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Conductive polishing article for electrochemical mechanical polishing 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24D-011/00
출원번호 US-0033732 (2001-12-27)
발명자 / 주소
  • Chen,Liang Yuh
  • Wang,Yuchun
  • Wang,Yan
  • Duboust,Alain
  • Carl,Daniel A.
  • Wadensweiler,Ralph
  • Birang,Manoocher
  • Butterfield,Paul D.
  • Mavliev,Rashid
  • Tsai,Stan D.
출원인 / 주소
  • Applied Materials Inc.
대리인 / 주소
    Patterson &
인용정보 피인용 횟수 : 20  인용 특허 : 55

초록

An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a

대표청구항

What is claimed is: 1. A polishing article for polishing a substrate, comprising: a body having a polishing surface adapted to polish the substrate; at least one conductive element embedded in the polishing surface, wherein the conductive element has a contact surface that extends beyond a plane d

이 특허에 인용된 특허 (55)

  1. Fujimori Keiichi,JPX ; Matsuo Junji,JPX, Abrasive dresser for polishing disc of chemical-mechanical polisher.
  2. Datta Madhav ; Edelstein Daniel Charles ; Uzoh Cyprian Emeka, Apparatus and method for the electrochemical etching of a wafer.
  3. Kishii Sadahiro (Kawasaki JPX) Arimoto Yoshihiro (Kawasaki JPX), Apparatus and method for uniformly polishing a wafer.
  4. Kishii Sadahiro (Kawasaki JPX) Arimoto Yoshihiro (Kawasaki JPX) Horie Hiroshi (Kawasaki JPX) Sugimoto Fumitoshi (Kawasaki JPX), Apparatus and method for uniformly polishing a wafer.
  5. Birang Manoocher ; Rosenberg Lawrence M. ; Somekh Sasson ; White John M, Apparatus and methods for chemical mechanical polishing with an advanceable polishing sheet.
  6. Peter J. Beckage, Apparatus for determining metal CMP endpoint using integrated polishing pad electrodes.
  7. Uzoh Cyprian Emeka ; Harper James McKell Edwin, Apparatus for electrochemical mechanical planarization.
  8. Cote William J. (Poughquag NY) Ryan James G. (Newtown CT) Okumura Katsuya (Poughkeepsie NY) Yano Hiroyuki (Wappingers Falls NY), Apparatus for processing semiconductor wafers.
  9. Damgaard Morten J.,DKX ; Bjerregaard Leila,DKX, Attachment means and use of such means for attaching a sheet-formed abrasive or polishing means to a magnetized support.
  10. Tabata Makoto (Furukawa JPX) Takezawa Hiroshi (Furukawa JPX), Automatic lapping apparatus for piezoelectric materials.
  11. Zuniga Steven ; Chen Hung ; Birang Manoocher, Carrier head for chemical mechanical polishing a substrate.
  12. Chen Lai-Juh,TWX, Chemical-mechanical polish (CMP) pad conditioner.
  13. Chen Lai-Juh,TWX, Chemical-mechanical polish (CMP) pad conditioner.
  14. Tsai Chia S. (Hsin-chu TWX) Tseng Pin-Nan (Hsin-chu TWX), Chemical/mechanical planarization (CMP) apparatus and polish method.
  15. Homayoun Talieh ; Cyprian Uzoh ; Bulent M. Basol, Device providing electrical contact to the surface of a semiconductor workpiece during metal plating.
  16. Datta Madhav (Yorktown Heights NY) O\Toole Terrence R. (Webster NY), Electrochemical metal removal technique for planarization of surfaces.
  17. Inoue ; Kiyoshi, Electrochemical polishing method.
  18. Datta Madhav (Yorktown Heights NY) Romankiw Lubomyr T. (Briarcliff Manor NY), Electrochemical tool for uniform metal removal during electropolishing.
  19. Weihs Timothy P. ; Mann Adrian B. ; Searson Peter C., Electrochemical-control of abrasive polishing and machining rates.
  20. Uzoh Cyprian E., Electroetch and chemical mechanical polishing equipment.
  21. Datta Madhav (Yorktown Heights NY) Shenoy Ravindra V. (Peekskill NY), Electroetching method and apparatus.
  22. Edelstein Daniel C. ; Horkans Wilma J. ; Luce Stephen E. ; Lustig Naftali E. ; Pope Keith R. ; Roper Peter D., Elimination of photo-induced electrochemical dissolution in chemical mechanical polishing.
  23. Birang Manoocher, Endpoint detector for a chemical mechanical polishing system.
  24. Shuzo Sato JP; Takuo Ihira JP, Flattening polishing device and flattening polishing method.
