Semiconductor apparatus and fabrication method of the same
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01L-021/30
H01L-021/02
출원번호
US-0685398
(2003-10-16)
우선권정보
JP-2002-305084(2002-10-18)
발명자
/ 주소
Yamazaki,Shunpei
Takayama,Toru
Maruyama,Junya
Ohno,Yumiko
출원인 / 주소
Semiconductor Energy Laboratory Co., Ltd.
대리인 / 주소
Fish &
인용정보
피인용 횟수 :
77인용 특허 :
5
초록▼
It is an object of the present invention to provide a semiconductor device capable of preventing deterioration due to penetration of moisture or oxygen, for example, a light-emitting apparatus having an organic light-emitting device that is formed over a plastic substrate, and a liquid crystal displ
It is an object of the present invention to provide a semiconductor device capable of preventing deterioration due to penetration of moisture or oxygen, for example, a light-emitting apparatus having an organic light-emitting device that is formed over a plastic substrate, and a liquid crystal display apparatus using a plastic substrate. According to the present invention, devices formed on a glass substrate or a quartz substrate (a TFT, a light-emitting device having an organic compound, a liquid crystal device, a memory device, a thin-film diode, a pin-junction silicon photoelectric converter, a silicon resistance element, or the like) are separated from the substrate, and transferred to a plastic substrate having high thermal conductivity.
대표청구항▼
What is claimed is: 1. A method for manufacturing a semiconductor apparatus comprising: forming a release layer including a semiconductor device over a first substrate; coating an organic resin film that melts with solvent over the release layer; bonding a second substrate to the organic resin fi
What is claimed is: 1. A method for manufacturing a semiconductor apparatus comprising: forming a release layer including a semiconductor device over a first substrate; coating an organic resin film that melts with solvent over the release layer; bonding a second substrate to the organic resin film with a first two-sided tape to sandwich the release layer and the organic resin film between the first substrate and the second substrate; bonding a third substrate to the first substrate with a second two-sided tape; separating the first substrate to which the third substrate is bonded from the release layer by a physical means; bonding a fourth substrate to the release layer to sandwich the release layer between the second substrate and the fourth substrate; separating the release layer and the first two-sided tape from the second substrate; separating the release layer from the first two-sided tape; and removing the organic resin film with solvent. 2. A method according to claim 1, wherein the solvent is water or alcohol. 3. A method according to claim 1, wherein adhesiveness of the first two-sided tape and the second substrate in the seventh process is stronger than that of the release layer and the fourth substrate. 4. A method for manufacturing a semiconductor apparatus comprising: forming a release layer including a semiconductor device over a first substrate; coating an organic resin film that melts with solvent over the release layer; bonding a second substrate to the organic resin film with a first two-sided tape to sandwich the release layer and the organic resin film between the first substrate and the second substrate; bonding a third substrate to the first substrate with the second two-sided tape; separating the first substrate to which the third substrate is bonded from the release layer by a physical means; bonding a fourth substrate to the release layer to sandwich the release layer between the second substrate and the fourth substrate; separating the release layer and first two-sided tape from the second substrate; separating the release layer from the first two-sided tape; removing the organic resin film with solvent; and bonding a fifth substrate to the release layer with a second adhesive to sandwich the release layer between the fourth substrate and the fifth substrate. 5. A method according to claim 4, wherein the solvent is water or alcohol. 6. A method according to claim 4, wherein adhesiveness of the first two-sided tape and the second substrate in the seventh process is stronger than that of the release layer and the fourth substrate. 7. A method according to claim 4, wherein the first substrate is a glass substrate, the second and the third substrates are a quartz substrate or a metal substrate, and the fourth substrate and the fifth substrate are plastic substrates. 8. A method according to claim 4, wherein the first substrate is a glass substrate, the second and the third substrates are a quartz substrate or a metal substrate, and among the fourth and the fifth substrate, one is a plastic substrate being transparent to light and another is a plastic substrate having thermal conductivity. 9. A method according to claim 4, wherein the fourth or the fifth substrate is a plastic substrate on the surface of which a SiNx film, a SiNxOy film, an AlNx film, or an AlNxOy film is formed. 10. A method for manufacturing a semiconductor apparatus comprising: forming a release layer including a TFT over a first substrate; coating an organic resin film that melts with solvent over the release layer; bonding a second substrate to the organic resin film with a first two-sided tape to sandwich the release layer and the organic resin film between the first substrate and the second substrate; bonding a third substrate to the first substrate with the second two-sided tape; separating the first substrate to which the third substrate is bonded from the release layer by a physical means; bonding a fourth substrate to the release layer with a first adhesive to sandwich the release layer between the second substrate and the fourth substrate; separating the release layer and the first two-sided tape from the second substrate; separating the release layer from the first two-sided tape; removing the organic resin film with solvent; fabricating a light-emitting device including an organic compound over the release layer; and bonding a fifth substrate for sealing the light-emitting device to the release layer with a second adhesive to sandwich the release layer between the fourth substrate and the fifth substrate. 11. A method according to claim 10, wherein the solvent is water or alcohol. 12. A method according to claim 10, wherein adhesiveness of the first two-sided tape and the second substrate in the seventh process is stronger than that of the release layer and the fourth substrate. 13. A method according to claim 12, wherein the solvent is water or alcohol. 14. A method according to claim 10, wherein the first substrate is a glass substrate, the second and the third substrates are a quartz substrate or a metal substrate, and the fourth substrate and the fifth substrate are plastic substrates. 15. A method according to claim 14, wherein adhesiveness of the first two-sided tape and the second substrate in the seventh process is stronger than that of the release layer and the fourth substrate. 16. A method according to claim 10, wherein the first substrate is a glass substrate, the second and the third substrates are a quartz substrate or a metal substrate, and among the fourth and the fifth substrate, one is a plastic substrate being transparent to light and another is a plastic substrate having thermal conductivity. 17. A method according to claim 10, wherein the fourth or the fifth substrate is a plastic substrate on the surface of which a SiNx film, a SiNxOy film, an AlNx film, or an AlNxOy film is formed.
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