Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
G06F-019/00
G05B-013/02
출원번호
US-0172977
(2002-06-18)
발명자
/ 주소
Shanmugasundram,Arulkumar P.
Armer,Helen
Schwarm,Alexander T.
출원인 / 주소
Applied Materials, Inc.
대리인 / 주소
Wilmer Culter Pickering Hale &
인용정보
피인용 횟수 :
35인용 특허 :
302
초록▼
The invention relates to a method, system and computer program useful for producing a product, such as a microelectronic device, for example in an assembly line, where the production facility includes parallel production of assembly lines of products on identically configured chambers, tools and/or
The invention relates to a method, system and computer program useful for producing a product, such as a microelectronic device, for example in an assembly line, where the production facility includes parallel production of assembly lines of products on identically configured chambers, tools and/or modules. Control is provided between such chambers. Behaviors of a batch of wafers (or of each wafer) are collected as the first batch (or each wafer) is processed by one of the identically configured chambers in one assembly line to produce the microelectronic device. The information relating to the behavior is shared with a controller of another one (or more) of the identically configured chambers, process tools and/or modules, to provide an adjustment of the process tool and thereby to produce a second batch (or next wafer) which is substantially identical, within tolerance, to the first batch (or wafer).
대표청구항▼
What is claimed is: 1. A computer-implemented method comprising: (A) collecting data representative of one or more behaviors of at least one of one or more semi-conductor processing entities, said one or more behaviors being collected in the course of the one or more semi-conductor processing entit
What is claimed is: 1. A computer-implemented method comprising: (A) collecting data representative of one or more behaviors of at least one of one or more semi-conductor processing entities, said one or more behaviors being collected in the course of the one or more semi-conductor processing entities converging to, or attempting to maintain proximity with, a target setting; and (B) sharing information, relating to the data representative of the one or more behaviors, between at least one of the one or more semi-conductor processing entities and at least one comparably configured semi-conductor processing entity, wherein the sharing of the information facilitates the at least one comparably configured semi-conductor processing entity receiving the information to adjust a recipe that enables the at least one comparably configured semi-conductor processing entity to converge to, or attempt to maintain proximity with, the target setting. 2. The method of claim 1, wherein the sharing of the information is performed on a wafer-to-wafer basis. 3. The method of claim 1, wherein the sharing of the information is performed on a run-to-run basis. 4. The method of claim 1, wherein the sharing of the information is performed on the same processing entity, at a time substantially later than a time at which the data was collected. 5. The method of claim 1, wherein the sharing of the information is performed on a different processing entity, at a substantially later time, or a substantially same time at which the data is collected. 6. The method of claim 1, wherein the step of collecting data includes measuring at least one device processed by one or more of the semi-conductor processing entities, and wherein the step of sharing includes adjusting a process parameter for the at least one comparably configured semi-conductor processing entity subsequent to measuring of the at least one device and prior to processing of a next device. 7. The method of claim 1, wherein the step of collecting data includes measuring at least one device in a batch of devices processed by one or more of the semi-conductor processing entities, and wherein the step of sharing includes adjusting a process parameter for the at least one comparably configured semi-conductor processing entity subsequent to measuring of the batch and prior to processing of a next batch. 8. The method of claim 1, wherein the at least one comparably configured semi-conductor processing entity resides on a same tool as said one or more semi-conductor processing entities. 9. The method according to claim 8, wherein the at least one comparably configured semi-conducting processing entity comprises a chamber. 10. The method according to claim 9, wherein the chamber comprises two or more processing stations. 11. The method of claim 1, wherein the at least one comparably configured semi-conductor processing entity and said one or more semi-conductor processing entities reside on separate tools. 12. The method according to claim 11, wherein the at Least one comparably configured semi-conductor processing entity comprises a chamber. 13. The method according to claim 12, wherein the chamber comprises two or more processing stations. 