초록 ▼

The invention relates to a method of removing a peripheral zone of adhesive while using a layer of adhesive in the process of assembling and transferring a layer of material from a source substrate to a support substrate. The method is remarkable in that it includes bonding the two substrates togeth

The invention relates to a method of removing a peripheral zone of adhesive while using a layer of adhesive in the process of assembling and transferring a layer of material from a source substrate to a support substrate. The method is remarkable in that it includes bonding the two substrates together by means of a curable adhesive so that an excess of adhesive is present. This assures proper bonding and provides a peripheral zone of adhesive outside of the joined substrates. Only that portion of adhesive is cured which is present in a connection zone between the substrates, and the peripheral zone of non-cured adhesive is removed prior to detaching the transferable layer. The invention is applicable to fabricating a composite substrate in the fields of electronics, opto-electronics, or optics.

대표청구항 ▼

What is claimed is: 1. A method for transferring a transferable layer of material onto a support substrate, the method comprising: joining a source substrate that includes a transferable layer to a support substrate that is to receive the transferable layer by depositing an adhesive onto a surface

What is claimed is: 1. A method for transferring a transferable layer of material onto a support substrate, the method comprising: joining a source substrate that includes a transferable layer to a support substrate that is to receive the transferable layer by depositing an adhesive onto a surface of at least one of the substrates to create a connection zone between the substrates which connection zone includes the adhesive; treating the connection zone to increase adhesion properties of the adhesive; and detaching the transferable layer from the source substrate to provide the support substrate with the transferable layer and the connection zone, and removing at least a portion of adhesive located beyond the periphery of the transferable layer, the support substrate or the connection zone formed between the transferable layer and support substrate prior to detaching the transferable layer. 2. The method of claim 1, wherein the adhesive is deposited in an amount such that a peripheral zone of adhesive is formed at the periphery of at least one of the source substrate or the support substrate and a portion or all of this peripheral zone is removed. 3. The method of claim 2, wherein the peripheral zone of adhesive is created when the adhesive is deposited. 4. The method of claim 2, wherein the peripheral zone of adhesive is created when the connection zone is created. 5. A method for transferring a transferable layer of material onto a support substrate, the method comprising: joining a source substrate that includes a transferable layer to a support substrate that is to receive the transferable layer by depositing an adhesive onto a surface of at least one of the substrates to create a connection zone between the substrates which connection zone includes the adhesive; treating the connection zone to increase adhesion properties of the adhesive; and detaching the transferable layer from the source substrate to provide the support substrate with the transferable layer and the connection zone, wherein the method further includes removing the peripheral zone of adhesive from the periphery of the at least one substrate before adhering the substrates together. 6. The method of claim 1, wherein the adhesive is photocurable, and further wherein at least one of the source or support substrates is transparent to light radiation to facilitate photocuring of the adhesive. 7. The method of claim 6, wherein the treating step includes exposing the connection zone to light rays, and placing a mask between the light rays and the peripheral zone of adhesive to prevent photocuring of the adhesive in the peripheral zone to facilitate removal of a portion or all of the peripheral zone. 8. The method of claim 7, wherein the mask substantially corresponds in size to the peripheral zone of adhesive and all or a portion of the adhesive is removed from the periphery of the at least one substrate after adhering the substrates together. 9. The method of claim 1, wherein the adhesive comprises a thermoset material, and further wherein the treating step comprises heating the connection zone to set and cure the adhesive. 10. The method of claim 9, wherein the heating step comprises applying a laser beam to locally heat the connection zone of adhesive for a sufficient amount of time to increase the adhesion properties of the adhesive but without increasing the adhesive properties of the adhesive located beyond the periphery of the transferable layer, the support substrate or the connection zone formed between the transferable layer and support substrate. 11. The method of claim 1, wherein the source substrate further includes a detachment zone between the transferable layer and source substrate. 12. The method of claim 11, wherein the detachment zone is a porous layer, a releasable bonding interface, or a stop layer that forms a barrier against chemical or mechanical attack. 13. The method of claim 11, wherein the detachment zone is formed by implantation of atomic species to a predetermined depth beneath the surface of the source substrate. 14. The method of claim 13, wherein the implantation of atomic species is performed with an ion beam implanter or a plasma implanter, and further wherein the atomic species is hydrogen ions. 15. The method of claim 11, wherein the detaching step comprises applying stress to the detachment zone in an amount sufficient to detach the transferable layer from the source substrate. 