  25. Shendon Norman ; Sherwood Michael ; Lee Harry, Fluid-pressure regulated wafer polishing head.
  26. David F. Bocian ; Werner G. Kuhr ; Jonathan S. Lindsey, High density non-volatile memory device.
  27. Kaanta Carter W. (Colchester VT) Leach Michael A. (Bristol VT), In situ conductivity monitoring technique for chemical/mechanical planarization endpoint detection.
  28. Paton Eric N., Method and apparatus for chemical polishing using field responsive materials.
  29. Dow Daniel B., Method and apparatus for electrically endpointing a chemical-mechanical planarization process.
  30. Dow Daniel B., Method and apparatus for electrically endpointing a chemical-mechanical planarization process.
  31. Talieh Homayoun, Method and apparatus for electro-chemical mechanical deposition.
  32. Lustig Naftali Eliahu ; Guthrie William L. ; Sandwick Thomas E., Method and apparatus for in-line oxide thickness determination in chemical-mechanical polishing.
  33. Sabde Gundu M. ; Meikle Scott, Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives.
  34. Hui Wang, Method for electropolishing metal on semiconductor devices.
  35. Jalal Ashjaee ; Boguslaw A. Nagorski ; Bulent M. Basol ; Homayoun Talieh ; Cyprian Uzoh, Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing.
  36. Yu Chris C. (Boise ID) Doan Trung T. (Boise ID), Method of chemical mechanical polishing predominantly copper containing metal layers in semiconductor processing.
  37. Uzoh Cyprian Emeka ; Harper James McKell Edwin, Method of electrochemical mechanical planarization.
  38. Liu Yauh-Ching ; Perng Dung-Ching, Method of single step damascene process for deposition and global planarization.
  39. Liu Yauh-Ching ; Perng Dung-Ching, Method of single step damascene process for deposition and global planarization.
  40. Hui Wang, Methods and apparatus for electropolishing metal interconnections on semiconductor devices.
  41. Wang Hui, Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces.
  42. Cesna Joseph V., Methods and apparatus for improved polishing of workpieces.
  43. Cook Lee Melbourne ; James David B. ; Jenkins Charles William ; Reinhardt Heinz F. ; Roberts John V. H. ; Pillai Raj Raghav, Methods for using polishing pads.
  44. Hui Wang, Plating apparatus and method.
  45. Robinson Karl M., Polishing pad and a method for making a polishing pad with covalently bonded particles.
  46. Takiyama Masahiro (Shiojiri JPX) Miyazaki Kunihiro (Shiojiri JPX) Shiozawa Kenichiro (Ashiya JPX), Polishing pad for semiconductor wafers.
  47. Reinhardt Heinz F. (Chadds Ford PA) Roberts John V. H. (Newark DE) McClain Harry G. (Middletown DE) Budinger William D. (Newark DE) Jensen Elmer W. (New Castle DE), Polymeric polishing pad containing hollow polymeric microelements.
  48. Berman Michael J., Pre-conditioning polishing pads for chemical-mechanical polishing.
  49. Perlov Ilya ; Gantvarg Eugene ; Lee Harry Q. ; Somekh Sasson ; Tolles Robert D., Radially oscillating carousel processing system for chemical mechanical polishing.
  50. Uzoh Cyprian E. ; Edelstein Daniel C., Serial intelligent electro-chemical-mechanical wafer processor.
  51. Hsieh Shih-Huang,TWX ; Chen Li-Dum,TWX, Slurry supply system for chemical mechanical polishing.
  52. Leach Michael A. (Bristol VT) Paulsen James K. (Jericho VT) Machesney Brian J. (Burlington VT) Venditti Daniel J. (Essex Junction VT) Whitaker Christopher R. (Jericho VT), System for mechanical planarization.
  53. Meikle Scott ; Schultz Laurence D., Under-pad for chemical-mechanical planarization of semiconductor wafers.
  54. Tobin Jim, Wafer transfer station for a chemical mechanical polisher.
  55. Carlson David W., Web-format polishing pads and methods for manufacturing and using web-format polishing pads in mechanical and chemical-mechanical planarization of microelectronic substrates.

