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"" 따옴표 내의 구문과 완전히 일치하는 문서만 검색 예) "Transform and Quantization"

특허 상세정보

Polarizing electrode for electric double layer capacitor and electric double layer capacitor therewith

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H01G-009/00   
미국특허분류(USC) 361/502; 361/508; 361/516; 423/445.R
출원번호 US-0721783 (2003-11-26)
우선권정보 JP-2002-349170(2002-11-29); JP-2002-349172(2002-11-29); JP-2003-369379(2003-10-29); JP-2003-369381(2003-10-29)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Arent Fox PLLC
인용정보 피인용 횟수 : 5  인용 특허 : 6
초록

A polarizing electrode for an electric double layer capacitor has good moldability and can achieving higher density of electrode and higher capacity, and an electric double layer capacitor employs the same. The electric double layer capacitor is made of an activated carbon obtained by activating a hard-to-graphitize material (for example, phenol resin) with water vapor, and the activated carbon has a median particle size within a range from 4 μm to 8 μm in the particle size distribution and at least a peak observed on the side of smaller partic...

대표
청구항

What is claimed is: 1. Activated carbon, obtained by activating a hard-to-graphitize material with water vapor, has a median particle size ranging a range from 4 μm to 8 μm in a particle size distribution when measured by laser diffraction method, and the particle size distribution has at least a peak located at a particle size which is lower than the median particle size. 2. Activated carbon according to claim 1, wherein activated carbon particles of not larger than 2 μm is not less than 10% by weight in a cumultive distribution of the...

이 특허를 인용한 특허 피인용횟수: 5

  1. Yoshinaga, Naoto; Ibaraki, Satoshi; Kodani, Yoshinobu; Ikeda, Takaomi. Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor. USP2014028658120.
  2. Yoshinaga, Naoto; Wakayama, Yoshiharu; Ibaraki, Satoshi; Shimomura, Jun; Murage, Yoshimi; Shiomi, Niro; Kodani, Yoshinobu; Ikeda, Takaomi. Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor. USP2012108293860.
  3. Yoshinaga, Naoto; Wakayama, Yoshiharu; Ibaraki, Satoshi; Shimomura, Jun; Murage, Yoshimi; Shiomi, Niro; Kodani, Yoshinobu; Ikeda, Takaomi. Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor. USP2013048409756.
  4. Yoshinaga, Naoto; Wakayama, Yoshiharu; Ibaraki, Satoshi; Shimomura, Jun; Murage, Yoshimi; Shiomi, Niro; Kodani, Yoshinobu; Ikeda, Takaomi. Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor. USP2012048158095.
  5. Yoshinaga, Naoto; Wakayama, Yoshiharu; Ibaraki, Satoshi; Shimormura, Jun; Murage, Yoshimi; Shiomi, Niro; Kodani, Yoshinobu; Ikeda, Takaomi. Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor. USP2013048411415.