초록 ▼

Devices and systems having one or more of the following components: a compliant pillar with a modified tip surface (non-flat tip) and a corresponding compliant socket; an optical/electrical I/O interconnect and a corresponding compliant socket; a lens/waveguide optical pillar, a polymer bridge, and

Devices and systems having one or more of the following components: a compliant pillar with a modified tip surface (non-flat tip) and a corresponding compliant socket; an optical/electrical I/O interconnect and a corresponding compliant socket; a lens/waveguide optical pillar, a polymer bridge, and an L-shaped pillar, are described herein. In addition, methods of making these components and methods of using these components are disclosed herein.

대표청구항 ▼

Therefore, having thus described the invention, at least the following is claimed: 1. An input/output (I/O) interconnect system, comprising: a first substrate having at least one compliant pillar transversely extending from the first substrate, wherein the compliant pillar comprises a first materia

Therefore, having thus described the invention, at least the following is claimed: 1. An input/output (I/O) interconnect system, comprising: a first substrate having at least one compliant pillar transversely extending from the first substrate, wherein the compliant pillar comprises a first material, and wherein the compliant pillar includes a non-flat tip at an end opposite the first substrate; and a second substrate having at least one compliant socket, wherein at least one of the compliant sockets is adapted to receive one of the compliant pillars of the first substrate within an opening in the compliant socket, wherein the compliant socket comprises a second material, wherein the compliant socket includes a non-flat top surface at an end opposite the second substrate that includes the opening of the compliant socket. 2. The I/O interconnect system of claim 1, wherein the first material comprises a low modulus material selected from polyimides, epoxides, polynorbornenes, polyarylene ethers, and parylenes. 3. The I/O interconnect system of claim 1, wherein the compliant pillar has a height of about 15 to 300 micrometers. 4. The I/O interconnect system of claim 1, wherein the compliant pillar has a length of about 2 to 55 micrometers and a width of about 2 to 55 micrometers. 5. The I/O interconnect system of claim 1, wherein the first substrate has from about 10 compliant pillars to about 500,000 compliant pillars per centimeter squared of the first substrate. 6. The I/O interconnect system of claim 1, wherein the second material comprises a low modulus material selected from polyimides, epoxides, polynorbornenes, polyarylene ethers, and parylenes. 7. The I/O interconnect system of claim 1, wherein the compliant socket has a height of about 5 to 30 micrometers. 8. The I/O interconnect system of claim 1, wherein the compliant socket includes a material that secures the compliant pillar to the compliant socket. 9. The I/O interconnect system of claim 1, wherein the compliant pillar is used as a transverse waveguide that is substantially perpendicular to the first substrate. 10. The I/O interconnect system of claim 9, further comprising an element selected from a diffractive grating coupler disposed on the compliant pillar and a mirror disposed on the compliant pillar. 11. The I/O interconnect system of claim 10, wherein the diffractive grating coupler is selected from a volume grating coupling element and a surface relief grating coupling element. 12. The I/O interconnect system of claim 1, further comprising an element selected from a diffractive grating coupler disposed within the second substrate and a mirror disposed within the second substrate. 13. The I/O interconnect system of claim 6, wherein the second substrate has from about 10 compliant sockets to about 100,000 compliant sockets per centimeter squared of the second substrate. 14. The I/O interconnect system of claim 1, further comprising a lead disposed upon a portion of the compliant pillar. 15. The I/O interconnect system of claim 14, wherein the lead is a radio frequency lead. 16. The I/O interconnect system of claim 14, wherein the lead is an electrical lead. 17. The I/O interconnect system of claim 15, wherein the first substrate has from about 10 compliant pillars to about 500,00 compliant pillars per centimeter squared of the first substrate. 18. The I/O interconnect system of claim 16, wherein the first substrate has from about 10 compliant pillars to about 100,000 compliant pillars per centimeter squared of the first substrate. 19. A dual-mode optical/electrical input/output (I/O) interconnect system, comprising: a first substrate having at least one optical/electrical I/O interconnect that includes a pillar transversely extending from the first substrate, wherein the pillar comprises a first material, the first material is optically conductive, and the pillar includes a lead disposed over a portion of the pillar extending from a base of the pillar on the first substrate to an end opposite the first substrate; and a second substrate having at least one socket adapted to receive the pillar and the lead, wherein the socket comprises a second material, wherein the second substrate includes a lead contact that communicatively connects the first substrate and the second substrate through the lead, wherein the second substrate includes an optical contact that communicatively connects the first substrate and the second substrate through the pillar. 