$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28F-007/00
출원번호 US-0698304 (2003-10-30)
발명자 / 주소
  • Goodson,Kenneth
  • Kenny,Thomas
  • Zhou,Peng
  • Upadhya,Girish
  • Munch,Mark
  • McMaster,Mark
  • Horn,James
출원인 / 주소
  • Cooligy, Inc.
대리인 / 주소
    Haverstock &
인용정보 피인용 횟수 : 85  인용 특허 : 212

초록

A method of controlling temperature of a heat source in contact with a heat exchanging surface of a heat exchanger, wherein the heat exchanging surface is substantially aligned along a plane. The method comprises channeling a first temperature fluid to the heat exchanging surface, wherein the first

대표청구항

What is claimed is: 1. A method of controlling temperature of a heat source in contact with a heat exchanging surface of a heat exchanger, wherein the heat exchanging surface is substantially aligned along a plane, the method comprising: a. channeling a selectable, non-uniform amount of a first tem

이 특허에 인용된 특허 (212)

  1. Haller Matthew Isaac ; Khuri-Yakub Butrus Thomas, Acoustic micropump.
  2. Soane David S. ; Soane Zoya M., Acrylic microchannels and their use in electrophoretic applications.
  3. Soane David S. ; Soane Zoya M. ; Hooper Herbert H. ; Amigo M. Goretty Alonso, Acrylic microchannels and their use in electrophoretic applications.
  4. Novotny, Shlomo; Dunn, John; Vogel, Marlin, Active temperature gradient reducer.
  5. Bartilson Bradley W. (Chippewa Falls WI), Air jet impingement on miniature pin-fin heat sinks for cooling electronic components.
  6. Porter Warren W. (Escondido CA), Apparatus and method for cooling an electronic device.
  7. McDunn Kevin J. (Lake in the Hills IL) Limper-Brenner Linda (Glenview IL) Press Minoo D. (Schaumburg IL), Apparatus and method for shielding an electronic module from electromagnetic radiation.
  8. Sanwo Ikuo J. (San Marcos CA) Flavin John (San Diego CA), Apparatus for containing and cooling an integrated circuit device having a thermally insulative positioning member.
  9. Messina Gaetano P. (Hopewell Junction NY) Brewster Robert A. (Poughkeepsie NY) Kara Theodore J. (Poughkeepsie NY) Song Seaho (Highland NY), Apparatus for cooling integrated circuit chips.
  10. Mittal Faquir C. (Audubon PA), Apparatus for cooling integrated circuit chips.
  11. Love David G. (Pleasanton CA) Moresco Larry L. (San Carlos CA) Horine David A. (Los Altos CA) Wang Wen-chou V. (Cupertino CA) Wheeler Richard L. (San Jose CA) Boucher Patricia R. (Mountain View CA) M, Apparatus for cooling semiconductor chips in multichip modules.
  12. Fahey Albert J. (Pleasant Valley NY) Messina Gaetano P. (Hopewell Junction NY) Pavelka John B. (Beacon NY) Sherif Raed A. (Pleasant Valley NY), Blind hole cold plate cooling system.
  13. DeBoer, Scott J.; Lee, Whonchee, Capacitor structures with recessed hemispherical grain silicon.
  14. West Steven J. ; Haber Carsten, Capillary electrophoretic separation system.
  15. Dereje Agonafer ; Richard C. Chu ; Michael J. Ellsworth, Jr. ; Robert E. Simons, Cavity plate and jet nozzle assemblies for use in cooling an electronic module, and methods of fabrication thereof.
  16. Hamilton Robin E. ; Fagan Thomas J. ; Kennedy Paul G. ; Woodward William S., Closed loop liquid cooling for semiconductor RF amplifier modules.
  17. Ciaccio Michael P. (Rockford IL), Cold plate for cooling electronics.
  18. Gruber Peter A. (Mohegan Lake NY) Zingher Arthur R. (White Plains NY), Compliant fluidic coolant hat.
  19. Chu, Richard C.; Ellsworth, Jr., Michael J.; Simons, Robert E., Conic-sectioned plate and jet nozzle assembly for use in cooling an electronic module, and methods of fabrication thereof.
  20. Lindner Friedrich (Stuttgart DEX), Container for a heat storage medium.
  21. Aid James D. (St. Petersburg FL), Container with tapered walls for heating or cooling fluids.
  22. Parce John Wallace ; Knapp Michael R. ; Chow Calvin Y. H. ; Bousse Luc, Controlled fluid transport in microfabricated polymeric substrates.
  23. Zingher Arthur R. (White Plains NY), Convection transfer system.
  24. Zingher Arthur R. (White Plains NY), Convection transfer system.
  25. Staskus Michael P. ; Haden James M., Cooler for removing heat from a heated region.
  26. Salmonson Richard B. ; Dravis Daniel John, Cooling approach for high power integrated circuits mounted on printed circuit boards.
  27. Becker Klaus,DEX ; Staiger Wolfgang,DEX ; Jung Matthias,DEX ; Heinemeyer Peter,DEX, Cooling body having lugs.
  28. Chu Richard C. (Poughkeepsie NY) Goth Gary F. (Pleasant Valley NY) Messina Gaetano P. (Hopewell Junction NY) Moran Kevin P. (Wappingers Falls NY) Zumbrunnen Michael L. (Poughkeepsie NY), Cooling by use of multiple parallel convective surfaces.
