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Surface modified colloidal abrasives, including stable bimetallic surface coated silica sols for chemical mechanical planarization

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C09C-001/02
  • C09G-001/04
  • C09G-001/00
출원번호 US-0759666 (2004-01-16)
발명자 / 주소
  • Siddiqui,Junaid Ahmed
출원인 / 주소
  • DuPont Air Products Nanomaterials LLC
인용정보 피인용 횟수 : 21  인용 특허 : 53

초록

A composition and an associated method for chemical mechanical planarization (or other polishing) are described. The composition includes a surface-modified abrasive modified with at least one stabilizer and at least one catalyst differing from the at least one stabilizer. The composition can furthe

대표청구항

The invention claimed is: 1. A polishing composition for use in combination with an oxidizing agent for polishing a substrate, said composition comprising an abrasive particle having a surface on which at least one stabilizer comprising B, Al, or mixtures thereof and at least one catalyst are bonde

이 특허에 인용된 특허 (53)

  1. Grunwald, John, Abrasives for CMP applications.
  2. Brian L. Mueller ; Shumin Wang, CMP polishing pad including a solid catalyst.
  3. Wang Shumin ; Mueller Brian L., CMP slurry containing a solid catalyst.
  4. Hata William Y., Catalytic acceleration and electrical bias control of CMP processing.
  5. Hata William Y., Catalytic acceleration and electrical bias control of CMP processing.
  6. Steven K. Grumbine ; Christopher C. Streinz ; Brian L. Mueller, Catalytic reactive pad for metal CMP.
  7. Tastu Francis (Nieul/sur/Mer FRX) Mlard Pierre (Courbevoie FRX), Ceric oxide/cerous salt organic glass polishing compositions.
  8. Hiroyuki Yano JP; Gaku Minamihaba JP; Yukiteru Matsui JP; Nobuo Hayasaka JP; Katsuya Okumura JP; Akira Iio JP; Masayuki Hattori JP; Masayuki Motonari JP, Chemical mechanical method of polishing wafer surfaces.
  9. Picardi S. Charles ; Tanase Mitch Mircea, Chemical mechanical polishing composition.
  10. Small Robert J. ; McGhee Laurence ; Maloney David J. ; Peterson Maria L., Chemical mechanical polishing composition and process.
  11. Small Robert J. ; McGhee Laurence,GBX ; Maloney David J. ; Peterson Maria L., Chemical mechanical polishing composition and process.
  12. Neville Matthew (Champaign IL) Fluck David J. (Pesotum IL) Hung Cheng-Hung (Champaign IL) Lucarelli Michael A. (Mattoon IL) Scherber Debra L. (Orangevale CA), Chemical mechanical polishing slurry for metal layers.
  13. Lee Kevin J., Chemical-mechanical polishing slurry.
  14. Avanzino Steven C. ; Erb Darrell M. ; Schonauer Diana M. ; Yang Kai, Chemically removable Cu CMP slurry abrasive.
  15. Fang Mingming ; Mueller Brian L. ; Dirksen James A., Composition and method for planarizing surfaces.
  16. Streinz Christopher C. ; Neville Matthew ; Grumbine Steven K. ; Mueller Brian L., Composition and method for polishing rigid disks.
  17. Grumbine Steven K. ; Streinz Christopher C. ; Mueller Brian L., Composition and slurry useful for metal CMP.
  18. Grumbine Steven K. ; Streinz Christopher C. ; Mueller Brian L., Composition and slurry useful for metal CMP.
  19. Mueller Brian L. ; Streinz Christopher C. ; Grumbine Steven K., Composition and slurry useful for metal CMP.
  20. Robert J. Small ; Joo-Yun Lee, Composition for cleaning chemical mechanical planarization apparatus.
  21. Small Robert J. ; Cheng Jun ; Maw Taishih, Compositions for cleaning organic and plasma etched residues for semiconductors devices.
  22. Yoshikazu Nishii JP; Nobuhiro Maeda JP; Shin-ichi Ogawa JP; Yoichi Hachitani JP; Masayuki Higashida JP; Itaru Watanabe JP, Glass material for carrying a photocatalyst, filter device using the same and light irradiating method.