14. The method of claim 1, wherein at least one of the one or more semi-conductor processing entities includes an integrated metrology tool. 15. The method of claim 1, further comprising the step of providing a separate metrology tool for at least one of the one or more semi-conductor processing entities. 16. The method of claim 1, further comprising the step of controlling at least one of the one or more semi-conductor processing entities from a controller. 17. The method of claim 1, wherein the at least one comparably configured semi-conductor entity comprises a module. 18. The method of claim 17, wherein the module comprises a chamber. 19. The method of claim 18, wherein the chamber comprises a processing station. 20. The method according to claim 1, wherein the at least one comparably configured semi-conductor processing entity is configured the same as said one or more semi-conductor processing entities. 21. A computer program product residing on a computer readable medium the computer program product comprising instructions for enabling a computer to: (A) collect data representative of one or more behaviors of at least one of one or more semi-conductor processing entities, said one or more behaviors being collected in the course of the one or more semi-conductor processing entities converging to, or attempting to maintain proximity with a target setting; and (B) share information, relating to the data representative of the one or more behaviors, between at least one of the one or more semi-conductor processing entities and at least one comparably configured semi-conductor processing entity, wherein the information facilitates the at least one comparably configured semi-conductor processing entity receiving the information to adjust a recipe that enables the at least one comparably configured semi-conductor processing entity to converge to, or attempt to maintain proximity with the target setting. 22. The computer program product of claim 21, wherein the instructions for sharing of the information are performed on a wafer-to-wafer basis. 23. The computer program product of claim 21, wherein the instructions for sharing information are performed on a run-to-run basis. 24. The computer program product of claim 21, wherein the instructions for sharing information are performed on a same tool, at a time substantially later than a time at which the data was collected. 25. The computer program product of claim 21, wherein the information is provided from a first tool, to a second tool at a substantially later time, or a substantially same time at which the data is collected. 26. The computer program product of claim 21, wherein the instructions for collecting data include instructions for measuring at least one device processed by at least one of the one or more semi-conductor processing entities, and wherein the instructions for sharing include instructions for adjusting a process parameter for the at least one comparably configured semi-conductor processing entity subsequent to measuring of the at least one device and prior to processing of a next device. 27. The computer program product of claim 21, wherein the instructions for collecting data include instructions for measuring at least one device in a batch of devices processed by at least one of the one or more semi-conductor processing entities, and wherein the instructions for sharing include instructions for adjusting a process parameter for the at least one comparably configured semi-conductor processing entity subsequent to measuring of the batch and prior to processing of a next batch. 28. The computer program product of claim 21, wherein the at least one comparably configured semi-conductor processing entity comprises a first chamber and a second chamber. 29. The computer program of claim 21, wherein the at least one comparably configured semi-conductor processing entity is on a tool separate from the one or more semi-conductor processing entities. 30. The computer program product of claim 21, wherein at least one of the one or more semi-conductor processing entities includes an integrated metrology tool. 31. The computer program product of claim 21, further comprising instructions for providing a separate metrology tool for at least one of the one or more semi-conductor processing entities. 32. The computer program product of claim 21, further comprising instructions for controlling at least one of the one or more semi-conductor processing entities from a controller. 33. A computer-implemented method of converging, to a target setting, processing results of two or more comparably configured semi-conductor processing entities, comprising: obtaining, for one of the comparably configured semi-conductor processing entities, a recipe to be utilized in conjunction with processing a product; measuring at least one product characteristic subsequent to processing; adjusting at least one recipe parameter based upon said measuring step; providing the at least one recipe parameter to at least one other comparably configured semi-conductor conductor processing entity; and utilizing the at least one recipe parameter to adjust a recipe of at least one other comparably configured semi-conductor processing entity and converge the processing results of the one comparably configured semi-conductor processing entity with the at least one other comparably configured semi-conductor processing entity. 