초록 ▼

The invention generally relates to a system and method for integrated gas delivery and leak detection to one or more applications. The system includes at least one application site, a process conduit extending from a process gas source site to the application site, a first and second process flow c

The invention generally relates to a system and method for integrated gas delivery and leak detection to one or more applications. The system includes at least one application site, a process conduit extending from a process gas source site to the application site, a first and second process flow control at the process conduit, and a first pressure sensor. Also included in the system is a microprocessor that is in electronic communication with the flow controls and the first pressure sensor, wherein the microprocessor is programmed to respond to an application standby request by performing a pressure decay test, including closing the second process flow control and pressurizing a portion of the system by opening the first process flow control. Further included in the pressure test is closing the first process flow control when the pressure at the first pressure sensor is at a minimum pressure, and comparing an empirical pressure decay rate at the first pressure sensor with a maximum pressure decay rate, whereby an empirical pressure decay rate that exceeds the maximum pressure decay rate indicates the presence of a leak.

대표청구항 ▼

What is claimed is: 1. A system for integrated gas delivery and leak detection, comprising: a) at least one application site; b) a process conduit extending from a process gas source site to the application site; c) a first process flow control at the process conduit; d) a second process flow cont

What is claimed is: 1. A system for integrated gas delivery and leak detection, comprising: a) at least one application site; b) a process conduit extending from a process gas source site to the application site; c) a first process flow control at the process conduit; d) a second process flow control at the process conduit between the first process flow control and the application site; e) a first pressure sensor located at the process conduit between the first and second process flow controls; f) a microprocessor that is in electronic communication with the first and second process flow controls and the first pressure sensor, wherein the microprocessor is programmed to respond to an application standby request by performing a pressure decay test, including: closing the second process flow control; pressurizing a portion of the system by opening the first process flow control; and when the pressure at the first pressure sensor is at a minimum pressure, closing the first process flow control, and comparing an empirical pressure decay rate at the first pressure sensor with a maximum pressure decay rate, whereby an empirical pressure decay rate that exceeds the maximum pressure decay rate indicates the presence of a leak; whereby the amount of pressure decay is monitored using the equation P=nRT/V in which the pressure variation at the first pressure sensor due to temperature is calculated, wherein P=pressure, V=volume, n=moles gas, R=universal gas constant and T=absolute temperature; g) a purge conduit extending from a purge gas source site to the process conduit between the first and second process flow controls; and h) a first purge flow control located at the purge conduit; wherein: the purge flow control is in electronic communication with the microprocessor; the first pressure sensor is located at the purge conduit between the first purge flow control and the process conduit, or at the process conduit between the first and second process flow controls; and the pressure decay test includes: pressurizing a portion of the system by opening the first process flow control and closing the first purge flow control; or opening the first purge flow control and closing the first process flow control; and when the pressure at the first pressure sensor is at a minimum pressure, closing the first process and the first purge flow controls; thereby providing integrated gas delivery and leak detection. 2. The system of claim 1, wherein the microprocessor is further programmed to perform a pressurization test, including: pressurizing a portion of the system by: closing the second process and the first purge flow controls and opening the first process flow control; or closing the first and second process flow controls and opening the first purge flow control; and comparing a timeout value to elapsed time from the beginning of the pressurizing step to attainment of a stable empirical pressure at the first pressure sensor, whereby expiration of the timeout value before attainment of a stable empirical pressure at the first pressure sensor indicates the presence of a leak; and closing the first process flow control when the presence of a leak is indicated. 