  23. Cheng Jun ; Small Robert J. ; Patel Bakul P., Lactam compositions for cleaning organic and plasma etched residues for semiconductor devices.
  24. Roberts John V. H. (Newark DE), Method and composition for polishing metal surfaces.
  25. Kodera Masako (Kawasaki NY JPX) Yano Hiroyuki (Wappingers Falls NY) Shigeta Atsushi (Yamato JPX) Aoki Riichirou (Tokyo JPX) Yajima Hiromi (Yokohama JPX) Okano Haruo (Tokyo JPX), Method for planarizing a semiconductor device having a amorphous layer.
  26. Shumin Wang ; Brian L. Mueller, Method for polishing a substrate using a CMP slurry.
  27. Li Lixiong ; Gloyna Earnest F., Method for selective separation of products at hydrothermal conditions.
  28. Farkas Janos ; Freeman Melissa, Method for using ammonium salt slurries for chemical mechanical polishing (CMP).
  29. Tokushima Kazuo,JPX ; Ito Akiko,JPX, Method of and an apparatus for producing a mineral water.
  30. Yu Chris C. (Boise ID) Doan Trung T. (Boise ID), Method of chemical mechanical polishing predominantly copper containing metal layers in semiconductor processing.
  31. Nenadic Anton (Red Hook NY) Pasco Robert W. (Wappingers Falls NY), Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor.
  32. Sun, Lizhong; Tsai, Stan; Li, Shijian; White, John, Method of initiating cooper CMP process.
  33. Bruxvoort Wesley J. ; Culler Scott R. ; Ho Kwok-Lun ; Kaisaki David A. ; Kessel Carl R. ; Klun Thomas P. ; Kranz Heather K. ; Messner Robert P. ; Webb Richard J. ; Williams Julia P., Method of modifying an exposed surface of a semiconductor wafer.
  34. Obeng Yaw Samuel, Method of polishing.
  35. Mingming Fang, Method of polishing a memory or rigid disk with an ammonia-and/or halide-containing composition.
  36. Kaufman Vlasta Brusic ; Wang Shumin, Multi-oxidizer slurry for chemical mechanical polishing.
  37. Hayashi Junji,JPX ; Yamagishi Hisashi,JPX ; Shimizu Yasumasa,JPX, Multi-piece solid golf ball.
  38. Towery Daniel L. ; Hendricks Neil H. ; Schilling Paul E. ; Chen Tian-An, Oxidizing polishing slurries for low dielectric constant materials.
  39. Izumi Hirohiko,JPX ; Sakai Masatoshi,JPX ; Yoshinaga Michihiro,JPX, Polishing abrasive grains, polishing agent and polishing method.
  40. Kodama Hitoshi,JPX ; Otake Hideki,JPX ; Ohashi Keigo,JPX, Polishing composition.
  41. Shemo David M. ; Rader W. S. ; Owaki Toshiki, Polishing composition and method for producing a memory hard disk.
  42. Kondo Seiichi,JPX ; Homma Yoshio,JPX ; Sakuma Noriyuki,JPX ; Takeda Kenichi,JPX ; Hinode Kenji,JPX, Polishing method.
  43. Liu Lei ; Kwok Doris, Polishing slurry.
  44. Cook Gregory A. (Baton Rouge LA) Engelmann Theodore R. (Baton Rouge LA), Polyolefin catalysts and method of preparing an olefin polymer.
  45. Small Robert J., Post clean treatment.
  46. Payne Charles C. (Aurora IL), Preparation of a ferric acetate coated silica sol by selective anion exchange.
  47. Smith Thomas W. (Penfield NY), Preparation of colloidal iron dispersions by the polymer-catalyzed decomposition of iron carbonyl and iron organocarbony.
  48. Mangold Helmut,DEX ; Kerner Dieter ; Kleinschmit Peter,DEX, Pyrogenic silica, process for the production thereof and use.
  49. Cadien Kenneth C. (Portland OR) Feller Daniel A. (Portland OR), Slurries for chemical mechanical polishing.
  50. Yu Chris C. (Boise ID) Doan Trung T. (Boise ID), Slurries for chemical mechanically polishing copper containing metal layers.
  51. Small Robert James ; Peterson Maria Louise ; Troung Tuan ; Bonneau Lionel,FRX ; Drouget Jean Claude,FRX, Slurry composition and method of chemical mechanical polishing using same.
  52. Sun Li Zhong ; Smith Stanley M. ; Fouyer Curtis W., Slurry comprising a ligand or chelating agent for polishing a surface.
  53. Shadman Farhang F. (Tucson AZ) Governal Robert A. (Tucson AZ), Ultrapure water treatment system.

