초록 ▼

A transfer molding arrangement for encapsulating a substrate with an encapsulating material comprising a bottom mold and a top mold, wherein a space is provided between the top mold and bottom mold for receiving the substrate, and the top mold and/or the bottom mold is/are arranged in such a way tha

A transfer molding arrangement for encapsulating a substrate with an encapsulating material comprising a bottom mold and a top mold, wherein a space is provided between the top mold and bottom mold for receiving the substrate, and the top mold and/or the bottom mold is/are arranged in such a way that when a clamping force is applied sufficiently strong, the top mold and bottom mold are abutted against each other, thereby distributing the force exerted on the substrate to the top mold and bottom mold.

대표청구항 ▼

The invention claimed is: 1. A transfer mold for encapsulating a substrate with an encapsulating material comprising: a bottom mold; a top mold, wherein a space provided between the top mold and bottom mold receives the substrate; and the top mold and the bottom mold abutted against each other in t

The invention claimed is: 1. A transfer mold for encapsulating a substrate with an encapsulating material comprising: a bottom mold; a top mold, wherein a space provided between the top mold and bottom mold receives the substrate; and the top mold and the bottom mold abutted against each other in the presence of a clamping force, thereby distributing the force exerted on the substrate to the top mold and bottom mold, wherein the bottom mold comprises a recess for receiving the substrate, thereby providing the space between the top mold and bottom mold, and wherein the recess is a channel which extends across the bottom mold. 2. The transfer molding arrangement according to claim 1 wherein the recess has the shape of a rectangular cavity. 3. A transfer mold comprising: a top mold including a cavity in communication with a reservoir; said reservoir for delivering encapsulating material to said cavity, said top mold further including air vents in said cavity; and a bottom mold having a shape of a channel extending along a length of said bottom mold, the length of said channel greater than a corresponding dimension of said cavity of said top mold, wherein said top and bottom molds define a space for receiving a substrate, and wherein said top and bottom molds are operable to exert maximum force upon said volume when said molds abut each other during a clamping operation. 4. The transfer mold of claim 3 wherein said bottom mold is interchangeable for use with a plurality of substrates with different lengths and widths. 5. The transfer mold of claim 3 wherein said top mold and said bottom mold define a plurality of additional spaces for receiving a plurality of substrates during a molding operation. 6. The transfer mold of claim 3 wherein said space for receiving said substrate is shallower than the thickness of said substrate, such that said clamping operation compresses said substrate. 7. The transfer mold of claim 3 wherein said channel extends across the length of said mold. 8. A transfer mold for encapsulating a substrate with an encapsulating material comprising: a bottom mold; a top mold, wherein a space provided between the top mold and bottom mold receives the substrate; and the top mold and the bottom mold abutted against each other in the presence of a clamping force, thereby distributing the force exerted on the substrate to the top mold and bottom mold, wherein said top mold has a stepped cavity comprising: a first region receiving an encapsulating material; a second region receiving the substrate; and at least one opening for injecting said encapsulating material into said first region of the stepped cavity when the substrate is received in said second region. 9. The transfer mold of claim 1, wherein said space is shallower than the thickness of said substrate. 10. The transfer mold of claim 1 further comprising an injecting unit for injecting an said encapsulating material into a cavity in the top mold through said at least one opening of the top mold. 11. The transfer mold of claim 10 further comprising a curing unit for curing the encapsulating material, thereby encapsulating said substrate.