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A flexible loop thermosyphon is provided having a flexible, hermetic, outer tube and a flexible, non-hermetic, inner tube, positioned concentrically within the outer tube, forming an annulus between the outer tube and inner tube. The annulus acts as a vapor conduit transferring vapor to the loop the

A flexible loop thermosyphon is provided having a flexible, hermetic, outer tube and a flexible, non-hermetic, inner tube, positioned concentrically within the outer tube, forming an annulus between the outer tube and inner tube. The annulus acts as a vapor conduit transferring vapor to the loop thermosyphon condenser while the inner tube acts as a condensate conduit returning liquid to the loop thermosyphon evaporator.

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What is claimed is: 1. A loop thermosyphon comprising an evaporator and a condenser that are interconnected in flow communication to one another by one conduit comprising a pair of concentrically arranged tubes comprising an inner tube and an outer tube that together define an annular void forming

What is claimed is: 1. A loop thermosyphon comprising an evaporator and a condenser that are interconnected in flow communication to one another by one conduit comprising a pair of concentrically arranged tubes comprising an inner tube and an outer tube that together define an annular void forming a vapor transfer space that is arranged in flow communication with said evaporator and said condenser, wherein said inner tube is operatively connected by an interference fit to a nipple located on said evaporator and said condenser and said outer tube is operatively connected to said evaporator and said condenser by a hermetic interface. 2. A loon thermosyphon according to claim 1 wherein said evaporator portion comprises a plurality of blade-evaporators that extend from a common manifold, wherein said common manifold is arranged in flow communication with each blade-evaporator and with said one conduit. 3. A loop thermosyphon according to claim 2 wherein each blade-evaporator is joined to said common manifold so that vapor exits from each blade-evaporator to said common manifold and condensate is returned to said common manifold so as to be distributed to individual blade-evaporators. 4. A loop thermosyphon according to claim 3 further comprising a vapor conduit hermetically engaged with said vapor plenum. 5. A loop thermosyphon according to claim 4 further comprising a condensate conduit in flow communication with said liquid header. 6. A loop thermosyphon according to claim 5 wherein said condensate conduit forms an interference fit with said nipple. 7. A thermal bus arranged within an electronics system for transporting thermal energy in a directed manner comprising at least one loop thermosyphon comprising an evaporator and a condenser that are interconnected in flow communication to one another by one conduit comprising a pair of concentrically arranged tubes comprising an inner tube and an outer tube that together define an annular void forming a vapor transfer space that is arranged in flow communication with said evaporator and said condenser, wherein said inner tube is operatively connected by an interference fit to a nipple located on said evaporator and said condenser and said outer tube is operatively connected to said evaporator and said condenser by a hermetic interface. 8. A thermal bus according to claim 7 wherein said inner tube comprises a melt-processable copolymer. 9. A thermal bus according to claim 8 wherein said condenser portion comprises a vapor vessel and a liquid vessel. 10. A thermal bus according to claim 9 wherein said liquid vessel comprises a liquid header and a vapor plenum that are separated by a bulkhead. 11. A thermal bus according to claim 10 wherein said vapor plenum is in flow communication with said vapor vessel. 12. A thermal bus according to claim 10 further comprising a port that passes through said bulkhead. 13. A thermal bus according to claim 10 wherein said inner tube forms said interference fit with said port. 14. A thermal bus according to claim 10 wherein said port comprises said nipple. 15. A thermal bus arranged within an electronics system for transporting thermal energy in a directed manner comprising: an evaporator and a condenser arranged in flow communication with one another through a conduit comprising an outer tube and an inner tube that are positioned in concentric relation to one another comprising an inner tube and an outer tube that together define an annular void forming a vapor transfer space that is arranged in flow communication with said evaporator and said condenser, wherein said inner tube is operatively connected to a port located on said evaporator and said condenser and said outer tube is operatively connected to said evaporator and said condenser by a hermetic interface. 16. A thermal bus according to claim 15 wherein said evaporator and condenser are spaced apart and separated by at least one structure. 17. A thermal bus according to claim 15 wherein said outer tube comprises a pleated wall that is formed by a plurality of circumferential folds that are arranged in parallel spaced relation to one another. 18. A thermal bus according to claim 15 wherein said inner tube comprises at least one of Teflon FEP and Teflon PFA.