이 특허를 인용한 특허 (21)

  1. Bateman, Stuart Arthur; Cardonna, Francisco; Simons, Ranya; Wu, Dong Yang; Berry, Douglas H.; Kirchner, James F.; Kobak, Seana B.; Seebergh, Jill E., Activation method.
  2. Bateman, Stuart Arthur; Simons, Ranya; Wu, Dong Yang; McMahon, Patrick James; Bilyk, Alexander; Berry, Douglas H.; Kobak, Seana B.; Kirchner, James F.; Straus, Lori Clarice; Johnson, Mark Paul, Activation method using modifying agent.
  3. Grumbine, Steven; Dysard, Jeffrey; Shen, Ernest; Cavanaugh, Mary, Colloidal silica chemical-mechanical polishing composition.
  4. Grumbine, Steven; Dysard, Jeffrey; Shen, Ernest; Cavanaugh, Mary, Colloidal silica chemical-mechanical polishing composition.
  5. Grumbine, Steven; Dysard, Jeffrey; Shen, Ernest; Cavanaugh, Mary, Colloidal silica chemical-mechanical polishing concentrate.
  6. Grumbine, Steven; Dysard, Jeffrey; Fu, Lin; Ward, William; Whitener, Glenn, Composition for tungsten CMP.
  7. Grumbine, Steven; Dysard, Jeffrey; Fu, Lin; Ward, William; Whitener, Glenn, Composition for tungsten CMP.
  8. Grumbine, Steven; Dysard, Jeffrey; Fu, Lin; Ward, William; Whitener, Glenn, Composition for tungsten CMP.
  9. Fu, Lin; Dysard, Jeffrey; Grumbine, Steven, Composition for tungsten buffing.
  10. Fu, Lin; Grumbine, Steven; Dysard, Jeffrey; Weng, Wei; Liu, Lei; Leonov, Alexei, Copper barrier chemical-mechanical polishing composition.
  11. Scott,Brandon Shane; Small,Robert J., Free radical-forming activator attached to solid and used to enhance CMP formulations.
  12. Siddiqui, Junaid Ahmed; Small, Robert J.; Castillo, Daniel Hernandez, Free radical-forming activator attached to solid and used to enhance CMP formulations.
  13. Siddiqui, Junaid Ahmed; Compton, Timothy Frederick; Richards, Robin Edward, Method for immobilizing ligands and organometallic compounds on silica surface, and their application in chemical mechanical planarization.
  14. Grumbine, Steven; Dysard, Jeffrey; Shen, Ernest; Cavanaugh, Mary; Clingerman, Daniel, Methods for fabricating a chemical-mechanical polishing composition.
  15. Grumbine, Steven; Dysard, Jeffrey, Mixed abrasive tungsten CMP composition.
  16. Ward, William; Whitener, Glenn; Grumbine, Steven; Dysard, Jeffrey, Mixed abrasive tungsten CMP composition.
  17. Siddiqui, Junaid Ahmed; Raiford, Kimberly Gheysen, Peroxide decomposition catalyst particles.
  18. Raiford, Kimberly Gheysen; Siddiqui, Junaid Ahmed, Stable proton exchange membranes and membrane electrode assemblies.
  19. Raiford, Kimberly Gheysen; Siddiqui, Junaid Ahmed, Stable proton exchange membranes and membrane electrode assemblies.
  20. Siddiqui,Junaid Ahmed, Surface modified colloidal abrasives, including stable bimetallic surface coated silica sols for chemical mechanical planarization.
  21. Fu, Lin; Grumbine, Steven; Dysard, Jeffrey; Li, Tina, Tungsten chemical-mechanical polishing composition.
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