said heating device comprising a temperature control configured to vary the temperature of said first surface to a temperature sufficient to transform said solid precursor material to a vapor; a vapor delivery line coupled to said vaporization chamber; a flow monitor arranged to measure the flow of said vapor through said vapor delivery line; a pressure sensor arranged to measure the pressure of said vapor within said vapor delivery line; a gas source coupled to said vaporization chamber, said gas source configured to supply an inert gas to said vapor delivery line; and a controller configured to control the temperature of said heating device as a function of said measured flow of vapor through said vapor delivery line and control the supply of said inert gas to said vapor delivery line as a function of the measured pressure of said vapor within said vapor delivery line. 5. A device as claimed in claim 4 wherein said device further comprises a deposition chamber and said vapor delivery line is arranged to couple said vaporization chamber to said deposition chamber. 6. A device comprising a vapor delivery system, said vapor delivery system comprising: a vaporization chamber; a first surface within said vaporization chamber; a solid precursor material supported by said first surface within said chamber; a heating device configured to transfer heat to said first surface, said heating device comprising a temperature control configured to vary the temperature of said first surface to a temperature sufficient to transform said solid precursor material to a vapor; a vapor delivery line coupled to said vaporization chamber; a flow monitor arranged to measure the flow of said vapor through said vapor delivery line; a pressure sensor arranged to measure the pressure of said vapor within said vapor delivery line; a temperature sensor arranged to measure the temperature of said vapor within said vapor delivery line; a gas source configured to supply an inert gas to said vapor delivery line; a flow regulator coupled to said gas source; and a controller configured to control the temperature of said heating device as a function of said measured flow of vapor through said vapor delivery line, and adjust the flow of said inert gas through said flow regulator as a function of said measured pressure and temperature of said vapor within said vapor delivery line. 7. A device as claimed in claim 6 wherein said device further comprises a deposition chamber and said vapor delivery line is arranged to couple said vaporization chamber to said deposition chamber. 8. A device comprising a vapor delivery system, said vapor delivery system comprising: a vaporization chamber; a first surface within said vaporization chamber; a solid precursor material supported by said first surface; a heating device arranged to heat said first surface to a temperature sufficient to transform said solid precursor material to a vapor; a vapor delivery line coupled to said vaporization chamber, said vapor delivery line arranged to route said vapor in a first direction and a second direction; a flow monitor arranged to measure the flow of said vapor through said vapor delivery line in said first direction; a valve arranged to regulate the flow of said vapor through said vapor delivery line in said second direction; a pump coupled to said vapor delivery line, said first pump arranged to draw vapor through said vapor delivery line in said second direction; and a controller configured to bleed off excess amounts of said vapor in said vapor delivery line as a function of the measured flow of said vapor through said vapor delivery line in said first direction. 9. A device as claimed in claim 8, further comprising a pressure sensor arranged to measure the pressure of said vapor within said vapor delivery line in said first direction, wherein said controller is further configured to adjust said valve as a function of said measured pressure of said vapor within said vapor delivery line. 10. A device as claimed in claim 9, wherein said controller is arranged to compare said measured pressure against a guard band range of pressures, and said controller is configured to adjust said valve if said measured pressure is outside of said guard band range of pressures. 11. A device as claimed in claim 8, further comprising a temperature sensor arranged to measure the temperature of said vapor within said vapor delivery line in said first direction, wherein said controller is further configured to control said valve as a function of said measured temperature of said vapor within said vapor delivery line. 12. A device as claimed in claim 8, further comprising a gas source configured to transfer gas to said vapor delivery line to regulate gas pressure within said vapor delivery line, wherein said controller is further configured to adjust the amount of said gas that is supplied to said vapor delivery line as a function of said measured flow of vapor through said vapor delivery line. 13. A device as claimed in claim 8, wherein said valve is positioned upstream of said flow monitor. 14. A device as claimed in claim 8 wherein said device further comprises a deposition chamber and said vapor delivery line is arranged to couple said vaporization chamber to said deposition chamber. 