20. The I/O interconnect system of claim 19, wherein the pillar is a compliant pillar. 21. The I/O interconnect system of claim 19, wherein the second material comprises a low modulus material selected from polyimides, epoxides, polynorbornenes, polyarylene ethers, and parylenes. 22. The I/O interconnect system of claim 19, wherein the socket is a compliant socket. 23. The I/O interconnect system of claim 19, wherein the pillar includes a non-flat tip at an end opposite the first substrate. 24. The I/O interconnect system of claim 19, wherein the first material comprises a low modulus material selected from polyimides, epoxides, polynorbornenes, polyarylene ethers, and parylenes. 25. The I/O interconnect system of claim 19, wherein the first substrate has from about 10 to about 100,000 optical/electrical I/O interconnects per centimeter squared of the first substrate. 26. The I/O interconnect system of claim 19, further comprising an element disposed on an end of the pillar opposite the first substrate, the element selected from a diffractive grating coupler and a mirror. 27. The I/O interconnect system of claim 26, wherein the diffractive grating coupler is selected from a volume grating coupling element and a surface relief grating coupling element. 28. A method for forming a device comprising: providing a first substrate having at least one optical/electrical I/O interconnect that includes a pillar transversely extending from the first substrate, wherein the pillar comprises a first material, the first material is optically conductive, and the pillar includes a lead disposed over a portion of the pillar extending from a base of the pillar on the first substrate to an end opposite the first substrate; providing a second substrate having at least one socket adapted to receive the optical/electrical I/O interconnect, wherein the socket comprises a second material, wherein the second substrate includes a lead contact that communicatively connects the first substrate and the second substrate through the lead, wherein the second substrate includes an optical contact that communicatively connects the first substrate and the second substrate through the pillar; and causing the socket to receive a portion of the optical/electrical I/O interconnect. 29. A method of aligning substrates, comprising: providing a first substrate having at least one optical/electrical I/O interconnect that includes a pillar transversely extending from the first substrate, wherein the pillar comprises a first material, the first material is optically conductive, and the pillar includes a lead disposed over a portion of the pillar extending from a base of the pillar on the first substrate to an end opposite the first substrate; providing a second substrate having at least one socket adapted to receive the optical/electrical I/O interconnect, wherein the socket comprises a second material, wherein the second substrate includes a lead contact that communicatively connects the first substrate and the second substrate through the lead, wherein the second substrate includes an optical contact that communicatively connects the first substrate and the second substrate through the pillar; maintaining optical alignment between the first substrate and the second substrate using the optical/electrical I/O interconnect and the socket; and maintaining electrical interconnection between the first substrate and the second substrate using the optical/electrical I/O interconnect and the socket. 30. A method of directing optical energy and electrical energy, comprising: providing a first substrate having at least one optical/electrical I/O interconnect that includes a pillar transversely extending from the first substrate, wherein the pillar comprises a first material, the first material is optically conductive, and the pillar includes a lead disposed over a portion of the pillar extending from a base of the pillar on the first substrate to an end opposite the first substrate; providing a second substrate having a socket adapted to receive the optical/electrical I/O interconnect, wherein the socket comprises a second material, wherein the second substrate includes a lead contact that communicatively connects the first substrate and the second substrate through the lead, wherein the second substrate includes at least one optical contact that communicatively connects the first substrate and the second substrate through the pillar; communicating optical energy between the pillar of the first substrate and the optical contact of the second substrate; and communicating electrical energy between the lead of the first substrate and the lead contact of the second substrate. 31. An input/output (I/O) interconnect system, comprising: a first substrate having at least one compliant pillar transversely extending from the first substrate, wherein the compliant pillar comprises a first material, and wherein the compliant pillar includes a non-flat tip at an end opposite the first substrate, wherein the compliant pillar is used as a transverse waveguide that is substantially perpendicular to the first substrate, wherein the compliant pillar has a height of about 15 to 300 micrometers; and an element selected from a diffractive grating coupler disposed on the compliant pillar and a mirror disposed on the compliant pillar. 32. The I/O interconnect system of claim 31, wherein the first material comprises a low modulus material selected from polyimides, epoxides, polynorbornenes, polyarylene ethers, and parylenes. 