  29. Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Cooling computer systems.
  30. Hayong Yun KR; Geunbae Lim KR; Jung Hyun Lee KR; Yukeun Eugene Pak KR, Cooling device using capillary pumped loop.
  31. Sato, Kaoru; Fujiwara, Yasuhiro; Kamizuru, Shinobu; Tate, Sumio; Sugimoto, Kazuhiko, Cooling element and cooling apparatus using the same.
  32. Lopes William F. (Groton MA), Cooling header connection for a thyristor stack.
  33. Nakanishi Keiichirou (Kokubunji JPX) Yamada Minoru (Iruma JPX) Masaki Akira (Meguro JPX) Imai Kuninori (Shiroyama JPX) Chiba Katuaki (Kokubunji JPX), Cooling module for integrated circuit chips.
  34. Simon, Jonathan, Cooling of substrate-supported heat-generating components.
  35. Eastman, Dean E.; Eldridge, Jerome M.; Petersen, Kurt E.; Olive, Graham, Cooling system for VLSI circuit chips.
  36. Galyon George T. (Fishkill NY) Jordhamo George M. (Wappingers Falls NY) Moran Kevin P. (Wappingers Falls NY) Zumbrunnen Michael L. (Poughkeepsie NY), Cross-hatch flow distribution and applications thereof.
  37. Kevin W. Kelly ; Chad R. Harris ; Mircea S. Despa, Crossflow micro heat exchanger.
  38. Takahiro Daikoku JP; Junri Ichikawa JP; Atsuo Nishihara JP; Kenichi Kasai JP, Device and method for cooling multi-chip modules.
  39. Hallefalt Magnus,SEX, Device for casting in a mould.
  40. P. R. Patel ; Yuan-Liang Li ; David G. Figueroa ; Shamala Chickamenahalli ; Huong T. Do, Dual-socket interposer and method of fabrication therefor.
  41. Paul Phillip H. ; Rakestraw David J., Electokinetic high pressure hydraulic system.
  42. Chow Calvin Y. H. ; Kopf-Sill Anne R. ; Parce John Wallace, Electrical current for controlling fluid parameters in microchannels.
  43. Rakestraw David J. ; Anex Deon S. ; Yan Chao ; Dadoo Rajeev ; Zare Richard N., Electro-osmotically driven liquid delivery method and apparatus.
  44. Paul Phillip H. ; Rakestraw David J., Electrokinetic high pressure hydraulic system.
  45. Paul Phillip H. ; Rakestraw David J. ; Arnold Don W. ; Hencken Kenneth R. ; Schoeniger Joseph S. ; Neyer David W., Electrokinetic high pressure hydraulic system.
  46. Paul, Phillip H.; Rakestraw, David J.; Arnold, Don W.; Hencken, Kenneth R.; Schoeniger, Joseph S.; Neyer, David W., Electrokinetic high pressure hydraulic system.
  47. Joseph S. Schoeniger ; Phillip H. Paul ; Luke Schoeniger, Electrokinetically pumped high pressure sprays.
  48. Tozuka Tadao,JPX ; Suzuki Kozo,JPX, Electronic cooling apparatus.
  49. Chang Neng Chao,TWX, Electronic device cooling arrangement.
  50. Roesner Arlen L. ; Wagner Guy R. ; Babb Samuel M., Electronic device enclosure having electromagnetic energy containment and heat removal characteristics.
  51. Charles M. Newton ; Randy T. Pike ; Richard A. Gassman, Electronic device using evaporative micro-cooling and associated methods.
  52. Richard C. Chu ; Michael J. Ellsworth, Jr. ; Robert E. Simons, Electronic module with integral refrigerant evaporator assembly and control system therefore.
  53. Donald R. Moles, Electroosmotic flow controlled microfluidic devices.
  54. Cabuz Cleopatra, Electrostatically actuated mesopump having a plurality of elementary cells.
  55. Chu Richard C. (Poughkeepsie NY) Ellsworth ; Jr. Michael J. (Poughkeepsie NY) Goth Gary F. (Pleasant Valley NY) Simons Robert E. (Poughkeepsie NY) Zumbrunnen Michael L. (Poughkeepsie NY), Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels, and.
  56. Leland John E. (Beavercreek OH), Enhanced nucleate boiling heat transfer for electronic cooling and thermal energy transfer.
  57. Ogushi Tetsurou,JPX ; Murakami Masaaki,JPX ; Yao Akira,JPX ; Okamoto Takeshi,JPX ; Masumoto Hiromitsu,JPX ; Yamakage Hisaaki,JPX, Evaporator and loop-type heat pipe using the same.
  58. Cho, Hye-jung; Lee, Yong-Soo; Hong, Seog-woo; Song, In-seob, Evaporator of CPL cooling apparatus having fine wick structure.
  59. Cheon Kioan, Fanless cooling system for computer.
  60. Davies, Michael E.; Abels, Kenneth M. A.; Burgers, Johny G.; Gauguier, Sebastien R., Finned plate heat exchanger.
  61. Cho, Kyung-il; Cho, Hye-jung; Lee, Jae-yong; Song, In-seob, Flat evaporator.
  62. Cho, Kyung-il; Song, In-seob; Ha, Byeoung Ju; Son, Sang-young; Yun, Hayong; Kang, Sung-gyu, Flat evaporator.
  63. Reed Stuart E. (Homeworth OH) Tillman Robert W. (Alliance OH) Wahle Harold W. (North Canton OH), Flexible insert for heat pipe freeze protection.
