초록 ▼

A thermal dissipation structure and method are provided which include a heat sink having a surface configured to couple to a surface of an electronic component for facilitating removal of heat from the component. The heat sink surface and the electronic component surface comprise dissimilar material

A thermal dissipation structure and method are provided which include a heat sink having a surface configured to couple to a surface of an electronic component for facilitating removal of heat from the component. The heat sink surface and the electronic component surface comprise dissimilar materials with different coefficients of thermal expansion. The heat sink surface has a pattern of channels therein which define multiple heat sink substructures. Each heat sink substructure includes a portion of the heat sink surface. The portions of the heat sink surface are coplanar and provide a reduced distance to neutral point across the heat sink surface. When the portions of the heat sink surface are bonded to the electronic component surface, shear stress within the bond is reduced.

대표청구항 ▼

What is claimed is: 1. A thermal dissipation structure comprising: a heat sink having a first surface configured to couple to a second surface of an electronic component for facilitating removal of heat from the electronic component, wherein the first surface of the heat sink and the second surface

What is claimed is: 1. A thermal dissipation structure comprising: a heat sink having a first surface configured to couple to a second surface of an electronic component for facilitating removal of heat from the electronic component, wherein the first surface of the heat sink and the second surface of the electronic component comprise dissimilar materials with different coefficients of thermal expansion; and wherein the first surface of the heat sink has a pattern of open channels therein, the channels of the pattern of open channels extending into the heat sink a distance less than a thickness of the heat sink, and the pattern of open channels defining multiple heat sink substructures, each heat sink substructure including a portion of the first surface of the heat sink, the portions of the first surface of the heat sink substructures being coplanar, and providing a reduced distance to neutral point across the first surface of the heat sink so that when the portions of the first surface of the heat sink are bonded to the second surface of the electronic component shear stress within the bond is reduced. 2. The thermal dissipation structure of claim 1, wherein the multiple heat sink substructures are partially compliant, the partial compliance enhancing coupling of the heat sink to the electronic component when the portions of the first surface of the heat sink are bonded to the second surface of the electronic component. 3. The thermal dissipation structure of claim 1, wherein the heat sink comprises a graphite composite material, and wherein the electronic component comprises at least one of an electronic device, an electronic module, an integrated circuit chip and a thermal spreader. 4. The thermal dissipation structure of claim 1, wherein the heat sink comprises a heat sink base, and wherein the first surface comprises one main surface of the heat sink base, and wherein the heat sink base further includes another main surface with a plurality of fins projecting therefrom. 5. The thermal dissipation structure of claim 4, wherein the pattern of open channels in the first surface of the heat sink comprises a pattern of grooves in the heat sink base at the first surface of the heat sink, the pattern of grooves extending from the one main surface of the heat sink base towards the another main surface of the heat sink base with the plurality of fins projecting therefrom, the pattern of grooves extending from the one main surface a depth short of the another main surface. 6. The thermal dissipation structure of claim 5, wherein the grooves of the pattern of grooves extend into the heat sink base a distance greater than half the distance between the one main surface of the heat sink base and the another main surface of the heat sink base. 7. The thermal dissipation structure of claim 5, wherein the pattern of grooves comprises a grid pattern of grooves in the heat sink base, the grid pattern of grooves defining the multiple heat sink substructures, each heat sink substructure having a portion of the first surface of the heat sink with at least one of a rectangular shaped area or a square shaped area. 8. The thermal dissipation structure of claim 7, wherein the heat sink comprises a monolithic structure. 9. The thermal dissipation structure of claim 1, wherein the heat sink comprises a heat sink base, and the heat sink substructures are bonded to the heat sink base at one main surface of the heat sink base, and wherein the heat sink further comprises a plurality of fins projecting from the heat sink base at another main surface thereof. 10. An electronic assembly comprising: an electronic component; a thermal dissipation structure comprising: a heat sink having a first surface configured to couple to a second surface of the electronic component for facilitating removal of heat from the electronic component, wherein the first surface of the heat sink and the second surface of the electronic component comprise dissimilar materials with different coefficients of thermal expansion; and wherein the first surface of the heat sink has a pattern of open channels therein, the channels of the pattern of open channels extending into the heat sink a distance less than a thickness of the heat sink, and the pattern of open channels defining multiple heat sink substructures, each heat sink substructure including a portion of the first surface of the heat sink, the portions of the first surface of the heat sink substructures being coplanar, and providing a reduced distance to neutral point across the first surface of the heat sink; and bonding material disposed between the portions of the first surface of the heat sink substructures and the second surface of the electronic component, wherein the bonding material comprises a thermal interface between the portions of the first surface of the heat sink substructures and the second surface of the electronic component. 