초록 ▼

An integrated motherboard for a small form factor computer comprises a CPU socket located in a central region of the motherboard. A south bridge/north bridge chipset is located next to the CPU socket towards the front of the motherboard, and a memory module is located next to the south bridge/north

An integrated motherboard for a small form factor computer comprises a CPU socket located in a central region of the motherboard. A south bridge/north bridge chipset is located next to the CPU socket towards the front of the motherboard, and a memory module is located next to the south bridge/north bridge chipset towards the front of the motherboard. One or more PCI slots are located on one side of the CPU socket, and a power module is located on the other side of the CPU socket.

대표청구항 ▼

I claim: 1. An integrated motherboard for a small form factor computer, the motherboard comprising: a CPU socket for receiving a CPU, the CPU socket located in a central region of the motherboard; a south bridge/north bridge chipset; a memory module wherein the CPU socket, the south bridge/north br

I claim: 1. An integrated motherboard for a small form factor computer, the motherboard comprising: a CPU socket for receiving a CPU, the CPU socket located in a central region of the motherboard; a south bridge/north bridge chipset; a memory module wherein the CPU socket, the south bridge/north bridge chipset, and the memory module are disposed on the motherboard in a substantially linear arrangement; at least one PCI slot located next to the CPU socket on one side of the linear arrangement; and a power module located next to the CPU socket on an opposite side of the linear arrangement. 2. The motherboard of claim 1, wherein the CPU socket is located at approximately the center of the motherboard. 3. The motherboard of claim 1, wherein the motherboard is less than or equal to about 25.4 centimeters in depth and less than or equal to about 18.5 centimeters in width. 4. A motherboard having a front, a back, and two sides, the motherboard comprising: a CPU socket located in a central region of the motherboard; a south bridge/north bridge chipset located next to the CPU socket towards the front of the motherboard; a memory module located next to the south bridge/north bridge chipset towards the front of the motherboard; at least one PCI slot located next to the CPU socket towards a side of the motherboard; and a power module located next to the CPU socket towards a side of the motherboard opposite the at least one PCI slot. 5. The motherboard of claim 4, further comprising: an input/output module located near the back of the motherboard. 6. The motherboard of claim 4, wherein the motherboard is less than or equal to about 25.4 centimeters in depth and less than or equal to about 18.5 centimeters in width. 7. A method of cooling the integrated motherboard of claim 1, comprising directing an air flow in a single path over the linear arrangement of the CPU socket, the south bridge/north bridge chipset, and the memory module to remove the heat generated thereby. 8. A method of cooling the motherboard of claim 4, comprising directing an air flow in a single path over the CPU socket, the south bridge/north bridge chipset, and the memory module to remove the heat generated thereby.