  64. Liang, Chunlin; Mosley, Larry Eugene; Mu, Chun, Flip-chip on flex for high performance packaging applications.
  65. North Mark T. ; Rosenfeld John H. ; Muth David L. ; Fritsch Brian D. ; Schaeffer C. Scott, Fluid cooled single phase heat sink.
  66. Wilson ; Edward A. ; Fredenberg ; James D., Fluid cooling systems for electronic systems.
  67. Cannell, Michael J.; Cooley, Roger; Garman, Richard W.; Green, Geoffrey; Harrison, Peter N.; Walters, Joseph D., Fluid-cooled heat sink with turbulence-enhancing support pins.
  68. Herrell Dennis J. (Austin TX) Gibson David A. (Austin TX), Fluid-cooled integrated circuit package.
  69. Hawrylo, Frank Z., Flux-free photodetector bonding.
  70. Phillips Richard J. (Billerica MA) Glicksman Leon R. (Lynnfield MA) Larson Ralph (Bolton MA), Forced-convection, liquid-cooled, microchannel heat sinks.
  71. Matzke Carolyn M. ; Ashby Carol I. H. ; Bridges Monica M. ; Manginell Ronald P., Formation of microchannels from low-temperature plasma-deposited silicon oxynitride.
  72. Ernst Donald M. (Leola PA) Sanzi James L. (Lancaster PA), Freezable heat pipe.
  73. Eastman George Y. (Lancaster PA), Freeze accommodating heat pipe.
  74. Oberholzer Johannes-Ulrich,CAX ; Elzinga David,CAX ; MacLellan Ian,CAX ; Mather David W.,CAX, Freeze protection apparatus for fluid transport passages.
  75. Brannen Wiley W. (P.O. Box 253 Statesboro GA 30458), Freeze protection system for water pipes.
  76. Cray Seymour R. (Colorado Springs CO) Sherwood Gregory J. (Colorado Springs CO), Gas-liquid forced turbulence cooling.
  77. Ching-Bin Lin TW, Guidably-recirculated heat dissipating means for cooling central processing unit.
  78. Tien-Lai Wang TW, Heat dissipater for a central processing unit.
  79. Yamamoto Yoshiyuki,JPX ; Imai Takahiro,JPX, Heat dissipator including coolant passage and method of fabricating the same.
  80. Batchelder John Samuel, Heat exchange apparatus.
  81. Matthews James A. (Milpitas CA), Heat exchanger for solid-state electronic devices.
  82. Matthews James A. (Milpitas CA), Heat exchanger for solid-state electronic devices.
  83. Xie Hong, Heat pipe lid for electronic packages.
  84. Schlitt Reinhard (Bremen DEX), Heat pipe with a bubble trap.
  85. Pease Roger F. (Stanford CA) Tuckerman David B. (Stanford CA) Swanson Richard M. (Los Altos CA), Heat sink and method of attaching heat sink to a semiconductor integrated circuit and the like.
  86. Wargo Alec, Heat sink device for power semiconductors.
  87. Reichard Jeffrey A. (Menomonee Falls WI), Heat sink for electrical circuit components.
  88. William J. Miller ; Imran A. Bhutta, Heat sink for use in cooling an integrated circuit.
  89. Hsiao Chieh-Jen,TWX, Heat-dissipating apparatus for an integrated circuit device.
  90. Kiseev Valery M. (Sverdlovsk SUX) Maidanik Jury F. (Sverdlovsk SUX) Gerasimov Jury F. (Sverdlovsk SUX), Heat-transporting device.
  91. Yamada Minoru (Iruma JPX) Masaki Akira (Musashino JPX) Sato Kazuo (Tokyo JPX) Harada Yutaka (Tokyo JPX), High density integration of semiconductor circuit.
  92. Mohinder Singh Bhatti ; Shrikant M. Joshi ; Russell S. Johnson, High performance heat sink for electronics cooling.
  93. Turlik Iwona (Raleigh NC) Reisman Arnold (Raleigh NC) Nayak Deepak (Los Angeles CA) Hwang Lih-Tyng (Durham NC) Dishon Giora (Jerusalem NC ILX) Jacobs Scott L. (Apex NC) Darveaux Robert F. (Raleigh NC, High performance integrated circuit chip package.
  94. Fitch John S. (Newark CA), High performance substrate, electronic package and integrated circuit cooling process.
  95. Weber Robert J. (Boone IA), High power semiconductor device with integral heat sink.
  96. Oda Zenzo (Suwa JPX) Sakurada Noriaki (Suwa JPX), IC card with dual level power supply interface and method for operating the IC card.
  97. Messina Gaetano P. (Hopewell Junction NY), Integral cooling system for electric components.
  98. Ghosh Syamal K. ; Chatterjee Dilip K. ; Furlani Edward P., Integrated ceramic micro-chemical plant.
  99. Vogel Marlin R. ; Love David G., Integrated circuit device package and heat dissipation device.
  100. Tsai Ming-Jye,TWX ; Wan Yue-Min,TWX ; Ke Chun-Hsu,TWX ; Jang Ruei-Hung,TWX ; Wu Ching-Yi,TWX ; Huang Raey-Shing,TWX ; Peng Cheng-Jien,TWX, Integrated flow controller module.
