$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Semiconductor device and method of manufacturing the same

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/00
  • H01L-021/46
  • H01L-021/02
  • H01L-021/30
출원번호 US-0787552 (2004-02-27)
우선권정보 JP-2003-053193(2003-02-28); JP-2003-053243(2003-02-28)
발명자 / 주소
  • Imai,Keitaro
  • Takayama,Toru
  • Goto,Yuugo
  • Maruyama,Junya
  • Ohno,Yumiko
출원인 / 주소
  • Semiconductor Energy Laboratory Co., Ltd.
대리인 / 주소
    Robinson Intellectual Property Law Office, P.C.
인용정보 피인용 횟수 : 47  인용 특허 : 7

초록

To provide a method for manufacturing a semiconductor device including a transfer step that is capable of controlling the adhesiveness of a substrate and an element-formed layer in the case of separating the element-formed layer including a semiconductor element or an integrated circuit formed over

대표청구항

What is claimed is: 1. A method for manufacturing a semiconductor device, comprising the steps of: forming a metal layer over a first substrate; forming an adhesive agent on a portion of the metal layer; forming an oxide layer to cover the metal layer and the adhesive agent; forming an element-for

이 특허에 인용된 특허 (7)

  1. Vu, Duy-Phach; Dingle, Brenda; Cheong, Ngwe, High density electronic circuit modules.
  2. Inoue Satoshi,JPX ; Shimoda Tatsuya,JPX, Manufacturing method of active matrix substrate, active matrix substrate and liquid crystal display device.
  3. Vu Duy-Phach (Taunton MA) Dingle Brenda D. (Mansfield MA) Dingle Jason E. (Mansfield MA) Cheong Ngwe (Boston MA), Method for manufacturing a semiconductor device using a circuit transfer film.
  4. Ramm Peter,DEX ; Buchner Reinhold,DEX, Method of making a three-dimensional integrated circuit.
  5. Yamazaki Shunpei,JPX ; Arai Yasuyuki,JPX ; Teramoto Satoshi,JPX, Method of manufacturing a semiconductor device using a metal which promotes crystallization of silicon and substrate bo.
  6. Tatsuya Shimoda JP; Satoshi Inoue JP; Wakao Miyazawa JP, Separating method, method for transferring thin film device, thin film device, thin film integrated circuit device, and liquid crystal display device manufactured by using the transferring method.
  7. Vu Duy-Phach (Taunton MA) Dingle Brenda D. (Mansfield MA) Dingle Jason E. (Mansfield MA) Cheong Ngwe (Boston MA), Single crystal silicon tiles for liquid crystal display panels including light shielding layers.

이 특허를 인용한 특허 (47)

