초록

Light system useful for activating light-activated materials are disclosed. Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and using them, and materials and structures usable therewith.

대표청구항 ▼

The invention claimed is: 1. A light for activating light-activated materials comprising: a wand adapted to be grasped by a human hand for use in positioning and manipulating the light, a wand housing that is at least a portion of the exterior surface of said wand, said wand housing having a top, a

The invention claimed is: 1. A light for activating light-activated materials comprising: a wand adapted to be grasped by a human hand for use in positioning and manipulating the light, a wand housing that is at least a portion of the exterior surface of said wand, said wand housing having a top, a bottom, a left side and a right side, an elongate heat sink located at least partially within said wand, said elongate heat sink having a proximal end, a distal end, and a longitudinal axis therebetween, a mounting platform on said elongate heat sink distal end, at least one semiconductor chip capable of emitting light of a wavelength that is useful in activating light-activated materials, said semiconductor chip being located on said mounting platform at said elongate heat sink distal end, said mounting platform being oriented so that light emitted directly in front of said chip travels at an angle of 30 to 150 degrees with respect to said longitudinal axis, a cover for covering said chip, said cover being made at least in part from a material that permits light emitted by said chip to pass through said cover to travel to a light-activated material, a plurality of air vents on said housing, a plurality of insulators located between said heat sink and said wand housing, an air jacket located between said heat sink and said housing, said air jacket being maintained by said insulators keeping said housing spaced apart from said elongate heat sink, said air jacket at least partially surrounding said heat sink, said air jacket permitting air circulation, ventilation and heat dissipation in order to manage heat given off by said chip, said circulation occurring by air entering an air vent, passing through said air jacket where said air picks up heat from said elongate heat sink, and said air departing through an air vent to the exterior of said housing in order to dissipate heat from said elongate heat sink. 2. A curing light as recited in claim 1 further comprising a fan that draws air into said housing from the exterior of said housing through a vent, forces said air through said air jacket and past said elongate heat sink where said air picks up heat from said elongate heat sink, and then out of said housing through a vent in order to dissipate heat. 3. A light for activating light-activated materials comprising: a housing, a plurality of air vents on said housing, a semiconductor chip capable of emitting light useful in activating a light-activated material, a primary heat sink, said primary heat sink having a longitudinal axis, a mounting platform on said elongate heat sink, said semiconductor chip being attached to said mounting platform on primary heat sink, said mounting platform being oriented so that light emitted directly in front of said chip travels at an angle of 30 to 150 degrees with respect to said longitudinal axis, a secondary heat sink capable of assisting in heat dissipation, said secondary heat sink being located at least partially within said housing, a plurality of insulators located between said secondary heat sink and said housing, said insulators serving to form a gap between said secondary heat sink and said housing, said gap forming an air jacket that at least partially surrounds said secondary heat sink, said air jacket being maintained by said insulators keeping said housing spaced apart from said secondary heat sink, said air jacket serving to mitigate against conductance of heat from said secondary heat sink to said housing, air located in said air jacket, said air located in said air jacket assisting in heat dissipation by entering said housing through a vent, passing by said secondary heat sink in said air jacket and thereby picking up heat from said elongate heat sink, thence exiting said housing to dissipate heat. 4. A curing light as recited in claim 3 wherein a material of at least one of said insulators is selected from the group consisting of rubber, silicone and plastic. 5. A curing light as recited in claim 3 further comprising a fan which tends to draw air from outside said housing through a vent on said housing into said air jacket where said air can pick up heat from said secondary heat sink, said fan then moving said air out of a vent on said housing to the exterior of said housing to achieve heat dissipation. 6. A light for activating light-activated materials as recited in claim 3 wherein the mass of said secondary heat sink is greater than the mass of said primary heat sink. 7. A light for activating light-activated materials comprising: a housing having a top, a bottom, a left side and a right side, a plurality of air vents on said housing, a light emission control actuator which when actuated causes light to be emitted from the light for activating light-activated materials, said light emission control actuator being located on one of said housing left side and said housing right side, a secondary heat sink capable of assisting in heat dissipation, a primary heat sink attached to said secondary heat sink, said primary heat sink having a longitudinal axis, a mounting platform on said primary heat sink, a semiconductor chip capable of emitting light useful in activating light-activated materials materials, said chip being mounted to said primary heat sink at said mounting platform, said mounting platform being oriented so that light emitted directly in front of said chip travels at an angle of 30 to 150 degrees with respect to said longitudinal axis, at least one insulator located between said secondary heat sink and said housing, an air jacket formed by a space between said secondary heat sink and said housing, said air jacket being maintained by said insulators keeping said housing spaced apart from said secondary heat sink, said air jacket serving to avoid conductance of heat to said housing, said air located in said air jacket assisting in heat dissipation by entering said housing through a vent, passing by said secondary heat sink in said air jacket and thereby picking up heat from said elongate heat sink, thence exiting said housing to dissipate heat a fan which tends to draw air from outside said housing through a vent on said housing into said air jacket where said air can pick up heat from said secondary heat sink, said fan then moving said air out of a vent on said housing to the exterior of said housing to achieve heat dissipation, and a thermoelectric cooler located on said secondary heat sink, said thermoelectric cooler serving to assist in heat dissipation, said fan also serving to move air past said thermoelectric cooler to aid in heat dissipation. 8. A curing light as recited in claim 7 wherein at least one of said insulators includes a material that is selected from the group consisting of rubber, silicone and plastic. 9. A light for activating light-activated materials as recited in claim 7 wherein the mass of said secondary heat sink is greater than the mass of said primary heat sink. 10. A light for activating light-activated materials as recited in claim 7 wherein said chip is selected from the group consisting of light emitting diode chips, laser chips, light emitting diode chip array, diode laser chips, diode laser chip array, surface emitting laser chips, edge emitting laser chips, and VCSEL chips. 11. A light for activating light-activated materials as recited in claim 7 further comprising a dome over said chip.