  101. Wan Yue-Min,TWX ; Wu Ching-Yi,TWX, Integrated flow sensor.
  102. Lindberg Peter,SEX ; Roeraade Johan,SEX ; Stjernstrom M.ang.rten,SEX ; Viovy Jean Louis,FRX, Integrated microfluidic element.
  103. Chu Richard C. (Poughkeepsie NY) Ellsworth ; Jr. Michael J. (Poughkeepsie NY) Simons Robert E. (Poughkeepsie NY) Vader David T. (New Paltz NY), Intersecting flow network for a cold plate cooling system.
  104. Chu Richard C. ; Ellsworth ; Jr. Michael J. ; Simons Robert E., Isothermal heat sink with converging, diverging channels.
  105. Chu Richard C. ; Ellsworth ; Jr. Michael J. ; Simons Robert E., Isothermal heat sink with cross-flow openings between channels.
  106. Dereje Agonafer ; Richard C. Chu ; Michael J. Ellsworth, Jr. ; Robert E. Simons, Isothermal heat sink with tiered cooling channels.
  107. O\Neill Richard F. (Carlsbad CA) Whitesides Robert B. (Murrysville PA), Isothermal panel and plenum.
  108. Calaman, Douglas P.; Connors, Mathew J., Liquid cooled heat exchanger with enhanced flow.
  109. Frey Toni ; Stuck Alexander,CHX ; Zehringer Raymond,CHX, Liquid cooling device for a high-power semiconductor module.
  110. Davis Alan Merle (Quincy IL) Blickhan Joseph David (Quincy IL), Liquid cooling system for high power solid state AM transmitter.
  111. Rolfson J. B. (Boise ID) Starkweather Michael W. (Boise ID), Liquid filled hot plate for precise temperature control.
  112. Douglas P. Calaman ; Mathew J. Connors, Liquid-cooled heat sink with thermal jacket.
  113. Clark William E. (401 Hyder St. ; N.E. Palm Bay FL 32907), Liquid-cooled, flat plate heat exchanger.
  114. Mehta, Tammy Burd; Kopf-Sill, Anne R.; Parce, J. Wallace; Chow, Andrea W.; Bousse, Luc J.; Knapp, Michael R.; Nikiforov, Theo T.; Gallagher, Steve, Manipulation of microparticles in microfluidic systems.
  115. Lomolino ; Sr. Paul A. (Danville CA) Lomolino ; Jr. Paul A. (Tracy CA) Lean Grace A. (Livermore CA) Burns Patricia L. (San Jose CA), Method and apparatus for a self contained heat exchanger.
  116. Marja Liisa Alajoki ; H. Garrett Wada ; Robert S. Dubrow, Method and apparatus for continuous liquid flow in microscale channels using pressure injection, wicking, and electrokinetic injection.
  117. Bhatia Rakesh ; Padilla Robert D. ; Hermerding ; II James G., Method and apparatus for cooling integrated circuits using a thermoelectric module.
  118. Hildebrandt James J., Method and apparatus for increasing the power density of integrated circuit boards and their components.
  119. Pankove Jacques I. (Boulder CO), Method and apparatus for semiconductor circuit chip cooling.
  120. Tuckerman David B. (Stanford CA) Pease Roger F. W. (Stanford CA), Method and means for improved heat removal in compact semiconductor integrated circuits.
  121. Tuckerman David B. (Stanford CA) Pease Roger F. W. (Stanford CA), Method and means for improved heat removal in compact semiconductor integrated circuits and similar devices utilizing co.
  122. Chang, Kuo-Wei, Method and system for electrokinetic delivery of a substance.
  123. Fisher John M., Method for eliminating flow wrinkles in compression molded panels.
  124. Arnold Don W. ; Paul Phillip H. ; Schoeniger Joseph S., Method for eliminating gas blocking in electrokinetic pumping systems.
  125. Avto Tavkhelidze ; Larisa Koptonashvili ; Zauri Berishvili ; Givi Skhiladze, Method for making a diode device.
  126. Yu Conrad M. (Antioch CA) Hui Wing C. (Campbell CA), Method for making circular tubular channels with two silicon wafers.
  127. Forster Fred K. ; Bardell Ron L. ; Sharma Nigel R., Method for making micropumps.
  128. Schwiebert Matthew K. ; Campbell Donald T. ; Heydinger Matthew ; Kraft Robert E. ; Vander Plas Hubert A., Method of bumping substrates by contained paste deposition.
  129. Hamilton Robin E. ; Kennedy Paul G. ; Ostop John ; Baker Martin L. ; Arlow Gregory A. ; Golombeck John C. ; Fagan ; Jr. Thomas J., Method of extracting heat from a semiconductor body and forming microchannels therein.
  130. Matthews James A. (Milpitas CA), Method of fabricating a heat exchanger for solid-state electronic devices.
  131. Matthews James A. (Milpitas CA), Method of fabricating a heat exchanger for solid-state electronic devices.
  132. Layton Wilber Terry (San Diego CA) Morange Blanquita Ortega (San Diego CA) Torres Angela Marie (Vista CA) Roecker James Andrew (Escondido CA), Method of fabricating an integrated circuit package having a liquid metal-aluminum/copper joint.
  133. Hsu David S. Y. (Alexandria VA), Method of fabricating sub-half-micron trenches and holes.
  134. Bezama Raschid J. ; Casey Jon A. ; Pavelka John B. ; Pomerantz Glenn A., Method of forming a multilayer electronic packaging substrate with integral cooling channels.