33. The I/O interconnect system of claim 31, wherein the compliant pillar has a length of about 2 to 55 micrometers and a width of about 2 to 55 micrometers. 34. The I/O interconnect system of claim 31, wherein the first substrate has from about 10 compliant pillars to about 500,000 compliant pillars per centimeter squared of the first substrate. 35. The I/O interconnect system of claim 31, further comprising: a second substrate having at least one compliant socket adapted to receive a compliant pillar, wherein the compliant socket comprises a second material, wherein the compliant socket includes a non-flat top surface at an end opposite the second substrate. 36. The I/O interconnect system of claim 35, wherein the second material comprises a low modulus material selected from polyimides, epoxides, polynorbornenes, polyarylene ethers, and parylenes. 37. The I/O interconnect system of claim 35, wherein the compliant socket has a height of about 5 to 30 micrometers. 38. The I/O interconnect system of claim 35, wherein the compliant socket includes a material that secures the compliant pillar to the compliant socket. 39. The I/O interconnect system of claim 31, wherein the diffractive grating coupler is selected from a volume grating coupling element and a surface relief grating coupling element. 40. The I/O interconnect system of claim 35, further comprising an element selected from a diffractive grating coupler disposed within the second substrate and a mirror disposed within the second substrate. 41. The I/O interconnect system of claim 36, wherein the second substrate has from about 10 compliant sockets to about 100,000 compliant sockets per centimeter squared of the second substrate. 42. The I/O interconnect system of claim 31, further comprising a lead disposed upon a portion of the compliant pillar. 43. The I/O interconnect system of claim 42, wherein the lead is a radio frequency lead. 44. The I/O interconnect system of claim 42, wherein the lead is an electrical lead. 45. The I/O interconnect system of claim 43, wherein the first substrate has from about 10 compliant pillars to about 500,000 compliant pillars per centimeter squared of the first substrate. 46. The I/O interconnect system of claim 44, wherein the first substrate has from about 10 compliant pillars to about 100,000 compliant pillars per centimeter squared of the first substrate. 47. An input/output (I/O) interconnect system, comprising: a first substrate having at least one compliant pillar transversely extending from the first substrate, wherein the compliant pillar comprises a first material, and wherein the compliant pillar includes a non-flat tip at an end opposite the first substrate, wherein the compliant pillar has a height of about 15 to 300 micrometers; and a lead disposed upon a portion of the compliant pillar, wherein the lead is a radio frequency lead. 48. The I/O interconnect system of claim 47, wherein the first material comprises a low modulus material selected from polyimides, epoxides, polynorbornenes, polyarylene ethers, and parylenes. 49. The I/O interconnect system of claim 47, wherein the compliant pillar has a length of about 2 to 55 micrometers and a width of about 2 to 55 micrometers. 50. The I/O interconnect system of claim 47, wherein the first substrate has from about 10 compliant pillars to about 500,000 compliant pillars per centimeter squared of the first substrate. 51. The I/O interconnect system of claim 47, further comprising: a second substrate having at least one compliant socket adapted to receive a compliant pillar and the lead, wherein the compliant socket comprises a second material, wherein the compliant socket includes a non-flat top surface at an end opposite the second substrate. 52. The I/O interconnect system of claim 51, wherein the second material comprises a low modulus material selected from polyimides, epoxides, polynorbornenes, polyarylene ethers, and parylenes. 53. The I/O interconnect system of claim 51, wherein the compliant socket has a height of about 5 to 30 micrometers. 54. The I/O interconnect system of claim 51, wherein the compliant socket includes a material that secures the compliant pillar to the compliant socket. 55. The I/O interconnect system of claim 47, wherein the compliant pillar is a transverse waveguide that is substantially perpendicular to the first substrate. 56. The I/O interconnect system of claim 55, further comprising an element selected from a diffractive grating coupler disposed on the compliant pillar and a mirror disposed on the compliant pillar. 57. The I/O interconnect system of claim 56, wherein the diffractive grating coupler is selected from a volume grating coupling element and a surface relief grating coupling element. 58. The I/O interconnect system of claim 51, further comprising an element selected from a diffractive grating coupler disposed within the second substrate and a mirror disposed within the second substrate. 59. The I/O interconnect system of claim 51, wherein the second substrate has from about 10 compliant sockets to about 100,000 compliant sockets per centimeter squared of the second substrate. 60. The I/O interconnect system of claim 51, wherein the first substrate has from about 10 compliant pillars to about 500,000 compliant pillars per centimeter squared of the first substrate. 