  1. Moriwaka, Tomoaki, Beam homogenizer and laser irradiation apparatus.
  2. Yamazaki, Shunpei; Hirakata, Yoshiharu; Yoshizumi, Kensuke, Display device.
  3. Yamazaki, Shunpei; Hirakata, Yoshiharu; Yoshizumi, Kensuke, Display device and method for manufacturing display device.
  4. Yamazaki, Shunpei; Hirakata, Yoshiharu; Yoshizumi, Kensuke, Display device including a touch sensor and method for manufacturing display device including a touch sensor.
  5. Sasagawa, Shinya; Monoe, Shigeharu, Etching method and manufacturing method of semiconductor device.
  6. Sasagawa, Shinya; Monoe, Shigeharu, Etching method and manufacturing method of semiconductor device.
  7. Hirakata, Yoshiharu, Light-emitting device and method for fabricating the same.
  8. Hirakata, Yoshiharu, Light-emitting device and method for fabricating the same.
  9. Sakuishi, Tatsuya, Light-emitting device, module, electronic device, and manufacturing method of light-emitting device.
  10. Maekawa, Shinji; Fujii, Gen; Maruyama, Junya; Takayama, Toru; Fukumoto, Yumiko; Arai, Yasuyuki, Manufacturing method of semiconductor device.
  11. Watanabe, Ryosuke, Manufacturing method of semiconductor device.
  12. Yamada, Daiki; Dozen, Yoshitaka, Manufacturing method of semiconductor device.
  13. Sugiyama, Eiji; Dozen, Yoshitaka; Fukumoto, Yumiko; Kuwabara, Hideaki; Yamazaki, Shunpei, Manufacturing method of semiconductor device including peeling layers from substrates by etching.
  14. Sugiyama, Eiji; Dozen, Yoshitaka; Ohno, Yumiko; Kuwabara, Hideaki; Yamazaki, Shunpei, Manufacturing method of semiconductor device using peeling.
  15. Yamazaki,Shunpei; Takayama,Toru; Kanno,Yohei, Manufacturing method of thin film integrated circuit device and manufacturing method of non-contact type thin film integrated circuit device.
  16. Maruyama, Junya; Jinbo, Yasuhiro; Shoji, Hironobu; Kuwabara, Hideaki; Yamazaki, Shunpei, Method for manufacturing a semiconductor device using a flexible substrate.
  17. Eguchi, Shingo; Oikawa, Yoshiaki; Katayama, Masahiro; Nakamura, Ami; Monma, Yohei, Method for manufacturing flexible semiconductor device.
  18. Tsurume, Takuya; Maruyama, Junya; Dozen, Yoshitaka, Method for manufacturing integrated circuit.
  19. Tsurume, Takuya; Maruyama, Junya; Dozen, Yoshitaka, Method for manufacturing integrated circuit.
  20. Tamura, Tomoko; Sugiyama, Eiji; Dozen, Yoshitaka; Dairiki, Koji; Tsurume, Takuya, Method for manufacturing semiconductor device.
  21. Tamura, Tomoko; Sugiyama, Eiji; Dozen, Yoshitaka; Dairiki, Koji; Tsurume, Takuya, Method for manufacturing semiconductor device.
  22. Yamazaki, Shunpei; Komori, Miho; Satou, Yurika; Hosoki, Kazue; Ogita, Kaori, Method for manufacturing thin film integrated circuit device, noncontact thin film integrated circuit device and method for manufacturing the same, and idtag and coin including the noncontact thin film integrated circuit device.
  23. Yamazaki, Shunpei; Komori, Miho; Satou, Yurika; Hosoki, Kazue; Ogita, Kaori, Method for manufacturing thin film integrated circuit device, noncontact thin film integrated circuit device and method for manufacturing the same, and idtag and coin including the noncontact thin film integrated circuit device.
  24. Dozen, Yoshitaka; Tamura, Tomoko; Tsurume, Takuya; Dairiki, Koji, Method for manufacturing thin film integrated circuit, and element substrate.
  25. Dozen,Yoshitaka; Tamura,Tomoko; Tsurume,Takuya; Dairiki,Koji, Method for manufacturing thin film integrated circuit, and element substrate.
  26. Yamazaki, Shunpei; Dairiki, Koji, Method for manufacturing thin film integrated circuit, and element substrate.
  27. Yamazaki, Shunpei; Dairiki, Koji, Method for manufacturing thin film integrated circuit, and element substrate.
  28. Yamazaki, Shunpei; Dairiki, Koji, Method for manufacturing thin film integrated circuit, and element substrate.
  29. An, Hyun-Jin; Lee, Kyoung-Mook, Method of fabricating display device using plastic substrate.
  30. Takayama, Toru; Maruyama, Junya; Goto, Yuugo; Ohno, Yumiko; Tsurume, Takuya; Kuwabara, Hideaki, Peeling method.
  31. Yamazaki, Shunpei; Suzuki, Kunihiko, Peeling method and peeling apparatus.
  32. Yasumoto, Seiji; Sato, Masataka; Eguchi, Shingo; Suzuki, Kunihiko, Peeling method, semiconductor device, and peeling apparatus.
  33. Yamazaki, Shunpei; Kato, Kiyoshi, Securities, chip mounting product, and manufacturing method thereof.
  34. Yamazaki, Shunpei; Kato, Kiyoshi, Securities, chip mounting product, and manufacturing method thereof.
  35. Yamazaki, Shunpei; Kato, Kiyoshi, Securities, chip mounting product, and manufacturing method thereof.
  36. Yamazaki, Shunpei; Suzuki, Kunihiko; Ohno, Masakatsu; Adachi, Hiroki; Idojiri, Satoru; Takeshima, Koichi, Semiconductor device.
  37. Maruyama, Junya; Takayama, Toru; Ohno, Yumiko; Yamazaki, Shunpei, Semiconductor device and manufacturing method thereof, delamination method, and transferring method.
  38. Maruyama, Junya; Takayama, Toru; Ohno, Yumiko; Yamazaki, Shunpei, Semiconductor device and manufacturing method thereof, delamination method, and transferring method.
  39. Maruyama, Junya; Takayama, Toru; Ohno, Yumiko; Yamazaki, Shunpei, Semiconductor device and manufacturing method thereof, delamination method, and transferring method.
  40. Maruyama, Junya; Takayama, Toru; Ohno, Yumiko; Yamazaki, Shunpei, Semiconductor device and manufacturing method thereof, delamination method, and transferring method.
  41. Maruyama, Junya; Takayama, Toru; Ohno, Yumiko; Yamazaki, Shunpei, Semiconductor device and manufacturing method thereof, delamination method, and transferring method.
  42. Ohnuma, Hideto, Semiconductor device and method for manufacturing semiconductor device.
  43. Koyama, Jun; Dairiki, Koji; Okazaki, Susumu; Moriya, Yoshitaka; Yamazaki, Shunpei, Semiconductor device and method for manufacturing the same.
  44. Maekawa, Shinji; Fujii, Gen; Maruyama, Junya; Takayama, Toru; Fukumoto, Yumiko; Arai, Yasuyuki, Semiconductor device and method for manufacturing the same.
  45. Yamamoto, Yoshiaki; Tanaka, Koichiro; Isobe, Atsuo; Ohgarane, Daisuke; Yamazaki, Shunpei, Semiconductor device and method for manufacturing the same.
  46. Kato, Kiyoshi, Semiconductor integrated circuit, semiconductor device, and manufacturing method of the semiconductor integrated circuit.
  47. Jia, Pei; Yang, Liu-yang, Thin film transistor array substrate and manufacturing method for the same.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트