초록 ▼

An improved two-step replication process for fabrication of porous metallic membranes is provided. A negative of a porous non-metallic template is made by infiltration of a liquid precursor into the template, curing the precursor to form a solid negative, and removing the template to expose the nega

An improved two-step replication process for fabrication of porous metallic membranes is provided. A negative of a porous non-metallic template is made by infiltration of a liquid precursor into the template, curing the precursor to form a solid negative, and removing the template to expose the negative. Metal is deposited to surround the exposed negative. Removal of the negative provides a porous metallic membrane having pores which replicate the pores of the original template membrane. The negative is kept immersed in a liquid at all times between removing the template and depositing the metal. This immersion eliminates damage to the negative that would be incurred in drying the negative out between these processing steps. Another aspect of the invention is metallic membranes prepared according to the preceding method. For example, metallic membranes having pores smaller on one side than on the other side of the membrane are provided.

대표청구항 ▼

The invention claimed is: 1. A method of fabricating a metallic membrane, the method comprising: a) providing a porous non-metallic template membrane having opposing first and second surfaces; b) first depositing a first metal layer on the first surface such that pores on the first surface are not

The invention claimed is: 1. A method of fabricating a metallic membrane, the method comprising: a) providing a porous non-metallic template membrane having opposing first and second surfaces; b) first depositing a first metal layer on the first surface such that pores on the first surface are not blocked by the first metal layer; c) providing a polymer negative to the template membrane and affixed to the first metal layer, wherein said polymer negative fills pores in said template membrane, thereby having a configuration that is a negative of said template membrane; d) removing the non-metallic template membrane to expose pore-filling parts of the polymer negative; e) second depositing a second metal onto the first metal layer such that the second metal makes contact with the pore-filling parts of the polymer negative, wherein the polymer negative is kept immersed in a liquid at all times between the removing the non-metallic template membrane and the depositing a second metal; and f) removing the polymer negative. 2. The method of claim 1: wherein the non-metallic template membrane comprises a first region including the first surface and a second region including the second surface; wherein the first region has a first pore size and the second region has a second pore size; wherein the second pore size is greater than the first pore size. 3. The method of claim 1, wherein said non-metallic template membrane comprises alumina or silicon. 4. The method of claim 1, wherein said first depositing comprises depositing two or more different metallic compositions. 5. The method of claim 1, wherein said first depositing comprises depositing about 30 nm to about 40 nm of Pt. 6. The method of claim 1, wherein said first depositing comprises RF sputtering of Pt for about 30 to 40 seconds at a deposition rate of about 1 nm/s. 7. The method of claim 1, wherein said providing a polymer negative comprises: filling space in said template membrane with a liquid polymer precursor; and curing the polymer precursor to provide said polymer negative. 8. The method of claim 7, wherein said polymer precursor is selected from the group consisting of methyl-methacrylate (MMA), and mixtures of MMA and poly-MMA. 9. The method of claim 7, wherein said curing comprises thermal curing or exposing said polymer precursor to ultraviolet radiation in a nitrogen ambient. 10. The method of claim 1, wherein said removing the non-metallic template membrane comprises dissolving the template membrane in an etchant, wherein said etchant is a basic solution. 11. The method of claim 1, wherein said second depositing comprises electroplating. 12. The method of claim 1, wherein said second depositing comprises depositing two or more different metallic compositions. 13. The method of claim 1, wherein said removing the polymer negative comprises dissolving the polymer negative in a solvent selected from the group consisting of acetone, toluene, methyl ethyl ketone, formaldehyde, and mixtures thereof. 14. The method of claim 1, further comprising third depositing a gas or ion species selective membrane on said first surface. 15. The method of claim 14, wherein said third depositing comprises a method selected from the group consisting of: atomic layer deposition; pulsed laser deposition; sputtering of a metal followed by oxidizing the sputtered metal; RF sputtering of a metal oxide; and sputtering of a metal.