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A method of separating a lamination body with high yield without damaging the lamination body is provided. Further, a method of manufacturing a lightweight, flexible semiconductor device, which is thin in total is provided. The method of manufacturing the semiconductor device includes: a first step

A method of separating a lamination body with high yield without damaging the lamination body is provided. Further, a method of manufacturing a lightweight, flexible semiconductor device, which is thin in total is provided. The method of manufacturing the semiconductor device includes: a first step of laminating a metal layer, an oxide layer, a layer containing no hydrogen element, and a lamination body on a first substrate; a second step of forming a photocatalytic layer on a transparent substrate; and a third step of attaching the photocatalytic layer to the surface of the lamination body by using a first adhesive material after the first and second steps, separating the metal layer from the oxide layer, and irradiating light from a side of the transparent substrate so that an interface between the photocatalytic layer and the first adhesive material is separated to remove the first adhesive material.

대표청구항 ▼

What is claimed is: 1. A method for manufacturing a semiconductor device comprising: forming a metal film, an oxide film, a film containing no hydrogen element, and a lamination body over a first substrate; forming a photocatalytic layer over a transparent substrate; attaching the photocatalytic l

What is claimed is: 1. A method for manufacturing a semiconductor device comprising: forming a metal film, an oxide film, a film containing no hydrogen element, and a lamination body over a first substrate; forming a photocatalytic layer over a transparent substrate; attaching the photocatalytic layer to a surface of the lamination body by using a first adhesive material; separating the metal film from the oxide film; irradiating an interface between the photocatalytic layer and the first adhesive material with a light; and separating the photocatalytic layer from the first adhesive material. 2. A method for manufacturing a semiconductor device according to claim 1, wherein the light is irradiated from a side of the transparent substrate. 3. A method for manufacturing a semiconductor device according to claim 1, wherein the film containing no hydrogen element has a conductive property. 4. A method for manufacturing a semiconductor device according to claim 1, wherein the layer containing no hydrogen element is etched into a predetermined shape to form a connection terminal. 5. A method for manufacturing a semiconductor device according to claim 1, wherein the film containing no hydrogen element has an insulating property. 6. A method for manufacturing a semiconductor device according to claim 1, wherein the film containing no hydrogen element is etched into a predetermined shape to form a protective film, while a conductive film formed in the lamination body is partly exposed to form a connection terminal. 7. A method for manufacturing a semiconductor device according to claim 1, wherein the lamination body comprises a semiconductor element selected from the group consisting of a thin film transistor, an organic semiconductor element, a diode, an MIM element. 8. A method for manufacturing a semiconductor device according to claim 1, wherein the metal film comprises at least one selected from the group consisting of titanium, aluminum, tantalum, tungsten, molybdenum, copper, chromium, neodymium, iron, nickel, cobalt, ruthenium, rhodium, palladium, osmium, and iridium. 9. A method for manufacturing a semiconductor device according to claim 1, wherein the oxide film is formed by treating the metal film with a thermal oxidation, a plasma irradiation, or a strong oxidizing solution. 10. A method for manufacturing a semiconductor device according to claim 1, wherein the film containing no hydrogen element comprises a nitride of an element selected from the group consisting of Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, Fe, Co, Mn, Ni, and Al. 11. A method for manufacturing a semiconductor device according to claim 1, wherein the film containing no hydrogen element is formed by sputtering. 12. A method for manufacturing a semiconductor device according to claim 1, wherein the semiconductor device is at least one selected from the group consisting of a TV set, a video camera, a digital camera, a goggle type display, a navigation system, an audio reproduction device, a laptop computer, a game machine, a mobile computer, a cellular telephone, an electronic book, and an image reproduction device. 13. A method for manufacturing a semiconductor device comprising: forming a metal film, an oxide film, a film containing no hydrogen element, and a lamination body over a first substrate; forming a photocatalytic layer over a transparent substrate; attaching the photocatalytic layer to a surface of the lamination body by using a first adhesive material; separating the metal film from the oxide film; irradiating an interface between the photocatalytic layer and the first adhesive material with a light; separating the photocatalytic layer from the first adhesive material; and removing the first adhesive material after separating the photocatalytic layer. 14. A method for manufacturing a semiconductor device according to claim 13, wherein the light is irradiated from a side of the transparent substrate. 15. A method for manufacturing a semiconductor device according to claim 13, wherein the film containing no hydrogen element has a conductive property. 16. A method for manufacturing a semiconductor device according to claim 13, wherein the layer containing no hydrogen element is etched into a predetermined shape to form a connection terminal. 17. A method for manufacturing a semiconductor device according to claim 13, wherein the film containing no hydrogen element has an insulating property. 18. A method for manufacturing a semiconductor device according to claim 13, wherein the film containing no hydrogen element is etched into a predetermined shape to form a protective film, while a conductive film formed in the lamination body is partly exposed to form a connection terminal. 19. A method for manufacturing a semiconductor device according to claim 13, wherein the lamination body comprises a semiconductor element selected from the group consisting of a thin film transistor, an organic semiconductor element, a diode, an MIM element. 20. A method for manufacturing a semiconductor device according to claim 13, wherein the metal film comprises at least one selected from the group consisting of titanium, aluminum, tantalum, tungsten, molybdenum, copper, chromium, neodymium, iron, nickel, cobalt, ruthenium, rhodium, palladium, osmium, and iridium. 21. A method for manufacturing a semiconductor device according to claim 13, wherein the oxide film is formed by treating the metal film with a thermal oxidation, a plasma irradiation, or a strong oxidizing solution. 