Method of encapsulating interconnecting units in packaged microelectronic devices
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01L-021/48
H01L-021/02
H05K-003/30
출원번호
US-0970399
(2004-10-20)
발명자
/ 주소
Cobbley,Chad A.
출원인 / 주소
Micron Technology, Inc.
대리인 / 주소
Perkins Coie LLP
인용정보
피인용 횟수 :
35인용 특허 :
153
초록▼
Methods and apparatuses for encapsulating a microelectronic die or other components in the fabrication of packaged microelectronic devices. In one aspect of the invention, a packaged microelectronic device assembly includes a microelectronic die, a substrate attached to the die, a protective casing
Methods and apparatuses for encapsulating a microelectronic die or other components in the fabrication of packaged microelectronic devices. In one aspect of the invention, a packaged microelectronic device assembly includes a microelectronic die, a substrate attached to the die, a protective casing covering a portion of the substrate, and a barrier projecting away from the surface of the substrate. The microelectronic die can have an integrated circuit and a plurality of bond-pads operatively coupled to the integrated circuit. The substrate can have a cap-zone defined by an area that is to be covered by the protective casing, a plurality of contact elements arranged in the cap-zone, a plurality of ball-pads arranged in a ball-pad array outside of the cap-zone, and a plurality of conductive lines coupling the contact elements to the ball-pads. The contact elements are electrically coupled to corresponding bond-pads on the microelectronic die, and the protective casing covers the cap-zone. The barrier on the surface of the substrate is configured so that at least a portion of the barrier is outside of the cap-zone and adjacent to at least a portion of the molded section. The barrier is a seal that inhibits the thermosetting material of the protective casing from covering a portion of the substrate outside of the cap-zone. As such, the barrier prevents thermosetting material from leaking between the substrate and a mold outside of the cap-zone during a molding process.
대표청구항▼
The invention claimed is: 1. A method of manufacturing a microelectronic device having a microelectronic die including an integrated circuit and a plurality of bond-pads coupled to the integrated circuit, comprising: coupling the die to an interconnecting unit, the interconnecting unit having a sub
The invention claimed is: 1. A method of manufacturing a microelectronic device having a microelectronic die including an integrated circuit and a plurality of bond-pads coupled to the integrated circuit, comprising: coupling the die to an interconnecting unit, the interconnecting unit having a substrate and a plurality of conductive features, the substrate having a first side and a second side, at least a set of the conductive features including a contact element, a conductive line connected to the contact element, and a ball-pad connected to the conductive line, the ball-pads being on the first side of the substrate, wherein the die is coupled to the interconnecting unit to electrically couple the bond-pads on the die with corresponding contact elements on the substrate, and wherein the contact elements define a cap-zone for encapsulation by a protective casing; encapsulating the die and the contact elements by engaging a first bearing surface of a first mold unit against the first side of the substrate, engaging a second bearing surface of a second mold unit against the second side of the substrate, positioning the die in the second mold unit, and injecting a molding compound into at least the second mold unit; and inhibiting the molding compound from leaking out of the cap-zone between the substrate and at least one of the first and second mold units by engaging a seal on the substrate with the one of the first and second mold units. 2. The method of claim 1 wherein: the seal comprises a thin film having an opening with edges bordering the cap-zone; and engaging the seal with at least one of the first and second mold units comprises contacting the one of the first and second mold units with the thin film. 3. The method of claim 1 wherein: the seal comprises a thin tape having an opening with edges bordering the cap-zone; and engaging the seal with at least one of the first and second mold units comprises contacting the one of the first and second mold units with the thin tape. 4. The method of claim 1 wherein: the seal comprises a polymeric coating having an opening with edges bordering the cap-zone; and engaging the seal with at least one of the first and second mold units comprises contacting the one of the first and second mold units with the polymeric coating. 5. The method of claim 1 wherein: the substrate has a die-side to which the die is attached, a wire-side, and a slot from the die-side to the wire-side, the contact elements being arranged in an array on the wire-side adjacent to an edge of the slot, the ball-pads being arranged on the wire-side spaced apart from the contact elements, the cap-zone having a boundary on the wire-side between the array of contact elements and the array of ball-pads, and the seal being a thin film applied to the wire-side of the substrate, wherein the thin film has an opening bordering the cap-zone; encapsulating the die and the contact elements comprises positioning the contact elements in a first cavity of the first mold unit, positioning the die in a second cavity of a second mold unit, injecting the molding compound into the second cavity, through a portion of the substrate, and into the first cavity to form a first protective casing over the contact elements and a second protective casing over the die; and engaging the seal with at least one of the first and second mold units comprises contacting the first mold unit with the thin film. 6. The method of claim 1 wherein: the substrate has a die-side to which the die is attached, a wire-side, and a slot from the die-side to the wire-side, the contact elements being arranged in an array on the wire-side adjacent to an edge of the slot, the ball-pads being