3. The system of claim 2, whereupon completing system initialization, the microprocessor is programmed to perform the pressurization test. 4. The system of claim 3, wherein the microprocessor is further programmed to respond to an application operation request by: directing process gas to the application by closing the first purge flow control and opening the first and second process flow controls; and performing a pressure variation test while process gas is directed to the application by comparing an empirical pressure variation at the first pressure sensor with a maximum pressure variation value, whereby an empirical pressure variation that exceeds the maximum pressure variation value indicates the presence of a leak. 5. The system of claim 4, further including a first vent flow control, wherein: the first vent flow control is in: electronic communication with the microprocessor; fluid communication with the process or the purge conduit; and the microprocessor is programmed to open the vent flow control upon indication of the presence of a leak. 6. The system of claim 5, further including: a third process flow control at the process conduit between the first process flow control and the purge conduit; a second pressure sensor located at the process conduit between the first and the third process flow controls, wherein the second pressure sensor is in electronic communication with the microprocessor; and wherein the first pressure sensor is located at the purge conduit between the first purge flow control and the process conduit, or at the process conduit between the second and the third process flow controls. 7. The system of claim 6, wherein the pressure decay test further includes closing the third process flow control. 8. The system of claim 7, wherein the pressure decay test further includes: closing the first process flow control when the pressure at the second pressure sensor is at a minimum pressure; and comparing an empirical pressure decay rate at the second pressure sensor with a maximum pressure decay rate, whereby an empirical pressure decay rate that exceeds the maximum pressure decay rate indicates the presence of a leak. 9. The system of claim 8, wherein the pressurization test further includes closing the third process flow control. 10. The system of claim 9, wherein the pressurization test further includes comparing a timeout value to the time elapsed from the beginning of the pressurizing step to attainment of a stable empirical pressure at the second pressure sensor, whereby expiration of the timeout value before attainment of a stable empirical pressure at the second pressure sensor indicates the presence of a leak. 11. The system of claim 10, further including: at least two said application sites; a process manifold located at the process conduit downstream of the first process flow control, whereby the process conduit extends separately to each said application site, wherein for each said application site one said third and one said second process flow control are located on the process conduit between the process manifold and the application site; wherein the first pressure sensor is located at the purge conduit between the first purge flow control and the process conduit; and the second pressure sensor is located upstream of the process manifold. 12. The system of claim 11, further including a purge manifold located at the purge conduit downstream of the first pressure sensor, wherein for each said application site: the purge conduit extends to the process conduit between the second and third process flow control; and further including a second purge flow control located on the purge conduit between the purge manifold and the process conduit. 13. The system of claim 12, wherein the pressure variation test further includes: independently for each said application site, closing the second purge flow control and opening the third process flow control; and comparing empirical pressure variation at the second pressure sensor with a maximum pressure variation value, whereby an empirical pressure variation at the second pressure sensor that exceeds the maximum pressure variation value indicates the presence of a leak. 14. The system of claim 13, wherein the microprocessor is programmed to independently respond to an application operation or application standby request for each of at least two said application sites. 15. The system of claim 14, further including at least one temperature sensor in electronic communication with the microprocessor, wherein: the temperature sensor is located at one said conduit; and the microprocessor is further programmed to: measure a gas temperature at the temperature sensor; and employ the gas temperature in calculating at least one value selected from a timeout value, a minimum pressure, a maximum pressure, a maximum pressure variation, and a maximum pressure decay rate. 16. The system of claim 15, further including a process gas detector, wherein: the detector is located external to the process conduit; the detector is in electronic communication with the microprocessor; and wherein the microprocessor is further programmed to compare an empirical process gas signal at the detector with a maximum process gas signal, whereby an empirical process gas signal at the detector that exceeds the maximum process gas signal indicates the presence of a leak. 17. The system of claim 16, further including: two additional pressure sensors in electronic communication with the microprocessor, including: a third pressure sensor at the process conduit between the process source and the first process flow control; a fourth pressure sensor at the process conduit between the first and third process flow controls; and whereupon sensing: a pressure at the third pressure sensor that is below a minimum pressure; or a pressure differential measured between two or more sensors selected from the second, third and fourth pressure sensors is greater than a maximum pressure differential; the microprocessor is programmed to close the first process flow control. 18. The system of claim 17, wherein at least one said pressure sensor employs a pair of pressure transducers in parallel, whereupon sensing a pressure differential between said transducers that is greater than a maximum pressure differential, the microprocessor is programmed to close the first process flow control. 