  135. Leland John E. ; Ponnappan Rengasamy, Method of making micro channel heat pipe having corrugated fin elements.
  136. Hoopman Timothy L. (River Falls WI) Krinke Harlan L. (Marine WA), Method of making microchanneled heat exchangers utilizing sacrificial cores.
  137. Parce John Wallace ; Kopf-Sill Anne R., Methods and apparatus for in situ concentration and/or dilution of materials in microfluidic systems.
  138. Kopf-Sill Anne R., Methods and systems for monitoring and controlling fluid flow rates in microfluidic systems.
  139. Soane David S. ; Soane Zoya M. ; Hooper Herbert H. ; Amigo M. Goretty Alonso, Methods for fabricating enclosed microchannel structures.
  140. Dusablon ; Sr. Michael S. (Milton VT) White Eric J. (North Ferrisburg VT), Microcavity structures, fabrication processes, and applications thereof.
  141. Dusablon ; Sr. Michael S. (Milton VT) White Eric J. (North Ferrisburg VT), Microcavity structures, fabrication processes, and applications thereof.
  142. Bernhardt Anthony F. (Berkeley CA), Microchannel cooling of face down bonded chips.
  143. Hamilton Robin E. ; Kennedy Paul G. ; Ostop John ; Baker Martin L. ; Arlow Gregory A. ; Golombeck John C. ; Fagan ; Jr. Thomas J, Microchannel cooling of high power semiconductor devices.
  144. Hamilton Robin E. (Millersville MD) Kennedy Paul G. (Grasonville MD), Microchannel cooling using aviation fuels for airborne electronics.
  145. Swift Gregory W. (Los Alamos NM) Migliori Albert (Santa Fe NM) Wheatley John C. (Los Alamos NM), Microchannel crossflow fluid heat exchanger and method for its fabrication.
  146. Bonde Wayne L. (Livermore CA) Contolini Robert J. (Pleasanton CA), Microchannel heat sink assembly.
  147. Walpole James N. (Concord MA) Missaggia Leo J. (Milford MA), Microchannel heat sink with alternating flow directions.
  148. Drost Monte K. ; Wegeng Robert S. ; Friedrich Michele ; Hanna William T. ; Call Charles J. ; Kurath Dean E., Microcomponent assembly for efficient contacting of fluid.
  149. Fuesser Hans-Juergen,DEX ; Zachai Reinhard,DEX ; Muench Wolfram,DEX ; Gutheit Tim,DEX, Microcooling device and method of making it.
  150. Weld John David (Succasunna NJ), Microelectronic package with device cooling.
  151. Weinberg Marc S. (Needham MA), Microfabricated pump.
  152. Sundberg Steven A. ; Parce J. Wallace ; Chow Calvin Y. H., Microfabricated structures for facilitating fluid introduction into microfluidic devices.
  153. Arnold Don W. ; Schoeniger Joseph S. ; Cardinale Gregory F., Microfluidic channel fabrication method.
  154. Michael Knapp ; John Wallace Parce ; Luc J. Bousse ; Anne R. Kopf-Sill, Microfluidic devices and methods for separation.
  155. Nagle Robert ; Kennedy Colin B., Microfluidic devices and systems incorporating integrated optical elements.
  156. Dubrow Robert S. ; Kennedy Colin B. ; Bousse Luc J., Microfluidic devices incorporating improved channel geometries.
  157. Kopf-Sill Anne R. ; Parce John Wallace, Microfluidic systems incorporating varied channel dimensions.
  158. Lee Abraham P. ; Lemoff Asuncion V., Micromachined magnetohydrodynamic actuators and sensors.
  159. Hartley Frank T., Micromachined peristaltic pumps.
  160. Richter Axel (Mnchen DEX), Microminiaturized pump.
  161. Parce John Wallace, Micropump.
  162. Van Lintel Harald,CHX, Micropump.
  163. van Lintel Harald T. G. (Enschede NLX), Micropump with improved priming.
  164. Mundinger David C. ; Worland D. Philip, Modular microchannel heat exchanger.
  165. Benett William J. (Livermore CA) Beach Raymond J. (Livermore CA) Ciarlo Dino R. (Livermore CA), Monolithic microchannel heatsink.
  166. Tuchinskiy Ley J., Multi-channel structures and processes for making such structures.
  167. Loo Mike C. (San Jose CA) Vogel Marlin R. (Fremont CA), Multi-chip cooling module and method.
  168. Chow Calvin Y. H., Multi-layer microfluidic devices.
  169. Sakamoto Masafumi,JPX, Multi-phase permanent-magnet type electric rotating machine.
  170. Tauchi Hitoshi,JPX, Multi-stage electronic cooling device.
  171. Phillips, Fred A. L., Non-inverted meniscus loop heat pipe/capillary pumped loop evaporator.
  172. Hamilton Robin E. ; Kennedy Paul G. ; Vale Christopher R., Non-mechanical magnetic pump for liquid cooling.
  173. Frieser Rudolf G. (Poughkeepsie NY) Reeber Morton D. (Shrub Oak NY), Nucleate boiling surface for increasing the heat transfer from a silicon device to a liquid coolant.
  174. Zanzucchi Peter J. (Lawrenceville NJ) Cherukuri Satyam C. (Cranbury NJ) McBride Sterling E. (Lawrenceville NJ), Partitioned microelectronic and fluidic device array for clinical diagnostics and chemical synthesis.
