초록 ▼

An electronic component includes at least one semiconductor chip. The semiconductor chip is attached on a first side of a wiring board or a leadframe. The wiring board is provided with interconnect structures at least on a second side. The first side of the wiring board, with the semiconductor chip

An electronic component includes at least one semiconductor chip. The semiconductor chip is attached on a first side of a wiring board or a leadframe. The wiring board is provided with interconnect structures at least on a second side. The first side of the wiring board, with the semiconductor chip located on it, is completely enclosed by a package. The package is provided with a cooling element, which is an integral part of the package. The invention also relates to a method for producing the electronic component.

대표청구항 ▼

We claim: 1. An electronic component, comprising: a semiconductor chip having an active front side and a passive rear side without semiconductor structures; a wiring board having a first side connected by soldering connections to said active front side of said semiconductor chip and having intercon

We claim: 1. An electronic component, comprising: a semiconductor chip having an active front side and a passive rear side without semiconductor structures; a wiring board having a first side connected by soldering connections to said active front side of said semiconductor chip and having interconnect structures at least on a second side facing away from said semiconductor chip; a package completely enclosing said first side of said wiring board; a cooling element having a central area and clearances with a straight-sided V-shaped funnel cross section widening in an upward direction formed therein and being integrated in said package, said central area thickening and reaching toward said semiconductor chip, said package being form-lockingly engaged by a dovetail connection in said clearances; and a connecting layer connecting said central area of said cooling element and said passive rear side of said semiconductor chip so that said central area of said cooling element is not separated from said semiconductor chip by material of said package. 2. The electronic component according to claim 1, wherein said wiring board is a leadframe. 3. An electronic component, comprising: a semiconductor chip having an active front side and a passive rear side without semiconductor structures; a wiring board having a first side connected by soldering connections to said passive rear side of said semiconductor chip and having interconnect structures at least on a second side facing away from said semiconductor chip; a package completely enclosing said first side of said wiring board; a cooling element having a central area and clearances with a straight-sided v-shaped funnel cross section widening in an upward direction formed therein and being integrated in said package, said central area thickening and reaching toward said semiconductor chip, said package being form-lockingly engaged by a dovetail connection in said clearances; and a connecting layer connecting said central area of said cooling element and said active front side of said semiconductor chip so that said central area of said cooling element is not separated from said semiconductor chip by material of said package. 4. The electronic component according to claim 1, wherein said cooling element is a metal plate. 5. The electronic component according to claim 1, wherein said clearances have a round contour. 6. The electronic component according to claim 1, wherein: said cooling element has a side length; and said clearances have a diameter sized from 3 to 15% of said side length of the cooling element. 7. The electronic component according to claim 1, wherein said clearances are formed by etching. 8. The electronic component according to claim 1, wherein said clearances are formed by laser drilling. 9. The electronic component according to claim 1, wherein said clearances are formed by punching. 10. The electronic component according to claim 1, wherein said package is a plastic package. 11. The electronic component according claim 1, wherein said package is an injection-molded plastic package. 12. The electronic component according to claim 1, including a further semiconductor chip; said cooling element having a matrix structure with a plurality of surface-area portions each covering a respective semiconductor chip and separating joints subdividing neighboring surface-area portions. 13. A method for producing an electronic component, which comprises; providing a semiconductor chip having an active front side and a passive rear side without semiconductor structures; providing a wiring board having a first side and a second side facing away from the semiconductor chip, the second side having interconnect structures formed thereon; mounting the semiconductor chip to the wiring board by connecting the first side of the wiring board to the active front side of the semiconductor chip by soldering connections; applying a package to the semiconductor chip and the wiring board to completely enclose the first side of the wiring board; integrating a cooling element to the package, the cooling element having a central area and clearances with a straight-sided V-shaped funnel cross section widening in an upward direction formed therein, the central area thickening and reaching toward the semiconductor chip, the package being form-lockingly engaged by a dovetail connection in the clearances; and providing a connecting layer connecting the central area of the cooling element and the passive rear side of the semiconductor chip so that the central area of the cooling element is not separated from the semiconductor chip by material of the package. 14. The method according to claim 13, which further comprises using a leadframe as the wiring board. 15. The method according to claim 13, which further comprises applying a plurality of semiconductor chips to the wiring board. 16. The method according to claim 15, which further comprises separating the wiring board into individual electronic components after applying the package and the cooling element. 17. The method according to claim 13, which further comprises producing the package from plastic by transfer molding. 18. The method according to claim 17, which further comprises: attaching the cooling element to one part of a mold having an upper mold part and a lower mold part; and separating the cooling element from the mold after the transfer molding step. 19. The method according to claim 18, which further comprises sealing the cooling element from the mold with a film. 20. The method according to claim 13, which further comprises: providing sawing track regions on the wiring board; providing separating joints in the cooling element; and disposing congruently the track regions on the separating joints. 21. The method according to claim 18, which further comprises: providing the cooling element with cooling areas and a frame surrounding the frame; connecting the frame to the cooling areas by thin webs; clamping the cooling element in the mold between the upper mold part and lower mold part. 22. The method according to claim 21, which further comprises: removing the cooling element from the mold after molding; and severing the thin webs and the frame after the removing from the mold. 23. The electronic component according to claim 1, wherein said connecting layer directly connects said cooling element and said passive rear side of said semiconductor chip. 24. An electronic component, comprising: a semiconductor chip having an active front side and a passive rear side without semiconductor structures; a wiring board having a first side connected by soldering connections to said active front side of said semiconductor chip and having interconnect structures at least on a second side facing away from said semiconductor chip; a plastic package completely enclosing said first side of said wiring board; a cooling element having a central area and clearances with a funnel-shaped cross section widening in an upward direction formed therein and being integrated in said package, said central area thickening and reaching toward said semiconductor chip, said package being form-lockingly engaged by a dovetail connection in said clearances; and a connecting layer connecting said central area of said cooling element and said passive rear side of said semiconductor chip so that said central area of said cooling element is not separated from said semiconductor chip by plastic material of said plastic package.