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A modular computing system that includes an enclosure, a rack mounted inside the enclosure and a plurality of modular bricks. The modular bricks each include electronic components and are supported by the rack. The computing system further includes a floor tile supporting the enclosure. The floor ti

A modular computing system that includes an enclosure, a rack mounted inside the enclosure and a plurality of modular bricks. The modular bricks each include electronic components and are supported by the rack. The computing system further includes a floor tile supporting the enclosure. The floor tile includes a plurality of fans that exchange air with each of the modular bricks to cool the electronic components in each modular brick.

대표청구항 ▼

What is claimed is: 1. A modular computing system comprising: an enclosure; a rack mounted inside the enclosure; a modular brick that includes electronic components, the modular brick being supported by the rack; a primary fan outside the enclosure, the primary fan exchanging air with the modular b

What is claimed is: 1. A modular computing system comprising: an enclosure; a rack mounted inside the enclosure; a modular brick that includes electronic components, the modular brick being supported by the rack; a primary fan outside the enclosure, the primary fan exchanging air with the modular brick to cool the electronic components in the modular brick; and a controller that detects when there is a malfunction in the primary fan. 2. The modular computing system of claim 1, further comprising at least one additional modular brick that includes electronic components, the primary fan exchanging air with each of the modular bricks to cool the electronic components in each modular brick. 3. The modular computing system of claim 2, wherein each modular brick is the same size. 4. The modular computing system of claim 1, further comprising a secondary fan outside the enclosure, the secondary fan exchanging air with the modular brick to cool the electronic components in the modular brick when the controller detects a malfunction in the primary fan. 5. The modular computing system of claim 1, wherein the primary fan is connected to the modular brick by conduits. 6. A modular computing system comprising: an enclosure; a rack mounted inside the enclosure; a modular brick that includes electronic components, the modular brick being supported by the rack; and a primary fan outside the enclosure, the primary fan exchanging air with the modular brick to cool the electronic components in the modular brick, wherein the primary fan is part of a floor tile that supports the enclosure of the computing system. 7. The modular computing system of claim 6, further comprising a power source outside the enclosure, the power source supplying power to the primary fan. 8. The modular computing system of claim 6, wherein the floor tile includes a plurality of fans that exchange air with the modular brick. 9. The modular computing system of claim 6, wherein the enclosure is bottomless such that air is exchanged between the modular brick and the primary fan through a bottom of the enclosure. 10. A method of exchanging air with modular bricks in a brick-based computer system comprising: placing a modular brick onto a rack inside an enclosure, the modular brick including electronic components; using a primary fan located outside the enclosure to exchange air with the modular brick to cool the electronic components in the modular brick; and using a secondary fan located outside the enclosure to exchange air with the modular brick when there is a malfunction with the primary fan. 11. The method according to claim 10, further comprising; placing at least one additional modular brick onto the rack inside the enclosure, each additional modular brick including electronic components; and using the primary fan located outside the enclosure to exchange air with each additional modular brick to cool the electronic components in each modular brick. 12. The method according to claim 10, wherein using the primary fan to exchange air with the modular brick includes forcing air from the modular brick to the primary fan. 13. The method according to claim 10, wherein using the primary fan to exchange air with the modular brick includes forcing air from the primary fan into the modular brick. 14. The method according to claim 10, further comprising powering the modular brick using a first power source and powering the primary fan using a second power source. 15. A method of exchanging air with modular bricks in a brick-based computer system comprising: placing a modular brick onto a rack inside an enclosure, the modular brick including electronic components; and using a primary fan located outside the enclosure to exchange air with the modular brick to cool the electronic components in the modular brick, wherein using the primary fan located outside the enclosure to exchange air with the modular brick includes positioning the enclosure above a floor tile that includes the primary fan. 16. The method according to claim 15, wherein using the primary fan located outside the enclosure to exchange air with the modular brick includes exchanging air between the primary fan and the modular brick through a bottom of the enclosure. 17. The method according to claim 15, wherein positioning the enclosure above a floor tile that includes the primary fan includes positioning the enclosure above a floor tile that includes a plurality of fans. 18. A modular computing system, comprising: an enclosure; a rack mounted inside the enclosure; a plurality of modular bricks supported by the rack, each modular brick including electronic components; and a floor tile supporting the enclosure, the floor tile including a plurality of fans to exchange air with each of the modular bricks to cool the electronic components in each modular brick.