  175. Zanzucchi Peter John ; Cherukuri Satyam Choudary ; McBride Sterling Edward ; Judd Amrit Kaur, Partitioned microelectronic device array.
  176. Kenny, Jr., Thomas William; Goodson, Kenneth E.; Santiago, Juan G.; Everett, Jr., George Carl, Power conditioning module.
  177. Barber, Vernon Alan; Obermaier, Hannsjorg; Patel, Chandrakant D., Power distribution in multi-chip modules.
  178. Bartilson Bradley W. (Chippewa Falls WI) Schlimme Elliot F. (Chippewa Falls WI), Printed circuit board with cooling monitoring system.
  179. Souriau Daniel (Paris FR), Process of and device for using the energy given off by a heat source.
  180. Sumberg Andrew J. (Arlington MA), Protection of heat pipes from freeze damage.
  181. Tam Andrew C. (Saratoga CA) Yeack-Scranton Celia E. (San Jose CA), Pulsed current resistive heating for bonding temperature critical components.
  182. Shlomo Novotny ; Arthur S. Rousmaniere ; Marlin Vogel, Refrigerant-cooled system and method for cooling electronic components.
  183. Paul D. Wohlfarth, Self-heating circuit board.
  184. Ching-Bin Lin TW, Self-recirculated heat dissipating means for cooling central processing unit.
  185. Ik Seong Park KR; In Soo Kang KR, Semiconductor chip package and fabrication method thereof.
  186. Beetz ; Jr. Charles P. ; Boerstler Robert W. ; Steinbeck John ; Winn David R., Silicon etching process for making microchannel plates.
  187. Pace Salvatore J. (Wilmington DE), Silicon semiconductor wafer for analyzing micronic biological samples.
  188. Andrus Lance ; Fraivillig James ; Barrett Edward ; High Brian, Solderable structures.
  189. Robert Michael Reese, Solid-state chip cooling by use of microchannel coolant flow.
  190. Galambos, Paul C.; Okandan, Murat; Montague, Stephen; Smith, James H.; Paul, Phillip H.; Krygowski, Thomas W.; Allen, James J.; Nichols, Christopher A.; Jakubczak, II, Jerome F., Surface-micromachined microfluidic devices.
  191. Bradley Susan J. (East Hampstead NH), System for bonding a heatsink to a semiconductor chip package.
  192. Zare Richard N. (Stanford CA) Huang Xiaohua (Mountain View CA) Ohms Jack I. (Palo Alto CA), System for measuring electrokinetic properties and for characterizing electrokinetic separations by monitoring current i.
  193. Bartilson Bradley W. (Chippewa Falls WI) Schlimme Elliot F. (Chippewa Falls WI), Temperature monitoring system for air-cooled electric components.
  194. Douglas P. Calaman, Thermal jacket for reducing condensation and method for making same.
  195. Sandhu Bal S. ; Reinhardt Dennis, Thermal sensing circuit.
  196. Hanrahan James R., Thermally conductive polytrafluoroethylene article.
  197. Charles M. Newton ; Carol A. Gamlen ; Raymond C. Rumpf, Jr., Thermally enhanced microcircuit package and method of forming same.
  198. Reyzin, Ilya; Bhatti, Mohinder Singh; Ghosh, Debashis; Joshi, Shrikant Mukund, Thermosiphon for electronics cooling with high performance boiling and condensing surfaces.
  199. Thomas Daniel Lee, Thin, planar heat spreader.
  200. Woodman John K. (601 Mystic La. Foster City CA 94404), Three dimensional integrated circuit package.
  201. Woodman John K. (601 Mystic La. Foster City CA 94404), Three dimensional integrated circuit package.
  202. Larson Ralph I. ; Phillips Richard L., Two phase component cooler.
  203. Kambiz Vafai ; Lu Zhu, Two-layered micro channel heat sink, devices and systems incorporating same.
  204. Puckett John Christopher, Two-phase constant-pressure closed-loop water cooling system for a heat producing device.
  205. Larson Ralph I. (Bolton MA) Phillips Richard L. (Alachua FL) Beane Alan F. (Gilford NH), Two-phase cooling system for laptop computers.
  206. Kaltenbach Patrick (Bischweier DEX) Swedberg Sally A. (Los Altos CA) Witt Klaus E. (Keltern DEX) Bek Fritz (Waldbronn DEX) Mittelstadt Laurie S. (Belmont CA), Use of temperature control devices in miniaturized planar column devices and miniaturized total analysis systems.
  207. Koubek Kevin J. (South Setauket NY) Kosson Robert L. (Massapequa NY) Quadrini John A. (Northport NY), Vapor chamber cooled electronic circuit card.
  208. Chow Calvin Y. H. ; Parce J. Wallace, Variable control of electroosmotic and/or electrophoretic forces within a fluid-containing structure via electrical forc.
  209. Chow Calvin Y. H. ; Parce J. Wallace, Variable control of electroosmotic and/or electrophoretic forces within a fluid-containing structure via electrical forc.
  210. Novotny, Shlomo; Rousmaniere, Arthur S.; Vogel, Marlin, Water-cooled system and method for cooling electronic components.
  211. Hamburgen William R. (Menlo Park CA) Fitch John S. (Newark CA), Wet micro-channel wafer chuck and cooling method.
  212. Cima Richard M. (Palo Alto CA), Wick assembly for self-regulated fluid management in a pumped two-phase heat transfer system.

