초록

An implantable component including a feedthrough assembly and a method for forming the feedthrough assembly wherein a coating forming a fluid barrier over an insulator, an insulator-to-terminal pin interface and an insulator-to-ferrule interface is incorporated.

대표청구항 ▼

What is claimed is: 1. An implantable component including a feedthrough assembly, the feedthrough assembly comprising: an insulator electrically isolating a terminal pin from a ferrule, the terminal pin extending through the ferrule; an insulator-to-ferrule interface; an insulator-to-terminal pin i

What is claimed is: 1. An implantable component including a feedthrough assembly, the feedthrough assembly comprising: an insulator electrically isolating a terminal pin from a ferrule, the terminal pin extending through the ferrule; an insulator-to-ferrule interface; an insulator-to-terminal pin interface; and a backfill deposited over the insulator and including a non-conductive polymer coating forming a fluid barrier over the insulator, the insulator-to-ferrule interface and the insulator-to-terminal pin interface, wherein the backfill further includes a layer of epoxy and the coating is located between the epoxy layer and the insulator. 2. The component of claim 1, wherein the coating has a maximum thickness approximately less than or equal to 0.01 inch. 3. The component of claim 2, wherein the maximum thickness is between approximately 0.0001 inch and approximately 0005 inch. 4. The component of claim 1, wherein the coating comprises a material selected from the group consisting of silicones, polyimides, and fluorosilicones. 5. The component of claim 4, wherein the backfill further includes at least one more coating formed over the coating. 6. The component of claim 1, wherein the backfill further includes at least one more coating formed over the coating. 7. The component of claim 6, wherein the epoxy layer is located between the coating and the at least one more coating. 8. The component of claim 6, wherein the backfill further includes a layer of silicone and the silicone layer is located between the coating and the at least one more coating. 9. The component of claim 1, wherein the coating contacts a top surface of the ferrule. 10. The component of claim 1, wherein the coating contacts the insulator. 11. The component of claim 1, wherein the insulator is formed of a glass material. 12. The component of claim 1, wherein the insulator is formed of a ceramic material. 13. The component of claim 12, further comprising a braze material at the insulator-to-ferrule interface and at the insulator-to-terminal pin interface and wherein the coating contacts the braze material at one or both of the interfaces. 14. An implantable component including a feedthrough assembly, the feedthrough assembly comprising: an insulator electrically isolating a terminal pin from a ferrule, the terminal pin extending through the ferrule; an insulator-to-ferrule interface; an insulator-to-terminal pin interface; and a backfill deposited over the insulator and including a non-conductive polymer coating forming a fluid barrier over the insulator, the insulator-to-ferrule interface and the insulator-to-terminal pin interface, wherein the backfill further includes a layer of epoxy and the epoxy layer is located between the coating and the insulator. 15. An implantable component including a feedthrough assembly, the feedthrough assembly comprising: an insulator electrically isolating a terminal pin from a ferrule, the terminal pin extending through the ferrule; an insulator-to-ferrule interface; an insulator-to-terminal pin interface; and a backfill deposited over the insulator and including a non-conductive polymer coating forming a fluid barrier over the insulator, the insulator-to-ferrule interface and the insulator-to-terminal pin interface, wherein the backfill further includes a layer of silicone and the coating is located between the silicone layer and the insulator. 16. An implantable component including a feedthrough assembly, the feedthrough assembly comprising: an insulator electrically isolating a terminal pin from a ferrule, the terminal pin extending through the ferrule interface; an insulator-to-ferrule; an insulator-to-terminal pin interface; and a backfill deposited over the insulator and including a non-conductive polymer coating forming a fluid barrier over the insulator, the insulator-to-ferrule interface and the insulator-to-terminal pin interface, wherein the backfill further includes a layer of silicone and the silicone layer is located between the coating and the insulator.