22. A method for manufacturing a semiconductor device according to claim 13, wherein the film containing no hydrogen element comprises a nitride of an element selected from the group consisting of Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, Fe, Co, Mn, Ni, and Al. 23. A method for manufacturing a semiconductor device according to claim 13, wherein the film containing no hydrogen element is formed by sputtering. 24. A method for manufacturing a semiconductor device according to claim 13, wherein the semiconductor device is at least one selected from the group consisting of a TV set, a video camera, a digital camera, a goggle type display, a navigation system, an audio reproduction device, a laptop computer, a game machine, a mobile computer, a cellular telephone, an electronic book, and an image reproduction device. 25. A method for manufacturing a semiconductor device comprising: forming a metal film, an oxide film, a film containing no hydrogen element, and a lamination body over a first substrate; forming a photocatalytic layer over a transparent substrate; attaching the photocatalytic layer to a surface of the lamination body by using a first adhesive material; separating the metal film from the oxide film; attaching a second substrate to a surface of the oxide film by using a second adhesive material; irradiating an interface between the photocatalytic layer and the first adhesive material with a light; and separating the photocatalytic layer from the first adhesive material. 26. A method for manufacturing a semiconductor device according to claim 25, wherein the light is irradiated from a side of the transparent substrate. 27. A method for manufacturing a semiconductor device according to claim 25, further comprising a step of attaching a third substrate to a surface of the lamination body by using a third adhesive material. 28. A method for manufacturing a semiconductor device according to claim 25, wherein the first substrate comprises at least one selected from the group consisting of a quartz substrate, a ceramic substrate, a silicon substrate, a metal substrate, and a stainless substrate. 29. A method for manufacturing a semiconductor device according to claim 25, wherein the second substrate comprises a plastic. 30. A method for manufacturing a semiconductor device according to claim 27, wherein the third substrate comprises a plastic. 31. A method for manufacturing a semiconductor device according to claim 25, wherein the lamination body comprises a semiconductor element selected from the group consisting of a thin film transistor, an organic semiconductor element, a diode, an MIM element. 32. A method for manufacturing a semiconductor device according to claim 25, wherein the metal film comprises at least one selected from the group consisting of titanium, aluminum, tantalum, tungsten, molybdenum, copper, chromium, neodymium, iron, nickel, cobalt, ruthenium, rhodium, palladium, osmium, and iridium. 33. A method for manufacturing a semiconductor device according to claim 25, wherein the oxide film is formed by treating the metal film with a thermal oxidation, a plasma irradiation, or a strong oxidizing solution. 34. A method for manufacturing a semiconductor device according to claim 25, wherein the film containing no hydrogen element comprises a nitride of an element selected from the group consisting of Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, Fe, Co, Mn, Ni, and Al. 35. A method for manufacturing a semiconductor device according to claim 25, wherein the film containing no hydrogen element is formed by sputtering. 36. A method for manufacturing a semiconductor device according to claim 25, wherein the semiconductor device is at least one selected from the group consisting of a TV set, a video camera, a digital camera, a goggle type display, a navigation system, an audio reproduction device, a laptop computer, a game machine, a mobile computer, a cellular telephone, an electronic book, and an image reproduction device. 37. A method for manufacturing a semiconductor device comprising: forming a metal film, an oxide film, a film containing no hydrogen element, and a lamination body over a first substrate; forming a photocatalytic layer over a transparent substrate; attaching the photocatalytic layer to a surface of the lamination body by using a first adhesive material; separating the metal film from the oxide film; attaching a second substrate to a surface of the oxide film by using a second adhesive material; irradiating an interface between the photocatalytic layer and the first adhesive material with a light; separating the photocatalytic layer from the first adhesive material; and removing the first adhesive material after separating the photocatalytic layer. 38. A method for manufacturing a semiconductor device according to claim 37, wherein the light is irradiated from a side of the transparent substrate. 39. A method for manufacturing a semiconductor device according to claim 37, further comprising a step of attaching a third substrate to a surface of the lamination body by using a third adhesive material. 40. A method for manufacturing a semiconductor device according to claim 37, wherein the first substrate comprises at least one selected from the group consisting of a quartz substrate, a ceramic substrate, a silicon substrate, a metal substrate, and a stainless substrate. 41. A method for manufacturing a semiconductor device according to claim 37, wherein the second substrate comprises a plastic. 42. A method for manufacturing a semiconductor device according to claim 39, wherein the third substrate comprises a plastic. 43. A method for manufacturing a semiconductor device according to claim 37, wherein the lamination body comprises a semiconductor element selected from the group consisting of a thin film transistor, an organic semiconductor element, a diode, an MIM element. 44. A method for manufacturing a semiconductor device according to claim 37, wherein the metal film comprises at least one selected from the group consisting of titanium, aluminum, tantalum, tungsten, molybdenum, copper, chromium, neodymium, iron, nickel, cobalt, ruthenium, rhodium, palladium, osmium, and iridium. 45. A method for manufacturing a semiconductor device according to claim 37, wherein the oxide film is formed by treating the metal film with a thermal oxidation, a plasma irradiation, or a strong oxidizing solution. 46. A method for manufacturing a semiconductor device according to claim 37, wherein the film containing no hydrogen element comprises a nitride of an element selected from the group consisting of Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, Fe, Co, Mn, Ni, and Al. 47. A method for manufacturing a semiconductor device according to claim 37, wherein the film containing no hydrogen element is formed by sputtering. 48. A method for manufacturing a semiconductor device according to claim 37, wherein the semiconductor device is at least one selected from the group consisting of a TV set, a video camera, a digital camera, a goggle type display, a navigation system, an audio reproduction device, a laptop computer, a game machine, a mobile computer, a cellular telephone, an electronic book, and an image reproduction device.