34. The computer-implemented method according to claim 33, wherein the two or more comparably configured processing entities comprise tool chambers. 35. The computer implemented method according to claim 34, wherein a first tool chamber is on a first tool and a second tool chamber is on a second tool. 36. The computer implemented method according to claim 35, wherein the first tool chamber comprises a first and a second processing station and the second tool chamber comprises a third and a fourth processing station. 37. The computer implemented method according to claim 34, wherein a first tool chamber and a second tool chamber are on a same tool. 38. The computer implemented method according to claim 37, wherein the first tool chamber comprises a first and a second processing station and the second tool chamber comprises a third and a fourth processing station. 39. A computer-implemented system of converging, to a target setting, processing results generated by comparatively configured process tools operating in parallel in a semiconductor processing environment, said system comprising: a module controller containing module level models for setting at least one process tool results target; each of said comparatively configured process tools configured in parallel and communicating with said module controller, each of said comparatively configured process tools comprising an automatic process control module that receives as input from said module controller a module level model, wherein at least one of said respective automatic process control modules adjust at least one recipe processing parameter based on shared information from another automatic process control module to enable at least one of said comparatively configured process tools to converge to or maintain a respective process tool results target. 40. The system of claim 39, wherein said at least two process tools comprise embedded computer intelligence. 41. The system of claim 39, wherein said module controller comprises a graphical user interface. 42. The system of claim 39, wherein said automatic process control module comprises at least one of hardware and software. 43. The system of claim 39, wherein each of said at least two process tools further comprises a tool controller for processing a recipe to achieve said at least one process tool results target.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (302)
Trombetta Liberatore A. (Hamilton CAX) Patel Dhanraj S. (Mississauga CAX) Darby Dennis A. (Hamilton CAX) Huhtanen Jayne S. (Toronto CAX), Absorbent article having a rewet barrier.
Kline Paul J. (Richardson TX) Kilgore Michael A. (McKinney TX) Martin Cynthia C. (Charlotte NC), Apparatus and method for controlling and scheduling processing machines.
Sullivan Michael F. (Dallas TX) Hirsch Judith S. (Plano TX) Butler Stephanie W. (Plano TX) Tovell Nicholas J. (Plano TX) Stefani Jerry A. (Richardson TX) Mozumder Purnendu K. (Dallas TX) Wild Ulrich , Apparatus and method for model based process control.
Sullivan Michael Francis ; Hirsch Judith Susan ; Butler Stephanie Watts ; Tovell Nicholas John ; Stefani Jerry Alan ; Mozumder Purnendu K. ; Wild Ulrich H. ; Wang Chun-Jen Jason ; Hartzell Robert A., Apparatus and method for model based process control.
Phan Khoi A. ; Bains Gurjeet S. ; Steele David A. ; Orth Jonathan A. ; Subramanian Ramkumar, Apparatus and method for reducing defects in a semiconductor lithographic process.
Parker Norman W. (Fairfield CA) Tolles Robert D. (Santa Clara CA) Lee Harry Q. (Mountain View CA), Apparatus and method for simulating and optimizing a chemical mechanical polishing system.
Mashruwala Rajesh U. (Palo Alto CA) Hess Richard L. (Palo Alto CA) Verplank William L. (Menlo Park CA), Apparatus and method for viewing relationships in a factory management system.
Kittler Richard Charles ; Ling Zhi-Min ; Pak James Minsu ; Lin Yung-Tao ; Shiau Ying, Arrangement and method for detecting sequential processing effects in manufacturing.
Lin Yung-Tao ; Ling Zhi-Min ; Pak James ; Shiau Ying, Arrangement and method for detecting sequential processing effects in manufacturing using predetermined sequences withi.
Tobin ; Jr. Kenneth W. ; Gleason Shaun S. ; Karnowski Thomas P. ; Sari-Sarraf Hamed, Automated defect spatial signature analysis for semiconductor manufacturing process.
Yu Chris C. (Boise ID) Sandhu Gurtej S. (Boise ID), Chemical mechanical planarization (CMP) of a semiconductor wafer using acoustical waves for in-situ end point detection.
Richard J. Lebel ; Rock Nadeau ; Martin P. O'Boyle ; Paul H. Smith, Jr. ; Theodore G. van Kessel ; Hemantha K. Wickramasinghe, Chemical mechanical polishing in-situ end point system.