61. An input/output (I/O) interconnect system, comprising: a first substrate having at least one compliant pillar transversely extending from the first substrate, wherein the compliant pillar comprises a first material, and wherein the compliant pillar includes a non-flat tip at an end opposite the first substrate, wherein the compliant pillar is used as a transverse waveguide that is substantially perpendicular to the first substrate, wherein the first substrate has from about 10 compliant pillars to about 500,000 compliant pillars per centimeter squared of the first substrate; and an element selected from a diffractive grating coupler disposed on the compliant pillar and a mirror disposed on the compliant pillar. 62. The I/O interconnect system of claim 61, wherein the first material comprises a low modulus material selected from polyimides, epoxides, polynorbornenes, polyarylene ethers, and parylenes. 63. The I/O interconnect system of claim 61, wherein the compliant pillar has a height of about 15 to 300 micrometers. 64. The I/O interconnect system of claim 61, wherein the compliant pillar has a length of about 2 to 55 micrometers and a width of about 2 to 55 micrometers. 65. The I/O interconnect system of claim 61, further comprising: a second substrate having at least one compliant socket adapted to receive a compliant pillar, wherein the compliant socket comprises a second material, wherein the compliant socket includes a non-flat top surface at an end opposite the second substrate. 66. The I/O interconnect system of claim 65, wherein the second material comprises a low modulus material selected from polyimides, epoxides, polynorbornenes, polyarylene ethers, and parylenes. 67. The I/O interconnect system of claim 65, wherein the compliant socket has a height of about 5 to 30 micrometers. 68. The I/O interconnect system of claim 65, wherein the compliant socket includes a material that secures the compliant pillar to the compliant socket. 69. The I/O interconnect system of claim 61, wherein the diffractive grating coupler is selected from a volume grating coupling element and a surface relief grating coupling element. 70. The I/O interconnect system of claim 65, further comprising an element selected from a diffractive grating coupler disposed within the second substrate and a mirror disposed within the second substrate. 71. The I/O interconnect system of claim 65, wherein the second substrate has from about 10 compliant sockets to about 100,000 compliant sockets per centimeter squared of the second substrate. 72. The I/O interconnect system of claim 61, further comprising a lead disposed upon a portion of the compliant pillar. 73. The I/O interconnect system of claim 72, wherein the lead is a radio frequency lead. 74. The I/O interconnect system of claim 72, wherein the lead is an electrical lead. 75. The I/O interconnect system of claim 74, wherein the first substrate has from about 10 compliant pillars to about 100,000 compliant pillars per centimeter squared of the first substrate. 76. An input/output (I/O) interconnect system, comprising: a first substrate having at least one compliant pillar transversely extending from the first substrate, wherein the compliant pillar comprises a first material, and wherein the compliant pillar includes a non-flat tip at an end opposite the first substrate, wherein a lead is disposed upon a portion of the compliant pillar, and wherein the lead is a radio frequency lead; and a second substrate having at least one compliant socket adapted to receive a compliant pillar and the lead, wherein the compliant socket comprises a second material, wherein the compliant socket includes a non-flat top surface at an end opposite the second substrate. 77. The I/O interconnect system of claim 76, wherein the first material comprises a low modulus material selected from polyimides, epoxides, polynorbornenes, polyarylene ethers, and parylenes. 78. The I/O interconnect system of claim 76, wherein the compliant pillar has a height of about 15 to 300 micrometers. 79. The I/O interconnect system of claim 76, wherein the compliant pillar has a length of about 2 to 55 micrometers and a width of about 2 to 55 micrometers. 80. The I/O interconnect system of claim 76, wherein the first substrate has from about 10 compliant pillars to about 500,000 compliant pillars per centimeter squared of the first substrate. 81. The I/O interconnect system of claim 76, wherein the second material comprises a low modulus material selected from polyimides, epoxides, polynorbornenes, polyarylene ethers, and parylenes. 82. The I/O interconnect system of claim 76, wherein the compliant socket has a height of about 5 to 30 micrometers. 83. The I/O interconnect system of claim 76, wherein the compliant socket includes a material that secures the compliant pillar to the compliant socket. 84. The I/O interconnect system of claim 76, wherein the compliant pillar is a transverse waveguide that is substantially perpendicular to the first substrate. 85. The I/O interconnect system of claim 84, further comprising an element selected from a diffractive grating coupler disposed on the compliant pillar and a mirror disposed on the compliant pillar. 86. The I/O interconnect system of claim 85, wherein the diffractive grating coupler is selected from a volume grating coupling element and a surface relief grating coupling element. 87. The I/O interconnect system of claim 76, further comprising an element selected from a diffractive grating coupler disposed within the second substrate and a mirror disposed within the second substrate. 88. The I/O interconnect system of claim 76, wherein the second substrate has from about 10 compliant sockets to about 100,000 compliant sockets per centimeter squared of the second substrate.