초록 ▼

A method of making a resonant frequency tag having a predetermined frequency comprises forming a first conductive pattern comprising an inductive element and a first land having a first end connected to an inductive element end, and a second end spaced a predetermined distance from the first end; se

A method of making a resonant frequency tag having a predetermined frequency comprises forming a first conductive pattern comprising an inductive element and a first land having a first end connected to an inductive element end, and a second end spaced a predetermined distance from the first end; separately forming a second conductive pattern comprising a second land having a predetermined width and a link element; placing the second conductive pattern proximate the first conductive pattern at a first location wherein the second land overlies a portion of the first land with a dielectric therebetween establishing capacitive element plates having a first capacitance along with the inductive element forming a resonant circuit; measuring the resonant circuit frequency and comparing the measured and predetermined frequencies moving the second land along of the first land length to match the resonant frequency; and securing the second conductive pattern to the first conductive pattern.

대표청구항 ▼

We claim: 1. A method of making a series of N resonant frequency tags, N being an integer greater than 1, with each of the N tags having a resonant frequency which differs from the resonant frequency of every other tag in the series by at least a predetermined minimum frequency range, the method co

We claim: 1. A method of making a series of N resonant frequency tags, N being an integer greater than 1, with each of the N tags having a resonant frequency which differs from the resonant frequency of every other tag in the series by at least a predetermined minimum frequency range, the method comprising the steps of: (a) forming N first conductive patterns, the first conductive patterns all being substantially the same and each first conductive pattern comprising an inductive element and a first land with a first end of the first land being connected to one end of the inductive element and a second end of the first land being spaced from the first end by a predetermined distance; (b) separately forming N second conductive patterns, the second conductive patterns all being substantially the same and each second conductive pattern comprising a second land and a link element, the second land having a predetermined width; and (c) sequentially securing a second conductive pattern to each of the first conductive patterns at a location so that the second land of each second conductive pattern overlies a portion of the first land of the corresponding first conductive pattern with a dielectric therebetween to establish the plates of a capacitive element for each resonant frequency tag, the location of each second conductive pattern relative to the first land of a corresponding first conductive pattern and thus the amount by which each second overlies the first land being different for each resonant frequency tag of the series so that the capacitance of the capacitive element of each resonant frequency tag is different from the capacitance of the capacitive element of every other resonant frequency tag of the series by at least a minimum value to thereby cause each resonant frequency tag to resonate at a different frequency from every other resonant frequency tag of the series. 2. The method as recited in claim 1, wherein each first land has a width which decreases when moving along the length from one end to the other end. 3. The method as recited in claim 1, wherein each second conductive pattern is secured to the corresponding first conductive pattern by one of an adhesive and hot pressing. 4. The method as recited in claim 3, wherein each second conductive pattern is secured to the corresponding first conductive pattern by applying pressure, the amount of pressure being varied to control the resonant frequency of the tag. 5. The method as recited in claim 1, wherein the second conductive pattern, once formed, is initially held of a carrier sheet. 6. The method as recited in claim 1, wherein the second conductive pattern comprise said dielectric layer which is placed between the second land and the first land prior to securing the second conductive pattern to the substrate.