Bach Mark A. ; Charlet Kyle Jeffrey ; Ho Shyh-Mei Fang ; McBride Kevin M. ; Rowe-Anderson Huey Moncrief ; Sander Thomas Beavers ; Vogel Thomas Arthur, Command line interface for creating business objects for accessing a hierarchical database.
Hirsch Judith S. (Plano TX) Wild Ulrich H. (Dallas TX), Computer-aided manufacturing support method and system for specifying relationships and dependencies between process typ.
Drummond Shattuck Reed ; Peter Earnshaw Heymann ; Steven Mark Mushero ; Kevin Benard Jones ; Jeffrey Todd Oberlander ; Dan Banay, Computer-based communication system and method using metadata defining a control-structure.
Baker Michael K. (Los Gatos CA) Lane Leslie A. (Sunnyvale CA) Perloff David S. (Sunnyvale CA) Freedland Alexander (Campbell CA), Data analysis system and method for industrial process control systems.
Toprac Anthony John ; Wiseman Joseph William ; Yue Hongyu, Determining endpoint in etching processes using principal components analysis of optical emission spectra with thresholding.
Hofmann Jim, Devices and methods for in-situ control of mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies.
Zhao Bin ; Vasudev Prahalad K. ; Horwath Ronald S. ; Seidel Thomas E. ; Zeitzoff Peter M., Dual damascene interconnect structure using low dielectric constant material for an inter-level dielectric layer.
Tai Wei-Heng (Hsin-Chu TWX) Hsu Yi-Chin (Taipei TWX), Dynamic dispatching rule that uses long term due date and short term queue time to improve delivery performance.
Morshedi Abdol M. (Houston TX) Cutler Charles R. (Houston TX) Fitzpatrick Thomas J. (Katy TX) Skrovanek Thomas A. (Houston TX), Dynamic process control.
Gerasimov Viktor G. (ulitsa Energeticheskaya ; 8 ; korpus 1 ; kv. 144 Moscow SUX) Kljuev Vladimir V. (ulitsa Volgina ; 13 ; kv. 69 Moscow SUX) Kuznetsov Viktor B. (Novogireevskaya ulitsa ; 14 ; korpu, Eddy current device for automatically testing the quality of elongated electrically conductive objects by non-destructiv.
Penzes William B. ; Allen Richard A. ; Cresswell Michael W. ; Linholm Loren W. ; Teague E. Clayton, Electrical test structure and method for measuring the relative locations of conductive features on an insulating substr.
Fehskens Leonard G. ; Sylor Mark W. ; Chapman Kenneth W. ; Schuchard Robert C. ; Goldfarb Stanley I. ; O'Brien Linsey B. ; Rosenbaum Richard L. ; Kohls Ruth E. J. ; Namoglu Sheryl F. ; Seger Mark J., Entity management system.
Krivokapic, Zoran; Heavlin, William D., Feed-forward control of TCI doping for improving mass-production-wise, statistical distribution of critical performance parameters in semiconductor devices.
Conrad, Edward W.; Smyth, John S.; Whiting, Charles A.; Ziemer, David A., Feedback method utilizing lithographic exposure field dimensions to predict process tool overlay settings.
Habib Dennis M. ; Engelberg Mindy J. ; McNutt Kathryn A. ; Kinser Colby E. ; Lynch ; II Charles E. ; Williams Chauncey L., Help system with semitransparent window for disabling controls.
Li Leping ; Barbee Steven George ; Halperin Arnold ; Heinz Tony Frederick, In-situ monitoring and control of conductive films by detecting changes in induced eddy currents.
Blaauw David T. (Austin TX) Maziasz Robert L. (Austin TX) Norton Joseph W. (Austin TX) Jones Larry G. (Austin TX) Guruswamy Mohankumar (Austin TX), Integrated circuit design and manufacturing method and an apparatus for designing an integrated circuit in accordance wi.
