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An assembly for a computer system is mountable on a circuit board of a computer system. The assembly includes a base portion for engaging with an electronic component mounted on the circuit board. The assembly also includes a spring formed of memory metal. The spring is operable to urge the base por

An assembly for a computer system is mountable on a circuit board of a computer system. The assembly includes a base portion for engaging with an electronic component mounted on the circuit board. The assembly also includes a spring formed of memory metal. The spring is operable to urge the base portion against the electronic component to urge the electronic component towards the circuit board. The spring is configured to provide a greater spring force for urging the base portion against the electronic component when the spring is above a predetermined temperature than when it is below said predetermined temperature.

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What is claimed: 1. An assembly for a computer system, the assembly being mountable on a circuit board of the computer system and comprising: a base portion for engaging with an electronic component mounted on the circuit board; a spring formed of memory metal, the spring being operable to urge the

What is claimed: 1. An assembly for a computer system, the assembly being mountable on a circuit board of the computer system and comprising: a base portion for engaging with an electronic component mounted on the circuit board; a spring formed of memory metal, the spring being operable to urge the base portion against the electronic component to urge the electronic component towards the circuit board, wherein the spring is configured to provide a greater spring force for urging the base portion against the electronic component when the spring is above a predetermined temperature than when it is below said predetermined temperatures, a strut mountable to the circuit board, the strut comprising an electrically conductive portion extending over at least part of the length of the strut; one end of the spring being coupled to strut, the spring being disposed around the strut; and a circuit configured to pass a current through the electrically conductive portion of the strut for heating the spring above the predetermined temperature. 2. The assembly of claim 1, comprising one or more formations for emitting heat. 3. The assembly of claim 2, wherein the formations for emitting heat are integrally formed with the base portion. 4. The assembly of claim 1, comprising a plurality of struts and a plurality of said springs, wherein each of the plurality of said springs is disposed around one of the struts. 5. The assembly of claim 1, wherein the spring is a coil spring. 6. The assembly of claim 1, wherein the predetermined temperature is lower than an operating temperature of the computer system. 7. The assembly of claim 1, wherein the predetermined temperature is chosen to be a temperature in the range 0-25 degrees Centigrade. 8. The assembly of claim 1, further comprising a heating element within the strut for heating the spring above the predetermined temperature, wherein the heating element is electrically coupled to the electrically conductive portion of the strut. 9. The assembly of claim 1, wherein the electrically conductive portion of the strut is electrically coupled to the spring, wherein the circuit is configured to pass a current through the spring, wherein the spring is configured to produce Joule heating when the current is passed through the spring to heat the spring above the predetermined temperature. 10. The assembly of claim 1, wherein the memory metal is a nickel titanium alloy. 11. The assembly of claim 1, wherein at least part of the base portion is electrically conductive, wherein the spring is electrically coupled between the base portion and a top portion of the strut, wherein the circuit is configured to pass a current through the strut, the spring, and the base portion, wherein the spring is configured to produce Joule heating when the current is passed through the spring to heat the spring above the predetermined temperature. 12. The assembly of claim 11, wherein the spring is a coil spring disposed around the strut, wherein an outer surface of the strut comprises an electrically isolating material to insulate a portion of the spring from contact with the electrically conductive portion of the strut. 13. The assembly of claim 11, wherein the base portion comprises: an aperture through which the strut passes; and an insulating region within the aperture to electrically isolate the base portion from contact with the electrically conductive portion of the strut. 14. The assembly of claim 1, wherein the assembly comprises a plurality of struts and a plurality of springs, wherein the circuit is configured to apply a different voltage to at least two of the struts. 15. A circuit board having an electronic component mounted thereon and an assembly comprising: a base portion for engaging with the electronic component; and a spring formed of memory metal, the spring being operable to urge the base portion against the electronic component to urge the electronic component towards the circuit board, wherein the spring is configured to provide a greater spring force for urging the base portion against the electronic component when the spring is above a predetermined temperature than when it below said predetermined temperature; a strut mounted to the circuit board comprising an electrically conductive portion extending over at least part of the length of the strut; one end of the spring being coupled to strut, the spring being disposed around the strut; and a circuit configured to pass a current through the electrically conductive portion of the strut for heating the spring above the predetermined temperature. 