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High speed, high density interconnect system for differential and single-ended transmission systems

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01R-012/00
출원번호 US-0971683 (2004-10-25)
발명자 / 주소
  • Driscoll,Michael P.
  • Vetter,Stephen
  • Bradley,Robert M.
출원인 / 주소
  • Litton Systems, Inc.
대리인 / 주소
    Rothwell, Figg, Ernst &
인용정보 피인용 횟수 : 13  인용 특허 : 222

초록

The present invention is directed to a high density electrical connector which can provide 80 or more twinax connections per linear inch in a 20 millimeter card slot. In a typical electronic system package, 20 millimeters is the spacing from center line to center line of the adjacent parallel daught

대표청구항

What is claimed is: 1. An interconnect system, comprising: a backplane comprising (a) a first signal pad on a first surface of the backplane and (b) a second signal pad also on the first surface of the backplane; a daughter-board comprising (a) a third signal pad on a first surface of the daughter-

이 특허에 인용된 특허 (222)

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  208. Broschard ; III John L. (Harrisburg PA) Davis Wayne S. (Harrisburg PA), Stacked electrical connector with diecast housing and drawn shells.
  209. Carnahan Blake A. (Cazenovia NY) Ilacqua Peter P. (Memphis NY), Stripline to stripline coaxial transition.
  210. Shores Marvin W. (Pomona CA), Suppressor for electromagnetic interference.
  211. Glover Douglas W. (Harrisburg PA) Harner Donald R. (Camp Hill PA), Surface mount HDI contact.
  212. Paagman Bernardus L. F.,NLX, Surface mount connector with integrated PCB assembly.
  213. Kachlic Jerry D. (Milpitas CA) Seong AuYong C. (Jurong East SGX), Surface mount electrical connector.
  214. Gosselin Jacques P. (Paris FRX), Surface mountable contact element and assembly.
  215. Rose William J. (West Hartford CT) Aekins Robert (Stratford CT), Telecommunication connector with feedback.
  216. Richard Scott Kline, Terminal module having open side for enhanced electrical performance.
  217. Hardie William G. (Landenberg PA) Theorin Craig R. (Landenberg PA), Twin-ax cable.
  218. Ko David Tso-Chin, Twinax coaxial flat cable connector assembly.
  219. Quan Clifton (Arcadia CA), Vertical right angle solderless interconnects from suspended stripline to three-wire lines on MIC substrates.
  220. Quan Clifton ; Robertson Edward L. ; Jorgenson Rosie M. ; Hashimoto Mark Y. ; Roberts David E., Wideband shielded coaxial to microstrip orthogonal launcher using distributed discontinuities.
  221. Riddle Robert G. (Escondido CA) Douglass Jeffrey A. (Poway CA) Voss John D. (Cumming GA) Ellis Stephen C. (Murrieta CA), Wideband solderless right-angle RF interconnect.
  222. Li Che-yu ; Korhonen Matti A. ; Shi Weimin, Wire segment based interposer for high frequency electrical connection.

이 특허를 인용한 특허 (13)

  1. Lloyd, Brian Keith; Walz, Gregory B.; Reed, Bruce; Fitzgerald, Gregory; Isaac, Ayman; Regnier, Kent E.; Janowiak, Brandon; Schulz, Darian R.; Ahmad, Munawar; Jones, Eran J.; Resendez, Javier; Rost, Michael, Circuit board bypass assemblies and components therefor.
  2. Regnier, Kent E., Connector system with cable by-pass.
  3. Regnier, Kent E., Connector system with cable by-pass.
  4. Hatch, Stephen McGarry, Dual contact pogo pin assembly.
  5. Hatch, Stephen McGarry, Dual contact pogo pin assembly.
  6. Lloyd, Brian Keith; Hirschy, Christopher David; Ahmad, Munawar; Jones, Eran J.; Hamblin, Stephen W.; Schulz, Darian Ross; Ward, Todd David; Walz, Gregory B.; Abunasrah, Ebrahim; Khan, Rehan, High speed bypass cable assembly.
  7. Wanha, Christopher D.; Lloyd, Brian Keith; Abunasrah, Ebrahim; Khan, Rehan; Resendez, Javier; Rost, Michael, High speed bypass cable for use with backplanes.
  8. Wanha, Christopher D.; Lloyd, Brian Keith; Abunasrah, Ebrahim; Khan, Rehan; Resendez, Javier; Rost, Michael, High speed bypass cable for use with backplanes.
  9. Wanha, Christopher D.; Lloyd, Brian Keith; Abunasrah, Ebrahim; Khan, Rehan; Resendez, Javier; Rost, Michael, High speed bypass cable for use with backplanes.
  10. Cohen, Thomas S., High-frequency electrical connector.
  11. Champion, Shaun L.; Ives, Philip H.; Andreas, Harry A.; Lee, Norman C.; Dooley, Karrie D., Microelectronic assemblies.
  12. Newman, Jerry R.; Sung, Jeffrey; York, Justin E.; Hua, Chanh V., Stacking network switches.
  13. Kowalski, Bobby Jim; Denny, Ronald R.; Seward, James T.; Ebsen, Michael P.; Rosenthal, Thomas; Leinberger, William J.; Josephson, Andrew D.; Young, Jeffery Stagg, System and method for interconnecting circuit boards.
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