19. The system of claim 18, wherein the microprocessor is in electronic communication with a ventilation system at said application sites, whereupon detecting that the ventilation system is inoperative, the microprocessor is programmed to close the first process flow control. 20. The system of claim 19, wherein the first process flow control, each said third process flow control, and the first purge flow control each employ a pair of direct lift pilot operated valves in series, whereupon detecting that at least one said valve is malfunctioning, the microprocessor is programmed to close the other said valve in said pair. 21. The system of claim 20, wherein each said third process flow control includes a check valve, whereby purge gas is excluded from each said third process flow control. 22. The system of claim 21, wherein the first vent flow control is in fluid communication with the process conduit between the process gas source site and the process manifold, further including a second vent flow control that is in fluid communication with the purge conduit between the purge gas source site and the purge manifold; and in electronic communication with the microprocessor; wherein the microprocessor is further programmed to open the second vent flow control when the presence of a leak is indicated. 23. A method for integrating leak detection in a gas delivery system, comprising the steps of: employing a gas delivery apparatus, comprising a process conduit extending from a process gas source site to at least one application site, at least two process flow controls, at least one pressure sensor, and a microprocessor; employing a microprocessor to control the apparatus to respond to an application standby request by performing a pressure decay test, comprising: closing a second process flow control; pressurizing a portion of the apparatus by opening a first process flow control, and closing the first process flow control when the pressure at a first pressure sensor is at a minimum pressure; and comparing an empirical pressure decay rate at a first pressure sensor with a maximum pressure decay rate, whereby an empirical pressure decay rate that exceeds the maximum pressure decay rate indicates the presence of a leak; whereby the amount of pressure decay is monitored using the equation P=nRT/V in which the pressure variation at the first pressure sensor due to temperature is calculated, wherein P=pressure, V=volume, n=moles gas, R=universal gas constant and T=absolute temperature; the apparatus further comprises a purge conduit extending from a purge gas source site to the process conduit, and at least one purge flow control; and the pressurizing step in the pressure decay test further comprises: opening the first process flow control and closing a first purge flow control; or opening the first purge flow control and closing the first process flow control; and closing the first process and the first purge flow controls when the pressure at the first pressure sensor is at a minimum pressure; thereby testing the gas delivery apparatus for leaks. 24. The method of claim 23, wherein the pressure decay test further includes: pressurizing a portion of the apparatus by: closing the second process and the first purge flow controls and opening the first process flow control; or closing the first and second process flow controls and opening the first purge flow control; and comparing a timeout value to elapsed time from the beginning of the pressurizing step to attainment of a stable empirical pressure at the first pressure sensor, whereby expiration of the timeout value before attainment of a stable empirical pressure at the first pressure sensor indicates the presence of a leak; and closing the first process flow control when the presence of a leak is indicated. 25. The method of claim 24, further including employing the microprocessor to perform the pressurization test upon completing system initialization. 26. The method of claim 25, further including employing the microprocessor to respond to an application operation request by: directing process gas to the application by closing the first purge flow control and opening the first and second process flow controls; and performing a pressure variation test while process gas is directed to the application by comparing an empirical pressure variation at the first pressure sensor with a maximum pressure variation, whereby an empirical pressure variation that exceeds the maximum pressure variation indicates the presence of a leak. 27. The method of claim 26, wherein the apparatus comprises at least one vent flow control, further including employing the microprocessor to open the vent flow control upon indication of the presence of a leak. 28. The method of claim 27, wherein the apparatus comprises a third process flow control and a second pressure sensor; further including employing the microprocessor to close the third process flow control during the pressure decay test. 29. The method of claim 28, wherein the pressure decay test further includes employing the microprocessor to: close the first process flow control when the pressure at the second pressure sensor is at a minimum pressure; and compare an empirical pressure decay rate at the second pressure sensor with a maximum pressure decay rate, whereby an empirical pressure decay rate that exceeds the maximum pressure decay rate indicates the presence of a leak. 30. The method of claim 29, further including employing the microprocessor to close the third process flow control during the pressurization test. 31. The method of claim 30, wherein the pressurization test further includes employing the microprocessor to compare a timeout value to the time elapsed from the beginning of the pressurizing step to attainment of a stable