16. The circuit board of claim 15, wherein the assembly comprises one or more formations for emitting heat. 17. The circuit board of claim 16, wherein the formations for emitting heat are integrally formed with the base portion. 18. The circuit board of claim 15, wherein the assembly comprises a plurality of struts and a plurality of said springs, wherein each of the plurality of said springs is disposed around one of the struts. 19. The circuit board of claim 15, wherein the spring is a coil spring. 20. The circuit board of claim 15, wherein the predetermined temperature is selected to be lower than an operating temperature of a computer system. 21. The circuit board of claim 15, wherein the predetermined temperature is chosen to be a temperature in the range 0-25 degrees Centigrade. 22. The circuit board of claim 15, wherein the assembly further comprises a heating element within the strut for heating the spring above the predetermined temperature, wherein the heating element is electrically coupled to the electrically conductive portion of the strut. 23. The circuit board of claim 15, wherein the electrically conductive portion of the strut is electrically coupled to the spring, wherein the circuit is configured to pass current through the spring, wherein the spring is configured to produce Joule heating when the current is passed through the spring to heat the spring above the predetermined temperature. 24. The circuit board of claim 15, wherein the memory metal is a nickel titanium alloy. 25. A computer system comprising a circuit board having an electronic component mounted thereon and an assembly comprising: a base portion for engaging with the electronic component; and a spring formed of memory metal, the spring being operable to urge the base portion against the electronic component to urge the electronic component towards the circuit board, wherein the spring is configured to provide a greater spring force for urging the base portion against the electronic component when the spring is above a predetermined temperature than when it below said predetermined temperature; a strut mounted to the circuit board comprising an electrically conductive portion extending over at least part of the length of the strut; one end of the spring being coupled to strut, the spring being disposed around the strut; and a circuit configured to pass a current through the electrically conductive portion of the strut for heating the spring above the predetermined temperature. 26. The computer system of claim 25, wherein the predetermined temperature is lower than an operating temperature of the computer system. 27. The computer system of claim 25, wherein the assembly comprises a heating element within the strut for heating the spring above the predetermined temperature, wherein the heating element is electrically coupled to the electrically conductive portion of the strut. 28. The computer system of claim 25, wherein the electrically conductive portion of the strut is electrically coupled to the spring, wherein the circuit is configured to pass a current through the spring, wherein the spring is configured to produce Joule heating when the current is passed through the spring to heat the spring above the predetermined temperature. 29. A method comprising: providing an assembly comprising: a base portion for engaging with an electronic component mounted on a circuit board of a computer system; and a spring formed of memory metal, the spring being operable to urge the base portion against the electronic component to urge the electronic component towards the circuit board, wherein the spring is configured to provide a greater spring force for urging the base portion against the electronic component when the spring is above a predetermined temperature than when it below said predetermined temperature; and a strut mountable to the circuit board, the strut comprising an electrically conductive portion extending over at least part of the length of the strut; one end of the spring being coupled to strut, the spring being disposed around the strut; mounting the assembly on the circuit board; and passing a current through the electrically conductive portion of the strut to heat the spring above the predetermined temperature. 30. The method of claim 29, comprising cooling the spring to a temperature below the predetermined temperature prior to mounting the assembly on the circuit board. 31. The method of claim 30, comprising using an aerosol spray to cool the spring below the predetermined temperature. 32. The method of claim 29, comprising using a heating element within the strut to heat the spring to a temperature above the predetermined temperature. 33. The method of claim 29, wherein the spring is configured to produce Joule heating when the current is passed through the spring to heat the spring, the method further comprising passing a current through the spring to heat the spring to a temperature above the predetermined temperature. 34. The method of claim 29, wherein passing a current through the electrically conductive portion of the strut comprises applying a voltage across the strut. 35. The method of claim 29, wherein the assembly comprises a plurality of struts and a plurality of springs, wherein the method further comprises applying a different voltage to at least two of the struts.