IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0896907
(2004-07-23)
|
우선권정보 |
TW-93105325 A(2004-03-01) |
발명자
/ 주소 |
- Wang,Shao Hwa
- Lin,Chi Sheng
|
출원인 / 주소 |
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
0 인용 특허 :
3 |
초록
▼
A method for repairing and assembling contact image sensor module and structure thereof are provided. The method includes following steps: (1) making a sensor housing; (2) providing a PCB; (3) assembling the PCB into the sensor housing; (4) melting an end of a securing post located on the sensor hou
A method for repairing and assembling contact image sensor module and structure thereof are provided. The method includes following steps: (1) making a sensor housing; (2) providing a PCB; (3) assembling the PCB into the sensor housing; (4) melting an end of a securing post located on the sensor housing and forming fastening means for fixing the PCB to the sensor housing; (5) testing the assembled CIS, if it can't pass the test, then cut off the fastening means and take away the PCB for repairing or replacing it; (6) cutting off the securing post located on the housing; (7) making an adapted post with a securing tip and fixing said adapted post to a corresponding position of the sensor housing on which the former securing post being located; (8) assembling the repaired or replaced PCB into the sensor housing, and make the securing tip of the adapted post passing through the securing hole and extending outwardly from the PCB; (9) melting the tip of the adapted post by the manner of hot-press and forming a new fastening means for fixing the repaired or replaced PCB to the sensor housing again.
대표청구항
▼
The invention claimed is: 1. A method for repairing and assembling contact image sensor (CIS) module, comprising following steps: (1) preparing a sensor housing having a first surface, a second surface, at least a securing post, and a plurality of receiving grooves being adapted to receive a plural
The invention claimed is: 1. A method for repairing and assembling contact image sensor (CIS) module, comprising following steps: (1) preparing a sensor housing having a first surface, a second surface, at least a securing post, and a plurality of receiving grooves being adapted to receive a plurality of optical elements; (2) preparing a PCB having photosensor elements, electronic elements and circuits thereon and being adapted to receive the light signals produced by the said optical elements and convert said light signals into the electrical signals, said PCB further having at least a securing hole on a predetermined position thereof; (3) assembling the PCB into the sensor housing, the securing post of the sensor housing passing through the securing hole and extending through the PCB; (4) melting the tip of the securing post and forming a fastening means for fixing the PCB to the sensor housing; (5) testing the assembled CIS module, if the module can't pass the test, then doing the following steps: (6) cutting off the fastening means and taking away the PCB for repairing or replacing; (7) cutting off the securing post located on the sensor housing; (8) preparing a adapted post having a predetermined length of securing post and fixing said adapted post to a corresponding position of the sensor housing on which the original securing post located; (9) assembling the repaired or replaced PCB into the sensor housing, and make the tip of the adapted post passing through the securing hole and extending outwardly from the PCB; (10) melting the tip of the adapted post and forming a fastening means for fixing the repaired or replaced PCB to the sensor housing; (11) testing the repaired CIS module, if need, repeat the steps from step (6) to step (11) until the CIS passes the test. 2. The method for repairing and assembling contact image sensor module as claimed in claim 1, wherein the sensor housing has a plurality of molded securing posts therewith, each securing post having a securing base near the bottom to connect to the sensor housing thereof, the outer diameter of said base being larger than the outer diameter of the tip of securing post. 3. The method for repairing and assembling contact image sensor module as claimed in claim 2, wherein the adapted post has a hollow portion, the inside diameter of said hollow portion being a little larger than the outside diameter of the securing base, so that said hollow portion of the adapted post can cover the securing base. 4. The method for repairing and assembling contact image sensor module as claimed in claim 3, wherein the inside surface of the hollow portion has at least a cavity thereon, with identified shape to making the sidewall uneven. 5. The method for repairing and assembling contact image sensor module as claimed in claim 4, wherein the adapted post is glued to the securing base, and the surplus glue being filled into the cavity of the hollow portion during the process of gluing. 6. The method for repairing and assembling contact image sensor module as claimed in claim 1, wherein the optical element in the sensor housing at least include a rod lens and a LED light source. 7. The method for repairing and assembling contact image sensor module as claimed in claim 6, wherein LED light source comprises a LED and an optical rod. 8. A method for manufacturing an electrical device, comprising following steps: (1) preparing a housing of an electrical device having a portion made of thermoplastic material, said portion including at least a securing post made of thermoplastic material; (2) preparing a circuit board having electronic elements and circuits thereon and being adapted to process the electrical signals, said circuit board further having at least a securing hole on a predetermined position thereof; (3) assembling said circuit board into the housing, the securing post of the housing passing through the securing hole and extending outwardly from the circuit board; (4) melting the tip of the securing post by the manner of hot-press and forming a fastening means for fixing the circuit board to the housing; (5) testing the assembled electrical device, if the device can't pass the test, then doing the following steps: (6) cutting off the fastening means and taking away the circuit board for repairing or replacing it; (7) cutting off the securing post located on the housing; (8) preparing a adapted post having a predetermined length of securing post and fixing the adapted post to a corresponding position of the housing on which the former securing post located; (9) assembling the repaired or replaced circuit board into the housing, and make the tip of the adapted post passing through the securing hole and extending outwardly from the circuit board; (10) melting the tip of the adapted post by the manner of hot-press and forming a fastening means for fixing the repaired or replaced circuit board to the housing; (11) testing the repaired electrical device, if need, repeat the steps from step (6) to step (11) until the device passes the test. 9. The method for manufacturing a electrical device as claimed in claim 8, wherein the housing has a plurality of plastic-molded securing posts, each of said securing post having a securing base near the bottom thereof, and the base's outside diameter being larger than the outer diameter of the tip of securing post. 10. The method for manufacturing a electrical device as claimed in claim 9, wherein the adapted post has a hollow portion, the inside diameter of said hollow portion being a little larger than the outside diameter of said securing base, so that said hollow portion of the adapted post can cover the securing base. 11. The method for manufacturing an electrical device as claimed in claim 10, wherein the sidewall hollow portion has at least a cavity with identified shape to making the sidewall uneven. 12. The method for manufacturing an electrical device as claimed in claim 11, when the adapted post is glued to the securing base, the surplus glue being filled into said cavity of the hollow portion during the process of gluing. 13. An adapted post is used in the method for repairing and assembling the circuit board described by claim 1. 14. The method for repairing and assembling contact image sensor module as claimed in claim 5, wherein the optical element in the sensor housing at least include a rod lens and a LED light source. 15. An adapted post is used in the method for repairing and assembling the circuit board described by claim 8.
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