arranged on the wire-side spaced apart from the contact elements, the cap-zone having a boundary on the wire-side between the array of contact elements and the array of ball-pads, and the seal being a thin tape applied to the wire-side of the substrate, wherein the thin tape has an opening bordering the cap-zone; encapsulating the die and the contact elements comprises positioning the contact elements in a first cavity of the first mold unit, positioning the die in a second cavity of a second mold unit, injecting the molding compound into the second cavity, through a portion of the substrate, and into the first cavity to form a first protective casing over the contact elements and a second protective casing over the die; and engaging the seal with at least one of the first and second mold units comprises contacting the first mold unit with the thin tape. 7. The method of claim 1 wherein: the substrate has a die-side to which the die is attached, a wire-side, and a slot from the die-side to the wire-side, the contact elements being arranged in an array on the wire-side adjacent to an edge of the slot, the ball-pads being arranged on the wire-side spaced apart from the contact elements, the cap-zone having a boundary on the wire-side between the array of contact elements and the array of ball-pads, and the seal being a polymeric coating applied to the wire-side of the substrate, wherein the polymeric coating has an opening bordering the cap-zone; encapsulating the die and the contact elements comprises positioning the contact elements in a first cavity of the first mold unit, positioning the die in a second cavity of a second mold unit, injecting the molding compound into the second cavity, through a portion of the substrate, and into the first cavity to form a first protective casing over the contact elements and a second protective casing over the die; and engaging the seal with at least one of the first and second mold units comprises contacting the first mold unit with the polymeric coating. 8. A method of manufacturing a microelectronic device, comprising: providing an unpackaged unit having a microelectronic die coupled to an interconnecting unit, the die having an integrated circuit and a plurality of bond-pads coupled to the integrated circuit, the interconnecting unit having a substrate, a plurality of contact elements, a plurality of conductive lines connected to corresponding contact elements, and a plurality of ball-pads connected to corresponding conductive lines, wherein the die is coupled to the interconnecting unit to electrically couple the bond-pads on the die with corresponding contact elements on the substrate, and wherein the contact elements define a cap-zone for encapsulation by a protective casing; engaging a first bearing surface of a first mold unit against a first side of the substrate; engaging a second bearing surface of a second mold unit against a second side of the substrate so that the die is received within the second mold unit; injecting a molding compound into at least the second mold unit; and sealing the cap-zone to inhibit the molding compound from leaking out of the cap-zone between the substrate and at least one of the first and second mold units by engaging a barrier on the substrate with the one of the first and second mold units. 9. A method of manufacturing an interconnecting unit for electrically coupling a microelectronic die having an integrated circuit to voltage sources and signal sources, the method comprising: forming a plurality of conductive features on a substrate, the plurality of conductive features having a plurality of contact elements arranged in a cap-zone, a plurality of conductive lines, and a plurality of ball-pads arranged in a ball-pad array outside of the cap-zone, wherein the conductive lines extends between corresponding contact elements and ball-pads, and wherein the cap-zone is configured to be covered by a protective casing; and fabricating a barrier on the substrate outside of the cap-zone so that at least a portion of the barrier is adjacent to a portion of the cap-zone, wherein the barrier covers at least one of the plurality of ball-pads. 10. The method of claim 9 wherein fabricating the barrier comprises disposing a thin film on the substrate to surround the cap-zone. 11. The method of claim 9 wherein fabricating the barrier comprises cutting an opening in a thin tape having a size configured to border the cap-zone and applying the tape to the substrate so that the opening surrounds the cap-zone. 12. The method of claim 9 wherein fabricating the barrier comprises coating the substrate with a polymeric material and forming an opening the polymeric material to border the cap-zone. 13. A method of manufacturing an interconnecting unit for electrically coupling a microelectronic die having an integrated circuit to voltage sources and signal sources, the method comprising: forming a plurality of conductive features on a substrate, the plurality of conductive features having a plurality of contact elements arranged in a cap-zone, a plurality of conductive lines, and a plurality of ball-pads arranged in a ball-pad array outside of the cap-zone, wherein the conductive lines extends between corresponding contact elements and ball-pads, and wherein the cap-zone is configured to be covered by a protective casing; and fabricating a removable raised seal on the substrate outside of the cap-zone so that at least a portion of the seal is adjacent to a portion of the cap-zone. 14. The method of claim 13 wherein fabricating the seal comprises disposing a thin film on the substrate to surround the cap-zone. 15. The method of claim 13 wherein fabricating the seal comprises cutting an opening in a thin tape having a size configured to border the cap-zone and applying the tape to the substrate so that the opening surrounds the cap-zone. 16. The method of claim 13 wherein fabricating the seal comprises coating the substrate with a polymeric material and forming an opening the polymeric material to border the cap-zone.
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