이 특허를 인용한 특허 (85)

  1. Yu, Lei; Tetu, Lee G.; Videto, Brian D., Air treatment module.
  2. Des Champs, Nicholas H., Apparatus and method for equalizing hot fluid exit plane plate temperatures in heat exchangers.
  3. Yazawa,Kazuaki, Apparatus, method, and control program for cooling electronic devices.
  4. Datta, Madhav; McMaster, Mark, Bonded metal and ceramic plates for thermal management of optical and electronic devices.
  5. Brunschwiler, Thomas J.; Colgan, Evan G.; Knickerbocker, John U.; Michael, Bruno; Ong, Chin Lee; Tsang, Cornelia K., Chip stack structures that implement two-phase cooling with radial flow.
  6. Brunschwiler, Thomas J.; Colgan, Evan G.; Knickerbocker, John U.; Michael, Bruno; Ong, Chin Lee; Tsang, Cornelia K., Chip stack structures that implement two-phase cooling with radial flow.
  7. Brunschwiler, Thomas J.; Colgan, Evan G.; Knickerbocker, John U.; Michael, Bruno; Ong, Chin Lee; Tsang, Cornelia K., Chip stack structures that implement two-phase cooling with radial flow.
  8. Dede, Ercan Mehmet; Liu, Yan, Cold plate assemblies and power electronics modules.
  9. Lyon, Geoff Sean; Holden, Michael James, Computer cooling system with preferential cooling device selection.
  10. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled.
  11. Campbell,Levi A.; Chu,Richard C.; Ellsworth,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled.
  12. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Cooling apparatus for an electronics subsystem employing a coolant flow drive apparatus between coolant flow paths.
  13. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Cooling apparatus with discrete cold plates disposed between a module enclosure and electronics components to be cooled.
  14. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Cooling apparatus, cooled electronic module and methods of fabrication employing a manifold structure with interleaved coolant inlet and outlet passageways.
  15. Dede, Ercan Mehmet, Cooling apparatuses and electronics modules having branching microchannels.
  16. Dede, Ercan Mehmet; Liu, Yan, Cooling apparatuses and power electronics modules.
  17. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Cooling apparatuses with discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled.
  18. Joshi, Shailesh N., Cooling assemblies and power electronics modules having multiple-porosity structures.
  19. Nakamura, Naoaki, Cooling device and electronic apparatus.
  20. Kenny, Thomas W.; Munch, Mark; Zhou, Peng; Shook, James Gill; Goodson, Kenneth; Corbin, Dave; McMaster, Mark; Lovette, James, Cooling systems incorporating heat exchangers and thermoelectric layers.
  21. Correa, Adrian; Lin, Tien Chih (Eric); Hom, James; Shiomoto, Gregory; Chow, Norman; Leong, Brandon; Brewer, Richard Grant; Werner, Douglas E.; McMaster, Mark, Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door.
  22. Correa, Adrian; Lin, Tien-Chieh (Eric); Hom, James; Shiomoto, Gregory; Chow, Norman; Leong, Brandon; Brewer, Richard Grant; Werner, Douglas E.; McMaster, Mark, Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door.
  23. Kharazmi, Saeid, Electrical circuit component carrier.
  24. Koyama, Takahiro, Electronic component cooler.
  25. Weaver, Stanton Earl; De Bock, Hendrik Pieter Jacobus, Electronic device cooling with autonomous fluid routing and method of assembly.
  26. Arvelo, Amilcar R.; Campbell, Levi A.; Ellsworth, Jr., Michael J.; McKeever, Eric J., Fabricating multi-component electronic module with integral coolant-cooling.
  27. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Flow boiling heat sink with vapor venting and condensing.
  28. Lyon, Geoff Sean, Fluid heat exchange systems.
  29. Lyon, Geoff Sean, Fluid heat exchange systems.
  30. Lyon, Geoff Sean, Fluid heat exchanger configured to provide a split flow.
  31. Lyon, Geoff Sean, Fluid heat exchanger configured to provide a split flow.
  32. Wang, Chi-Chuan; Lin, Kuo-Wei, Heat conducting module.
  33. Hou, Fengze; Lin, Tingyu, Heat dissipation solution for advanced chip packages.
  34. Muley, Arun; Borghese, Joe; Williams, Michael, Heat exchanger fin containing notches.
  35. Dede, Ercan Mehmet; Liu, Yan, Heat exchanger fluid distribution manifolds and power electronics modules incorporating the same.
  36. Otoshi, Kota; Kono, Eiji; Toh, Keiji; Tanaka, Katsufumi; Furukawa, Yuichi; Yamauchi, Shinobu; Hoshino, Ryoichi; Wakabayashi, Nobuhiro; Nakagawa, Shintaro, Heat radiator and power module.
  37. Kubota, Jumpei, Heat receiving apparatus, cooling apparatus, and electronic apparatus.
  38. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Heat sink structure with a vapor-permeable membrane for two-phase cooling.
  39. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Heat sink structure with a vapor-permeable membrane for two-phase cooling.
  40. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Heat sink structure with a vapor-permeable membrane for two-phase cooling.
  41. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Heat sink structure with a vapor-permeable membrane for two-phase cooling.
  42. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Heat sink structure with a vapor-permeable membrane for two-phase cooling.