16. The method of claim 11, wherein the transferable layer and the source substrate each comprise silicon, and further wherein the detachment zone includes a releasable bonding interface comprising silicon oxide. 17. A method for transferring a transferable layer of material onto a support substrate, the method comprising: joining a source substrate that includes a transferable layer to a support substrate that is to receive the transferable layer by depositing an adhesive onto a surface of at least one of the substrates to create a connection zone between the substrates which connection zone includes the adhesive; curing the adhesive in the connection zone to increase adhesion properties of the adhesive; and detaching the transferable layer from the source substrate to provide the support substrate with the transferable layer and the connection zone, wherein the adhesive is deposited in an amount such that a peripheral zone of adhesive is formed at a periphery of at least one of the source substrate or the support substrate, and which further comprises removing the peripheral zone of adhesive prior to detaching the transferable layer. 18. The method of claim 17, wherein the connection zone includes an amount of adhesive that overflows onto a side of at least one of the substrates. 19. The method of claim 17, wherein the adhesive is photocurable, at least one of the source or support substrates is transparent to light radiation to facilitate photocuring of the adhesive, the treating step includes exposing the connection zone to light rays, and placing a mask between the light rays and the peripheral zone of adhesive to prevent photocuring of the adhesive in the peripheral zone. 20. The method according to claim 18, wherein the mask is withdrawn and the peripheral zone of adhesive is removed by chemical cleaning. 21. The method of claim 1, wherein the transferable layer comprises at least a portion of an electronic or an opto-electronic component. 22. The method of claim 1 wherein the connection zone is treated in a manner to increase the adhesion properties of the adhesive but without increasing the adhesive properties of the adhesive located beyond the periphery of the transferable layer, the support substrate or the connection zone formed between the transferable layer and support substrate. 23. A method for transferring a transferable layer of material onto a support substrate, the method comprising: joining a source substrate that includes a transferable layer to a support substrate that is to receive the transferable layer by depositing an adhesive onto a surface of at least one of the substrates to create a connection zone between the substrates which connection zone includes the adhesive; treating the connection zone to increase adhesion properties of the adhesive; detaching the transferable layer from the source substrate to provide the support substrate with the transferable layer and the connection zone, and removing at least a portion of adhesive located beyond the periphery of the transferable layer, the support substrate or the connection zone formed between the transferable layer and support substrate; wherein all or a portion of the adhesive located beyond the periphery of the transferable layer, the support substrate or the connection zone formed between the transferable layer and support substrate is removed prior to treating the connection zone. 24. The method of claim 1 wherein all or a portion of the adhesive located beyond the periphery of the transferable layer, the support substrate or the connection zone formed between the transferable layer and support substrate is removed after joining the substrates together. 25. A method for transferring a transferable layer of material onto a support substrate, the method comprising: joining a source substrate that includes a transferable layer to a support substrate that is to receive the transferable layer by depositing an adhesive onto a surface of at least one of the substrates to create a connection zone between the substrates which connection zone includes the adhesive; treating the connection zone to increase adhesion properties of the adhesive; detaching the transferable layer from the source substrate to provide the support substrate with the transferable layer and the connection zone, and removing at least a portion of adhesive located beyond the periphery of the transferable layer, the support substrate or the connection zone formed between the transferable layer and support substrate; wherein the adhesive is deposited in an amount such that a peripheral zone of adhesive is formed at the periphery of at least one of the source substrate or the support substrate and all or a portion of the peripheral zone is removed prior to joining the source substrate and transferable layer. 26. A method for transferring a transferable layer of material onto a support substrate, the method comprising: joining a source substrate that includes a transferable layer to a support substrate that is to receive the transferable layer by depositing an adhesive that comprises a thermoset material onto a surface of at least one of the substrates to create a connection zone between the substrates which connection zone includes the adhesive; heating the connection zone to set and cure the adhesive; detaching the transferable layer from the source substrate to provide the support substrate with the transferable layer and the connection zone, and removing at least a portion of adhesive located beyond the periphery of the transferable layer, the support substrate or the connection zone formed between the transferable layer and support substrate; wherein all or a portion of the adhesive located beyond the connection zone formed between the transferable layer and support substrate is removed after joining the substrates together but prior to detaching the transferable layer.