초록 ▼

A thermal energy management system is provided having a heat spreading device that is operatively engaged with at least one semiconductor chip and a thermal bus operatively engaged with the heat spreading device so as to transport thermal energy from the heat spreading device to a heat sink. The hea

A thermal energy management system is provided having a heat spreading device that is operatively engaged with at least one semiconductor chip and a thermal bus operatively engaged with the heat spreading device so as to transport thermal energy from the heat spreading device to a heat sink. The heat spreading device includes a heat pipe and the thermal bus includes a loop thermosyphon. A second thermal bus may be operatively engaged with the first-thermal bus so as to transport thermal energy from the first thermal bus to a heat sink. The second thermal bus may also include a loop thermosyphon. A method of managing thermal energy in an electronic system is also provided that includes spreading thermal energy generated by one or more devices over a surface that is relatively larger than the devices, thermally coupling an evaporator portion of a loop thermosyphon to the surface, and thermally coupling a condensing portion of the loop thermosyphon to a thermal energy sink, e.g., a second loop thermosyphon, convection fin, or cold plate.

대표청구항 ▼

The invention claimed is: 1. A thermal energy management system comprising: a planar heat pipe having a first outer surface that is operatively engaged with at least one heat generating component wherein said planar heat pipe is sized and shaped so as to spread thermal energy over an area larger th

The invention claimed is: 1. A thermal energy management system comprising: a planar heat pipe having a first outer surface that is operatively engaged with at least one heat generating component wherein said planar heat pipe is sized and shaped so as to spread thermal energy over an area larger than the area of said at least one heat generating component; and a thermal bus including an evaporator plate that is operatively engaged with a second outer surface of said planar heat pipe so as to transport thermal energy from said planar heat pipe to a heat sink, said thermal bus including a tubular evaporator portion of a loop-thermosyphon wherein at least one groove is formed in a top surface of said evaporator plate so as to receive and cradle said evaporator tube of said loop-thermosyphon. 2. A thermal energy management system according to claim 1 including a second thermal bus that is operatively engaged with said thermal bus so as to transport thermal energy from said first thermal bus to said heat sink. 3. A thermal energy management system according to claim 2 wherein said second thermal bus comprises a second loop thermosyphon. 4. A thermal energy management system according to claim 1 wherein said heat planar pipe comprises a vapor chamber that is defined between a top wall formed from a substantially uniform thickness sheet of a thermally conductive material and a bottom wall comprises a substantially uniform thickness sheet of a thermally conductive material. 5. A thermal energy management system according to claim 1 wherein said thermal bus comprises a tubular evaporator portion of at least two loop-thermosyphons wherein each tubular evaporator portion is thermally engaged with said planar heat pipe so as to bus thermal energy to a thermal energy sink. 6. A thermal energy management system according to claim 5 wherein said at least two loop thermosyphons each comprise a condensing portion positioned in spaced away relation to each of said tubular evaporator portions. 7. A thermal energy management system according to claim 1 wherein said thermal bus comprises a loop thermosyphon formed from a closed tube having a continuous internal passageway and wherein said tubular evaporator portion includes an integrally formed wicking layer disposed on the surface of said tube that defines said internal passageway adjacent to said evaporator portion and said planar heat pipe. 8. A thermal energy management system according to claim 7 wherein said wicking layer comprises sintered copper powder having an average thickness of about 0.5 mm to 2.0 mm. 9. A thermal energy management system according to claim 1 wherein a portion of said thermal bus is arranged in intimate thermal contact with a wall of a support chassis. 10. A thermal energy management system according to claim 9 wherein said thermal bus is maintained in position by a simple fastening system so that it may be disassembled from an underlying electronic system and components. 11. A thermal energy management system according to claim 9 further comprising a second thermal bus positioned adjacent to a condensing portion of said thermal bus. 12. A thermal energy management system comprising: a planar heat pipe heat spreader that is operatively engaged with at least one heat generating component; an evaporator plate positioned between a portion of said planar heat pipe heat spreader and an evaporation tube of a first loop thermosyphon so as to transport thermal energy from said planar heat pipe heat spreader to a heat sink wherein at least one groove is formed in a top surface of said evaporator plate so as to receive and cradle said evaporator tube of said loop-thermosyphon and further wherein said evaporator plate is formed from a substantially uniform thickness sheet of a thermally conductive material that is sized and shaped to cover a portion of said top surface; and a second evaporator plate positioned between a condensing portion of said first loop thermosyphon and an evaporator tube of a second loop thermosyphon. 13. A thermal energy management system according to claim 12 wherein said evaporator plate provides a physical and thermal interface between a top wall of said planar heat pipe heat spreader and said evaporator tube of said loop-thermosyphon.