Lee Mark S. (Windsor Locks CT) McQuaid Cameron M. (Middlefield MA) Urban Stephen R. (West Hartford CT) Seccombe ; Jr. Donald A. (Cheshire CT) Leo ; Jr. Robert T. (Manchester CT) Coon Edward H. (Winfi, Integrated manufacturing system.
Lopatin, Sergey; Wang, Fei; Schonauer, Diana; Avanzino, Steven C., Interconnect structure formed in porous dielectric material with minimized degradation and electromigration.
Sharpe ; Jr. Richard R. ; Bruck Robert ; Wagenknecht Richard ; Westbrock Jon D. ; Tielens Craig R. ; Kieley James W., Interface controls for use in a field device management system.
Lale Peter G. (Harpenden GBX) Hocking Donald H. (St. Albans GBX), Lift off compensation of eddy current crack detection system by controlling damping resistance of oscillator.
Scheid Glen W. ; Riley Terrence J. ; Wang Qingsu ; Miller Michael ; Qin Si-Zhao J., Lot-to-lot rapid thermal processing (RTP) chamber preheat optimization.
Cho, Dae-Sik; Chae, Hee-Sun; Kim, Seok-Hyun; Tong, Seung-Hoon; Yoon, Tae-Yang; Kwak, Doh-Soon; Kang, Hee-Se; Park, Yll-Seug; Oh, Jae-Seok, Lots dispatching method for variably arranging processing equipment and/or processing conditions in a succeeding process according to the results of a preceding process and apparatus for the same.
LaLonde John D. ; MacDonnell Craig A. ; Cucuzella David, Manufacturing method for assembling products by generating and scheduling dynamically assembly instructions.
Fischer Frederic P. (Williamsville NY) Lee Patrick S. K. (Poughkeepsie NY) Logue Raymond C. (Somers NY) Parks Thomas W. (Ithaca NY), Measurement of fiber diameters with high precision.
Anthony J. Toprac ; Derick J. Wristers ; Jon D. Cheek, Method and apparatus for characterizing semiconductor device performance variations based on independent critical dimension measurements.
Bonser Douglas ; Toprac Anthony J. ; Purdy Matthew ; Behnke John R. ; Hussey ; Jr. James H., Method and apparatus for control of critical dimension using feedback etch control.
Campbell W. Jarrett ; Lansford Jeremy ; Raeder Christopher H., Method and apparatus for controlling within-wafer uniformity in chemical mechanical polishing.
Wiswesser Andreas Norbert,DEX ; Pan Judon Tony ; Swedek Boguslaw, Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers.
Wiswesser, Andreas Norbert; Pan, Judon Tony; Swedek, Boguslaw, Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers.
Coss, Jr., Elfido; Wang, Qingsu; Riley, Terrence J., Method and apparatus for fault detection of a processing tool and control thereof using an advanced process control (APC) framework.
Sonderman, Thomas; Coss, Jr., Elfido; Wang, Qingsu, Method and apparatus for fault detection of a processing tool in an advanced process control (APC) framework.
Wright, Marilyn I.; Lensing, Kevin R.; Stirton, James Broc, Method and apparatus for identifying misregistration in a complimentary phase shift mask process.
Elfido Coss, Jr. ; Thomas Sonderman ; Robert W. Anderson, Method and apparatus for implementing corrected species by monitoring specific state parameters.
Pecen Jiri ; Fielden John ; Chadda Saket ; LaComb ; Jr. Lloyd J. ; Jairath Rahul ; Krusell Wilbur C., Method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishing.
Lee Shih-Jong J. ; Kuan Chih-Chau L., Method and apparatus for incremental concurrent learning in automatic semiconductor wafer and liquid crystal display defect classification.
Maruyama Shigenobu,JPX ; Hongo Mikio,JPX ; Todoroki Satoru,JPX ; Okunaka Masaaki,JPX ; Matsuzaki Hideo,JPX ; Ninomiya Takanori,JPX ; Yoshimura Kazushi,JPX ; Ito Fumikazu,JPX, Method and apparatus for inspection and correction of wiring of electronic circuit and for manufacture thereof.