empirical pressure at the second pressure sensor, whereby expiration of the timeout value before attainment of a stable empirical pressure at the second pressure sensor indicates the presence of a leak. 32. The method of claim 31, wherein the apparatus further includes: at least two said application sites; and a process manifold located at the process conduit downstream of the first process flow control, whereby the process conduit extends separately to each said application site, wherein for each said application site one said third and one said second process flow control are located on the process conduit between the process manifold and the application site; wherein the first pressure sensor is located at the purge conduit between the first purge flow control and the process conduit; and the second pressure sensor is located upstream of the process manifold. 33. The method of claim 32, wherein the apparatus further includes a purge manifold located at the purge conduit downstream of the first pressure sensor, wherein for each said application site: the purge conduit extends to the process conduit between the second and third process flow controls; and further including a second purge flow control located on the purge conduit between the purge manifold and the process conduit. 34. The method of claim 33, wherein the pressure variation test further includes employing the microprocessor to: independently for each said application site, close the second purge flow control and open the third process flow control; and compare empirical pressure variation at the second pressure sensor with a maximum pressure variation, whereby an empirical pressure variation at the second pressure sensor that exceeds the maximum pressure variation indicates the presence of a leak. 35. The method of claim 34, further including employing the microprocessor to independently respond to an application operation or application standby request for each of at least two said application sites. 36. The method of claim 35, wherein the apparatus further includes at least one temperature sensor in electronic communication with the microprocessor, wherein the temperature sensor is located at one said conduit, and further including employing the microprocessor to: measure a gas temperature at the temperature sensor; and employ the gas temperature in calculating at least one value selected from a timeout value, a minimum pressure, a maximum pressure, a maximum pressure variation, and a maximum pressure decay rate. 37. The method of claim 36, wherein the apparatus further includes a process gas detector, wherein: the detector is located external to the process conduit; the detector is in electronic communication with the microprocessor; and further including employing the microprocessor to compare an empirical process gas signal at the detector with a maximum process gas signal, whereby an empirical process gas signal at the detector that exceeds the maximum process gas signal indicates the presence of a leak. 38. The method of claim 37, wherein the apparatus further comprises two additional pressure sensors, further including employing the microprocessor to close the first process flow control upon sensing: a pressure at the third pressure sensor that is below a minimum pressure; or a pressure differential measured between two or more sensors selected from the second, third and fourth pressure sensors is greater than a maximum pressure differential. 39. The method of claim 38, wherein at least one said pressure sensor employs a pair of pressure transducers in parallel, further including employing the microprocessor to close the first process flow control upon sensing a pressure differential between said transducers that is greater than a maximum pressure differential. 40. The method of claim 39, wherein the microprocessor is in electronic communication with a ventilation system at said application sites, further including employing the microprocessor to close the first process flow control upon detecting that the ventilation system is inoperative. 41. The method of claim 40, wherein the first process flow control, each said third process flow control, and the first purge flow control each employ a pair of direct lift pilot operated valves in series, further including employing the microprocessor, upon detecting that at least one said valve is malfunctioning, to close the other said valve in said pair. 42. A computer program product for integrating leak detection in a gas delivery apparatus, comprising a computer usable medium including computer readable code thereon, wherein the code comprises instructions for causing a microprocessor to perform a pressure decay test in response to an application standby request, including; closing a second process flow control; pressurizing a portion of the apparatus by: opening a first process flow control and closing a first purge flow control; or opening the first purge flow control and closing the first process flow control; and when the pressure at a first pressure sensor is at a minimum pressure, closing the first process and the first purge flow controls, and comparing an empirical pressure decay rate at the first pressure sensor with a maximum pressure decay rate, whereby an empirical pressure decay rate that exceeds the maximum pressure decay rate indicates the presence of a leak; and wherein the gas delivery apparatus comprises a process conduit extending from a process gas source site to at least one application site, the first and second process flow controls located at the process conduit, a purge conduit extending from a purge gas source site to the process conduit, the pressure sensor, and the microprocessor.