A substrate removal apparatus capable of cutting a plurality of aligned, precision slots in a variety of surfaces, such as concrete, asphalt pavement, and other composite substrates, utilizes high-pressure liquid cutting devices. Slots may be cut in pavement for such applications as dowel bar retrof
A substrate removal apparatus capable of cutting a plurality of aligned, precision slots in a variety of surfaces, such as concrete, asphalt pavement, and other composite substrates, utilizes high-pressure liquid cutting devices. Slots may be cut in pavement for such applications as dowel bar retrofitting for joint load transfer restoration. An apparatus according to one embodiment includes a support frame, a carriage carried by the support frame, and cutting devices coupled to the carriage. The apparatus is configured so that the carriage is movable along a generally horizontal path of travel and a generally vertical path of travel.
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The invention claimed is: 1. An apparatus for cutting at least three slots into a surface of a substrate, comprising: a support frame having a front end and a rear end; a carriage movably carried by the support frame, the carriage reciprocally movable along a first path of travel between the front
The invention claimed is: 1. An apparatus for cutting at least three slots into a surface of a substrate, comprising: a support frame having a front end and a rear end; a carriage movably carried by the support frame, the carriage reciprocally movable along a first path of travel between the front and rear ends of the support frame; and at least three spaced-apart and substantially collinearly arranged cutting devices carried on the carriage for movement therewith, the cutting devices each including at least one discharge orifice coupled in fluid communication with a source of high pressure liquid for supplying pressurized liquid to the orifice, the pressurized liquid being discharged from the cutting devices at the discharge orifices with sufficient discharge pressure to simultaneously cut at least three slots into the surface of the substrate. 2. The apparatus of claim 1, wherein the support frame is adapted to traverse the surface of the substrate. 3. The apparatus of claim 1, further comprising a first drive source associated with the carriage for effecting reciprocal movement of the carriage along the first path of travel. 4. The apparatus of claim 3, further comprising linear actuators coupled to the ends of the carriage, the first drive source drivingly connected to the linear actuators for effecting movement of the carriage along the first path of travel. 5. The apparatus of claim 1, wherein the first path of travel is substantially parallel to the surface of the substrate. 6. The apparatus of claim 1, wherein the carriage is further reciprocally movable with respect to the support frame along a second path of travel different than the first path of travel. 7. The apparatus of claim 6, wherein the second path of travel is substantially orthogonal to the first path of travel. 8. The apparatus of claim 6, wherein the second path of travel is vertically oriented with relation to the surface of the substrate. 9. The apparatus of claim 6, further comprising a second drive source associated with the carriage for effecting reciprocal movement of the carriage along the second path of travel. 10. The apparatus of claim 9, further comprising linear actuators coupled to the ends of the carriage, the second drive source drivingly connected to the linear actuators for effecting movement of the carriage along the second path of travel. 11. The apparatus of claim 1, wherein the cutting device has an operating position substantially orthogonal to the surface of the substrate. 12. The apparatus of claim 1, further comprising at least one shield assembly connected to a lower portion of the support frame and associated with at least one cutting device, the shield assembly defining an interior cavity into which the at least one cutting device extends, wherein the shield assembly further includes a template coupled to a lower portion of the shield assembly and forming an opening corresponding in shape and size with the slot to be formed in the substrate by the at least one cutting device. 13. A method for simultaneously cutting at least three spaced-apart slots in a surface of a substrate with at least three high pressure liquid cutting heads carried on a frame in spaced relation, the method comprising: positioning the frame in a desired location with respect to the surface of the substrate with the at least three cutting heads positioned above a portion of the surface of the substrate in which slots are to be cut; and discharging liquid at high pressure from the at least three high pressure liquid cutting heads to impinge against the surface of the substrate with sufficient force to simultaneously cut at least three spaced slots in the surface of the substrate. 14. The method of claim 13, further comprising: moving the plurality of cutting heads from a first position in a first direction substantially parallel to the surface of the substrate and relative to the frame to elongate the slots. 15. The method of claim 14, further comprising: lowering the plurality of cutting heads to a second position to reduce the distance between the cutting heads and the surface of the substrate to deepen the slots. 16. The method of claim 15, further comprising: moving the plurality of cutting heads in a second direction opposite the first direction to elongate the deepened slots in the surface. 17. An apparatus for cutting at least three slots into a surface of a substrate, comprising: a support frame having a front end and a rear end; a carriage moveably carried by the support frame, the carriage reciprocally movable along a first path of travel between the front and rear ends of the support frame; and a set of three cutting devices carried on the carriage for movement therewith, the cutting devices being spaced apart and each including at least one discharge orifice, wherein the cutting devices are adapted to be connected to a source of high pressure liquid for supplying pressurized liquid to the discharge orifices, the pressurized liquid being discharged from the cutting devices at the discharge orifices with sufficient discharge pressure to simultaneously cut three spaced slots in the substrate. 18. The apparatus of claim 17, wherein the cutting devices are collinearly arranged and spaced apart a distance of approximately 12 inches. 19. The apparatus of claim 17, wherein the set of cutting devices comprises a first set of cutting devices, the apparatus being further configured to cooperate with a second set of three cutting devices, the cutting devices in each of the first and second sets being spaced apart and each including at least one discharge orifice, wherein the cutting devices in the first and second sets are adapted to be connected to a source of high pressure liquid for supplying pressurized liquid to the discharge orifices, the pressurized liquid being discharged from the cutting devices at the discharge orifices with sufficient discharge pressure to simultaneously cut six spaced slots in the substrate. 20. The apparatus of claim 19, wherein the first set of cutting devices is spaced apart a distance of approximately 60 inches from the second set of cutting devices.
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이 특허에 인용된 특허 (21)
Sergeant Mark R. (73 Tower Hill Ave. Red Bank NJ 07701), Adjustable plunge-cut road saw mechanism.
Rasmussen James E. (Marathon FL) Mosher Larry (Lebananon TN) Godwin James K. (Sheridan AR) Swanda Larry (Ankeny IA) Given Robert W. (White Hall AR) Maynard Jerry (Lebananon TN) Sidler Thomas (Lebanan, Methods for cutting aligned sets of slots in pavement.
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