Miller, Michael Lee; Wang, Qingsu; Coss, Jr., Elfido, Method and apparatus for integration of real-time tool data and in-line metrology for fault detection in an advanced process control (APC) framework.
Maung Sonny (Plano TX) Butler Stephanie W. (Plano TX) Henck Steven A. (Plano TX), Method and apparatus for process endpoint prediction based on actual thickness measurements.
Venkatesh Srilakshmi ; Jevtic Dusan, Method and apparatus for scheduling wafer processing within a multiple chamber semiconductor wafer processing tool having a multiple blade robot.
Hurwitt Steven D. (Park Ridge NJ) Wagner Israel (Monsey NY) Hieronymi Robert (Rock Cavern NY) Van Nutt Charles (Monroe NY), Method and apparatus for sputter coating stepped wafers.
Miller, Michael Lee; Bushman, Scott G., Method and apparatus for the integration of sensor data from a process tool in an advanced process control (APC) framework.
Van Boxem Gerardus J. C.,NLX, Method and system for assessing a measurement procedure and measurement-induced uncertainties on a batchwise manufacturi.
Kahn Randolph W. ; Prosack Hank G. ; Vickers Kenneth G., Method and system for enhancing the identification of causes of variations in the performance of manufactured articles.
Yuji Takagi JP; Hideaki Doi JP; Makoto Ono JP, Method and system for manufacturing semiconductor devices, and method and system for inspecting semiconductor devices.
Philippe Coronel FR; Jean Canteloup FR; Renzo Maccagnan FR; Jean-Phillippe Vassilakis FR, Method and system for semiconductor wafer fabrication process real-time in-situ interactive supervision.
Joseph C. Davis ; Karthik Vasanth ; Sharad Saxena ; Purnendu K. Mozumder ; Suraj Rao ; Chenjing L. Fernando ; Richard G. Burch, Method and system for using response-surface methodologies to determine optimal tuning parameters for complex simulators.
Yang Jiunn-Der,TWX ; Yeh Renn-Shyan,TWX ; Chang Chao-Hsin,TWX ; Chang Wen-Chen,TWX, Method and system for yield loss analysis by yield management system.
Campbell William Jarrett ; Lansford Jeremy, Method for characterizing polish pad lots to eliminate or reduce tool requalification after changing a polishing pad.
Kelkar Amit S., Method for depositing a selected thickness of an interlevel dielectric material to achieve optimum global planarity on a semiconductor wafer.
Leu, Jihperng; Wu, Chih-I; Zhou, Ying; Kloster, Grant M., Method for improving nucleation and adhesion of CVD and ALD films deposited onto low-dielectric-constant dielectrics.
Shuo-Yen Tai TW; Ming-Cheng Yang TW; Jiun-Fang Wang TW; Champion Yi TW, Method for integration optimization by chemical mechanical planarization end-pointing technique.
Miller Michael Lee ; Campbell William Jarrett, Method for providing cooperative run-to-run control for multi-product and multi-process semiconductor fabrication.
Liu Chung-Shi,TWX ; Yu Chen-Hua,TWX ; Bao Tien-I,TWX ; Jang Syun-Ming,TWX, Method for selective growth of Cu3Ge or Cu5Si for passivation of damascene copper structures and device manufactured thereby.
Meikle Scott G. (Boise ID) Marty Lucky F. (Scottsdale AZ), Method for selectively reconditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers.
Bomans Muriel (Boulogne FRX) Pierre Francine (Paris FRX) Robin Hugues (Bouguenais FRX), Method for structuring information used in an industrial process and its application to aircraft piloting assistance.
Weling Milind (San Jose CA) Gabriel Calvin T. (Cupertino CA), Method of inspecting planarity of wafer surface after etchback step in integrated circuit fabrication.
Lopatin, Sergey; King, Paul L.; Bernard, Joffre F., Method of reducing electromigration by ordering zinc-doping in an electroplated copper-zinc interconnect and a semiconductor device thereby formed.