15. A device comprising a vapor delivery system, said vapor delivery system comprising: a vaporization chamber; a first surface within said vaporization chamber; a solid precursor material supported by said first surface; a heating device arranged to heat said first surface to a temperature sufficient to transform said solid precursor material to a vapor; a vapor delivery line coupled to said vaporization chamber, said vapor delivery line arranged to route said vapor in a first direction and a second direction; a flow monitor arranged to measure the flow of said vapor through said vapor delivery line in said first direction; a pressure sensor arranged to measure the pressure of said vapor within said vapor delivery line in said first direction; a valve arranged to regulate the flow of said vapor through said vapor delivery line in said second direction; a pump coupled to said vapor delivery line, said first pump arranged to draw vapor through said vapor delivery line in said second direction; and a gas source coupled to an inlet in said vaporization chamber, said gas source arranged to supply an inert gas to said vapor delivery line; a flow regulator between said gas source and said inlet in said vaporization chamber; and a controller configured to bleed off excess amounts of said vapor in said vapor delivery line as a function of the measured flow of said vapor in said vapor deliver line and the measured pressure of said vapor in said vapor delivery line. 16. A device as claimed in claim 15 wherein said device further comprises a deposition chamber and said vapor delivery line is arranged to couple said vaporization chamber to said deposition chamber. 17. A device comprising a vapor delivery system, said vapor delivery system comprising: a vaporization chamber; a first surface within said vaporization chamber; a solid precursor material supported by said first surface; a heating device arranged to heat said first surface to a temperature sufficient to transform said solid precursor material to a vapor; a vapor delivery line coupled to said vaporization chamber, said vapor delivery line arranged to route said vapor in a first direction and a second direction; a flow monitor arranged to measure the flow of said vapor through said vapor delivery line in said first direction; a pressure sensor arranged to measure the pressure of said vapor within said vapor delivery line in said first direction; a temperature sensor arranged to measure the temperature of said vapor within said vapor delivery line in said first direction; a valve arranged to regulate the flow of said vapor through said vapor delivery line in said second direction; a first pump coupled to said vapor delivery line, said first pump arranged to draw vapor through said vapor delivery line in said second direction; and a gas source coupled to an inlet in said vaporization chamber, said gas source arranged to supply an inert gas to said vapor delivery line; a flow regulator between said gas source and said inlet in said vaporization chamber; and a controller configured to bleed off excess amounts of said vapor in said vapor delivery line as a function of the measured flow of said vapor in said vapor deliver line, the measured pressure of said vapor in said vapor deliver line, and the measured temperature of said vapor in said vapor delivery line. 18. A device as claimed in claim 17 wherein said device further comprises a deposition chamber and said vapor delivery line is arranged to couple said vaporization chamber to said deposition chamber. 19. A device comprising a vapor delivery system, said vapor delivery system comprising: a vaporization chamber; a first surface within said vaporization chamber; a solid precursor material supported by said first surface; a heating device configured to transfer heat to said first surface, said heating device comprising a temperature control configured to vary the temperature of said first surface to a temperature sufficient to transform said solid precursor material to a vapor; a vapor delivery line coupled to said vaporization chamber, said vapor delivery line arranged to route said vapor in a first direction and a second direction; a flow monitor arranged to measure the flow of said vapor through said vapor delivery line in said first direction; a valve arranged to regulate the flow of said vapor through said vapor delivery line in said second direction; a pump coupled to said vapor delivery line, said first pump arranged to draw vapor through said vapor delivery line in said second direction; and a controller configured to control the temperature of said heating device as a function of said measured flow of vapor through said vapor delivery line and bleed off excess amounts of said vapor in said vapor delivery line as a function of said measured flow of vapor through said vapor delivery line. 20. A device as claimed in claim 19, further comprising a pressure sensor arranged to measure the pressure of said vapor within said vapor delivery line, wherein said controller is configured to control said heating device based at least in part on the measured pressure of said pressure sensor. 21. A device as claimed in claim 20, further comprising a gas source configure to supply a gas to said vapor delivery line, wherein said controller is further configured to control the amount of said gas that is supplied to said vapor delivery line by said gas source as a function of said measured flow of said vapor through said vapor delivery line. 22. A device as claimed in claim 21, further comprising a temperature sensor arranged to measure the temperature of said vapor within said vapor delivery line, wherein said controller is configured to bleed off excess amounts of said vapor in said vapor delivery line as a function of the measured temperature of said vapor in said vapor delivery line. 23. A device as claimed in claim 19, further comprising a temperature sensor arranged to measure the temperature of said vapor within said vapor delivery line, wherein said controller is configured to bleed off excess amounts of said vapor in said vapor delivery line as a function of the measured temperature of said vapor in said vapor delivery line. 24. A device as claimed in claim 19, further comprising a gas source configure to supply a gas to said vapor delivery line, wherein said controller is further configured to control the amount of said gas that is supplied to said vapor delivery line by said gas source as a function of said measured flow of said vapor through said vapor delivery line. 25. A device as claimed in claim 24, wherein said gas comprises an inert gas. 26. A device as claimed in claim 19 wherein said device further comprises a deposition chamber and said vapor delivery line is arranged to couple said vaporization chamber to said deposition chamber.