  43. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Heat sink structure with a vapor-permeable membrane for two-phase cooling.
  44. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Heat sink structure with a vapor-permeable membrane for two-phase cooling.
  45. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madusudan K.; Simons, Robert E., Heat sink structure with a vapor-permeable membrane for two-phase cooling.
  46. Hom, James; Upadhya, Girish; Werner, Douglas E.; Munch, Mark; Tsao, Paul; Conway, Bruce; Zhou, Peng; Brewer, Richard, Integrated liquid to air conduction module.
  47. Harris, Daniel W.; Ditri, John; Hahn, Joseph W.; McNulty, Michael K., Integration of chip level micro-fluidic cooling in chip packages for heat flux removal.
  48. Chainer, Timothy J.; Parida, Pritish R.; Schultz, Mark D., Interlayer chip cooling apparatus.
  49. Joshi, Shailesh N., Jet impingement cooling apparatuses having enhanced heat transfer assemblies.
  50. Dede, Ercan Mehmet, Jet impingement heat exchanger apparatuses and power electronics modules.
  51. Yao, Qizhou Matthew; Legge, Ryan J., Liquid cooling with parasitic phase-change pumps.
  52. Yao, Qizhou Matthew, MEMS based device for phase-change autonomous transport of heat (PATH).
  53. Altman, David H., Maintaining thermal uniformity in micro-channel cold plates with two-phase flows.
  54. Lyon, Geoff Sean; Holden, Mike; Gierl, Brydon, Manifolded heat exchangers and related systems.
  55. Price, Andrew R.; Kaina, Rachid; Garnett, Mark C., Method and structure for optimizing heat exchanger performance.
  56. Reeves, Matthew A.; Holland, Robert Scott; Loong, Sy-Jenq, Method of producing a liquid cooled coldplate.
  57. Loong, Sy-Jenq; Smith, Donald Lynn, Method of producing an enhanced base plate.
  58. Loong, Sy-Jenq; Smith, Donald Lynn, Method of producing electronics substrate with enhanced direct bonded metal.
  59. Brewer, Richard Grant; Chow, Norman; Hom, James, Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers.
  60. Bhatti,Mohinder Singh; Parisi,Mark Joseph; Hayes,Andrew R., Microchannel heat sink.
  61. Datta, Madhav; Leong, Brandon; McMaster, Mark, Microheat exchanger for laser diode cooling.
  62. Determan, Matthew; Lee, Scott W. C. H.; Siu Ho, Abel Manuel; Lee, Seri, Microscale cooling apparatus and method.
  63. Lyon, Geoff Sean; Holden, Mike; Gierl, Brydon, Modular heat-transfer systems.
  64. Arvelo, Amilcar R.; Campbell, Levi A.; Ellsworth, Jr., Michael J.; McKeever, Eric J., Multi-component electronic module with integral coolant-cooling.
  65. Arvelo, Amilcar R.; Campbell, Levi A.; Ellsworth, Jr., Michael J.; McKeever, Eric J., Multi-component electronic module with integral coolant-cooling.
  66. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Multi-element heat exchange assemblies and methods of fabrication for a cooling system.
  67. Upadhya, Girish; Herms, Richard; Zhou, Peng; Goodson, Kenneth; Hom, James, Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange.
  68. Dede, Ercan Mehmet, Power electronics card assemblies, power electronics modules, and power electronics devices.
  69. Dede, Ercan Mehmet, Power electronics modules and power electronics module assemblies.
  70. Abe, Hidefumi; Mayumi, Toshiro; Abe, Seiichiro, Semiconductor control device.
  71. Abe, Hidefumi; Abe, Seiichiro; Shiba, Toru; Yagi, Takuya; Mayumi, Toshiro, Semiconductor device.
  72. Crocker,Michael T.; Carter,Daniel P., Systems for integrated cold plate and heat spreader.
  73. Daly, John, Thermal management of photonics assemblies.
  74. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Thermostat-controlled coolant flow within a heat sink.
  75. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Thermostat-controlled coolant flow within a heat sink.
  76. Qu, Weilin, Two-phase cross-connected micro-channel heat sink.
  77. Avery, Randal N.; Booth, Charlie; Livingston, Wes; Lopp, Tom Watson, Utilization of data center waste heat for heat driven engine.
  78. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Valve controlled, node-level vapor condensation for two-phase heat sink(s).
  79. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Valve controlled, node-level vapor condensation for two-phase heat sink(s).
  80. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Valve controlled, node-level vapor condensation for two-phase heat sink(s).
  81. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madusudan K.; Simons, Robert E., Valve controlled, node-level vapor condensation for two-phase heat sink(s).
  82. Brunschwiler, Thomas J.; Linderman, Ryan J.; Michel, Bruno; Ruetsche, Erich M., Variable flow computer cooling system for a data center and method of operation.
  83. Brunschwiler, Thomas J.; Linderman, Ryan J.; Michel, Bruno; Ruetsche, Erich M., Variable flow computer cooling system for a data center and method of operation.
  84. Lei, Guangyin; Wang, Tienli; Jih, Edward Chan-Jiun; Degner, Michael W., Vehicle power module assemblies and manifolds.
  85. Rau, Matthew Joseph; Dede, Ercan Mehmet; Joshi, Shailesh N.; Garimella, Suresh V., Vehicles, power electronics modules and cooling apparatuses with single-phase and two-phase surface enhancement features.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로