Lopatin, Sergey; Nickel, Alexander H., Method of reducing electromigration in a copper line by Zinc-Doping of a copper surface from an electroplated copper-zinc alloy thin film and a semiconductor device thereby formed.
Lopatin, Sergey; Nickel, Alexander H., Method of reducing electromigration in a copper line by electroplating an interim copper-zinc alloy thin film on a copper surface and a semiconductor device thereby formed.
Frizelle Gerald D. M. (St. Albans GB3) Jackson Robert G. (Preston GB3) Woodcock Eric J. (Preston GB3), Methods and apparatus for the testing, monitoring and improvement of manufacturing process effectiveness.
Bartels Anthony L. ; Allen Robert F. ; Holzapfel Paul ; Lin Warren, Methods for the in-process detection of workpieces with a monochromatic light source.
Mellen-Garnett Katrina A. ; Gupta Prashant, Modular application collaboration including filtering at the source and proxy execution of compensating transactions to conserve server resources.
Mozumder Purnendu K. (Plano TX) Saxena Sharad (Dallas TX) Pu William W. (Plano TX), Multi-variable statistical process controller for discrete manufacturing.
Kim Do-hyeong,KRX ; Kim Tae-ryong,KRX ; Choi Byeung-wook,KRX ; Jung Kwang-jin,KRX, Multiple reaction chamber system having wafer recognition system and method for processing wafer using same.
Goiffon David A. ; Hartmann Gerald E. ; Johnson David R., Object management system supporting the use of application domain knowledge mapped to technology domain knowledge.
Tantry Subhash B. (Palo Alto CA) Mashruwala Rajesh U. (Palo Alto CA) Lozier Barry A. (Sunnyvale CA) Hess Richard L. (Palo Alto CA), Object-oriented architecture for factory floor management.
Brewer Tony Mahlon ; Watson Thomas Lee ; Chastain David Michael, Parallel processing computer system having shared coherent memory and interconnections utilizing separate undirectional.
Chan Lap ; Yap Kuan Pei,MYX ; Tee Kheng Chok,MYX ; Ip Flora S.,SGX ; Loh Wye Boon,MYX, Passivation of copper interconnect surfaces with a passivating metal layer.
Axelby George S. (North Linthicum MD) Geldiay Vedat (Silver Spring MD) Moulds ; III Clinton W. (Millersville MD), Predictive model reference adaptive controller.
Lane Leslie A. (Santa Clara CA) Lybeck Lynn V. (Moss Beach CA) Perloff David S. (Sunnyvale CA) Kumagi Shoji (Santa Clara CA), Process control interface system for managing measurement data.
Anthony J. Toprac, Process control with control signal derived from metrology of a repetitive critical dimension feature of a test structure on the work piece.
Saxena Sharad ; Unruh Amy J. ; Mozumder Purnendu K. ; Burch Richard G., Process flow design at the module effects level through the use of acceptability regions.
Sierk Dennis A. (Huntsville AL) DuRoss Ronald R. (Huntsville AL) Geist Stephen G. (Union Grove AL) Hayes Gregory L. (Fayetteville TN), Process gas distribution system and method.
Sierk Dennis A. (Huntsville AL) DuRoss Ronald R. (Huntsville AL) Geist Stephen G. (Union Grove AL) Hayes Gregory L. (Fayetteville TN), Process gas distribution system and method with automatic transducer zero calibration.
Sierk Dennis A. (Huntsville AL) DuRoss Ronald R. (Huntsville AL) Geist Stephen G. (Union Grove AL) Hayes Gregory L. (Fayetteville TN), Process gas distribution system and method with automatic transducer zero calibration.
Sierk Dennis A. (Huntsville AL) DuRoss Ronald R. (Huntsville AL) Geist Stephen G. (Union Grove AL) Hays Gregory L. (Fayetteville TN), Process gas distribution system and method with gas cabinet exhaust flow control.