11. The electronic assembly of claim 10, wherein the bonding material comprises one of a solder based material or an epoxy based material disposed between the portions of the first surface of the heat sink substructures and the second surface of the electronic component. 12. The electronic assembly of claim 10, wherein the multiple heat sink substructures are partially compliant, the partial compliance enhancing coupling strength of the heat sink to the electronic component. 13. The electronic assembly of claim 10, wherein the heat sink comprises a graphite composite material, and wherein the electronic component composes at least one of an electronic device, an electronic module, an integrated circuit chip, and a thermal spreader. 14. The electronic assembly of claim 10, wherein the heat sink comprises a heat sink base, and wherein the first surface comprises one main surface of the heat sink base, and wherein the heat sink base further includes another main surface with a plurality of fins projecting therefrom. 15. The electronic assembly of claim 14, wherein the pattern of open channels in the first main surface of the heat sink comprises a pattern of grooves in the heat sink base at the first surface of the heat sink, the pattern of grooves extending from the one main surface of the heat sink base comprising the first surface towards the another main surface of the heat sink base with the plurality of fins projecting therefrom, the pattern of grooves extending from the one main surface a depth short of the another main surface. 16. The electronic assembly of claim 15, wherein the grooves of the pattern of grooves extend into the heat sink base a distance greater than half the distance between the one main surface of the heat sink base and the another main surface of the heat sink base. 17. The electronic assembly of claim 15, wherein the pattern of grooves comprises a grid pattern of grooves in the heat sink base, the grid pattern of grooves defining the multiple heat sink substructures, each heat sink substructure having a portion of the first surface of the heat sink with at least one of a rectangular shaped area or a square shaped area. 18. The electronic assembly of claim 17, wherein the heat sink comprises a monolithic, graphite composite structure. 19. The electronic assembly of claim 10, wherein the heat sink comprises a heat sink base, and the heat sink substructures are bonded to the heat sink base at one main surface of the heat sink base, and wherein the heat sink further comprises a plurality of fins projecting from the heat sink base at another main surface thereof. 20. A thermal dissipation method for an electronic component, said method comprising: providing a heat sink having a first surface configured to couple to a second surface of the electronic component for facilitating removal of heat from the electronic component, wherein the first surface of the heat sink and the second surface of the electronic component comprise dissimilar materials with different coefficients of thermal expansion; wherein the first surface of the heat sink has a pattern of open channels therein, the channels of the pattern of open channels extending into the heat sink a distance less than a thickness of the heat sink, and the pattern of open channels defining multiple heat sink substructures, each heat sink substructure including a portion of the first surface of the heat sink, the portions of the first surface of the heat sink substructures being coplanar, and providing a reduced distance to neutral point across the first surface of the heat sink; and bonding the portions of the first surface of the heat sink substructures to the second surface of the electronic component, wherein the portions of the first surface of the heat sink of the multiple heat sink substructures with the reduced distance to neutral point result in reduced shear stresses within the bond between the first surface of the heat sink and the second surface of the electronic component. 21. The method of claim 20, wherein the bonding comprises providing a bonding material between the portions of the first surface of the heat sink of the multiple heat sink substructures and the second surface of the electronic component comprising at least one of a solder based material or an epoxy based material. 22. The method of claim 20, wherein the providing of the heat sink further comprises mechanically segmenting the first surface of the heat sink to establish the pattern of open channels therein and define the multiple heat sink substructures. 23. The method of claim 22, wherein the mechanically segmenting comprises mechanically cutting grooves into the heat sink at the first surface thereof to define the pattern of channels in the first surface of the heat sink. 24. The method of claim 23, further comprising mechanically cutting grooves into the heat sink at the first surface thereof a sufficient depth that the multiple heat sink substructures are partially compliant. 25. The method of claim 20, wherein the heat sink further comprises a heat sink base, the first surface of the heat sink comprises one main surface of the heat sink base, and the grooves of the pattern of grooves extend into the heat sink base a distance X, and wherein the heat sink base has a thickness Y between the one main surface thereof and another main surface of the heat sink base, with X>쩍Y and X<Y. 26. The method of claim 20, wherein the heat sink comprises a monolithic, graphite composite material, and wherein the electronic component comprises at least one of an electronic device, an electronic module, an integrated circuit chip and a thermal spreader. 27. The method of claim 20, wherein the heat sink comprises a heat sink base, and wherein the providing of the heat sink comprises bonding heat sink substructures to the heat sink base at one main surface of the heat sink base, the bonded heat sink substructures being in spaced relation, thereby establishing the pattern of open channels at the first surface of the heat sink.