이 특허를 인용한 특허 (20)

  1. Manens, Antoine P.; Duboust, Alain; Neo, Siew S.; Chen, Liang Yuh, Algorithm for real-time process control of electro-polishing.
  2. Chen,Liang Yun; Wang,Yuchun; Wang,Yan; Duboust,Alain; Carl,Daniel A.; Wadensweiler,Ralph; Birang,Manoocher; Butterfield,Paul D.; Mavliev,Rashid A.; Tsai,Stan D.; Wang,You; Diao,Jie; Jia,Renhe; Karuppiah,Lakshmanan; Ewald,Robert, Conductive pad with ion exchange membrane for electrochemical mechanical polishing.
  3. Chen,Liang Yuh; Wang,Yuchun; Wang,Yan; Duboust,Alain; Carl,Daniel A.; Wadensweiler,Ralph; Birang,Manoocher; Butterfield,Paul D.; Mavliev,Rashid; Tsai,Stan D., Conductive polishing article for electrochemical mechanical polishing.
  4. Chen,Liang Yuh; Wang,Yuchun; Wang,Yan; Duboust,Alain; Carl,Daniel A.; Wadensweiler,Ralph; Birang,Manoocher; Butterfield,Paul D.; Mavliev,Rashid; Tsai,Stan D., Conductive polishing article for electrochemical mechanical polishing.
  5. Hu,Yongqi; Wang,Yan; Duboust,Alain; Liu,Feng Q.; Manens,Antoine P.; Neo,Siew S.; Tsai,Stan D.; Chen,Liang Yuh; Butterfield,Paul D.; Tian,Yuan A.; Ko,Sen Hou, Conductive polishing article for electrochemical mechanical polishing.
  6. Fang, Rui; Kulkarni, Deepak; Watts, David K. H., Electrical contact method.
  7. Fang, Rui; Kulkarni, Deepak; Watts, David K., Electrical contact structures and methods for use.
  8. Wang, Yan; Manens, Antoine P.; Neo, Siew S.; Duboust, Alain; Chen, Liang-Yuh, Endpoint for electroprocessing.
  9. Wang, Yuchun; Ewald, Robert A.; Hsu, Wei-Yung; Chen, Liang-Yuh, Extended pad life for ECMP and barrier removal.
  10. Inagawa, Makoto, Load lock roller ball support.
  11. Chen,Jian; Rajagopal,Ramasubramaniam, Nanocomposites and methods thereto.
  12. Chang,Shou Sung; Tsai,Stan D.; Olgado,Donald J. K.; Chen,Liang Yuh; Duboust,Alain; Wadensweiler,Ralph M., Pad assembly for electrochemical mechanical polishing.
  13. Chang,Shou Sung; Tsai,Stan D.; Olgado,Donald J. K.; Chen,Liang Yuh; Duboust,Alain; Wadensweiler,Ralph M., Pad assembly for electrochemical mechanical processing.
  14. Chen, Jian; Liu, Haiying, Polymer and method for using the polymer for noncovalently functionalizing nanotubes.
  15. Chen,Jian; Liu,Haiying, Polymer and method for using the polymer for noncovalently functionalizing nanotubes.
  16. Chen, Jian; Liu, Haiying, Polymer and method for using the polymer for solubilizing nanotubes.
  17. Chen,Jian; Liu,Haiying, Polymer and method for using the polymer for solubilizing nanotubes.
  18. Ait Haddou,Hassan; Rutkofsky,Marni Loriel, Polymers for enhanced solubility of nanomaterials, compositions and methods therefor.
  19. Manens,Antoine P.; Chen,Liang Yuh, Process control in electrochemically assisted planarization.
  20. Chen,Jian; Dyer,Mark J., System and method for manipulating nanotubes.
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