Sierk Dennis A. (Huntsville AL) DuRoss Ronald R. (Huntsville AL) Geist Stephen G. (Union Grove AL) Hayes Gregory L. (Fayetteville TN), Process gas distribution system and method with supervisory control.
Schacham-Diamand Yosef ; Dubin Valery M. ; Ting Chiu H. ; Zhao Bin ; Vasudev Prahalad K. ; Desilva Melvin, Protected encapsulation of catalytic layer for electroless copper interconnect.
Lopatin, Sergey; Nickel, Alexander H., Semiconductor device with copper-filled via includes a copper-zinc/alloy film for reduced electromigration of copper.
Anthony J. Toprac ; Michael L. Miller ; Thomas Sonderman, Supervisory method for determining optimal process targets based on product performance in microelectronic fabrication.
Wang Qingsu ; Christian Craig William ; Crowley John B. ; Dolman Denver L., System and method for calculating cluster tool performance metrics using a weighted configuration matrix.
Campbell William Jarrett ; Mullins James Anthony ; Toprac Anthony John, System and method for controlling the manufacture of discrete parts in semiconductor fabrication using model predictive control.
Wang Qingsu ; Barnett Gerald ; Greig R. Michael ; Cheng Yi, System and method for performing real time data acquisition, process modeling and fault detection of wafer fabrication p.
Fuduka Etsuo (Tokyo JPX) Tazawa Masayoshi (Tokyo JPX) Miura Kazuyki (Tokyo JPX) Takano Tomiko (Tokyo JPX) Satoguchi Yuichi (Tokyo JPX) Ozaki Yuichiro (Tokyo JPX), System for automatically producing different semiconductor products in different quantities through a plurality of proce.
Shiba Masataka,JPX ; Watanabe Kenji,JPX ; Hamada Toshimitsu,JPX ; Ishikawa Seiji,JPX ; Go Naoki,JPX ; Yachi Toshiaki,JPX ; Watanabe Tetsuya,JPX ; Jingu Takahiro,JPX, System for quality control where inspection frequency of inspection apparatus is reset to minimize expected total loss based on derived frequency function and loss value.
Schwenke Marvin J. ; Staron Raymond J. ; Sinclair James A. ; Franklin Paul F. ; Hoskins Josiah C., System, method and article of manufacture for displaying an animated, realtime updated control sequence chart.
Dubin Valery M. (Cupertino CA) Schacham-Diamand Yosi (Ithaca NY) Zhao Bin (Irvine CA) Vasudev Prahalad K. (Austin TX) Ting Chiu H. (Saratoga CA), Use of cobalt tungsten phosphide as a barrier material for copper metallization.
Goodwin, Thomas J.; Emami, Iraj; May, Charles E., Use of contamination-free manufacturing data in fault detection and classification as well as in run-to-run control.
Herner, Scott Brad; Hernandez, Manuel Anselmo, Wafer pretreatment to decrease rate of silicon dioxide deposition on silicon nitride compared to silicon substrate.
Huang, Chung Ho; Venugopal, Vijayakumar C.; Lam, Connie; Podlesnik, Dragan, Arrangement for identifying uncontrolled events at the process module level and methods thereof.
Shanmugasundram, Arulkumar P.; Schwarm, Alexander T.; Prabhu, Gopalakrishna B., Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles.
Martin,Jeremy Isaac, Method and apparatus for pressure and plasma control during transitions used to create graded interfaces by multi-step PECVD deposition.
Burda, Richard Gerard; Degbotse, Alfred; Denton, Brian Trevor; Fordyce, Kenneth Jeffrey; Milne, Robert John, Method of release and product flow management for a manufacturing facility.
Albarede, Luc; Pape, Eric; Venugopal, Vijayakumar C; Choi, Brian D, Methods and apparatus for predictive preventive maintenance of processing chambers.
Venugopal, Vijayakumar C.; Benjamin, Neil Martin Paul, Methods and arrangements for in-situ process monitoring and control for plasma processing tools.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.