초록 ▼

A cooling system in which an electronic device or other component is cooled by using one or more solid sources of liquid vapor (such as polymeric absorbents, hydrates or desiccants that desorb water at comparatively low temperature) in conjunction with one or more high-temperature vapor sorbents or

A cooling system in which an electronic device or other component is cooled by using one or more solid sources of liquid vapor (such as polymeric absorbents, hydrates or desiccants that desorb water at comparatively low temperature) in conjunction with one or more high-temperature vapor sorbents or desiccants that effectively transfer heat from the component to the fluid in the wellbore. Depending on the wellbore temperature, desiccants are provided that release water at various high regeneration temperatures such as molecular sieve (220-250째 C.), potassium carbonate (300째 C.), magnesium oxide (800째 C.) and calcium oxide (1000째 C.). A solid water source is provided using a water-absorbent polymer, such as sodium polyacrylate. Heat transfer is controlled in part by a check valve selected to release water vapor at a selected vapor pressure.

대표청구항 ▼

What is claimed is: 1. A sorption heating apparatus for use in a downhole tool comprising: a solid source of liquid associated with a first region within the tool; a sorbent located in a second region of the tool; and a passage between the first region and the second region for enabling liquid vapo

What is claimed is: 1. A sorption heating apparatus for use in a downhole tool comprising: a solid source of liquid associated with a first region within the tool; a sorbent located in a second region of the tool; and a passage between the first region and the second region for enabling liquid vapor released from the solid source of liquid to pass from the first region to the second region and a sorbent for sorbing the liquid vapor thus removing heat from first region. 2. The apparatus of claim 1 further comprising: a check valve located between the first region and the second region for controlling a rate of water vapor production. 3. The apparatus of claim 2 wherein the check valve opens at a pre-selected vapor pressure facilitating water vapor production in the first region. 4. The apparatus of claim 2 wherein the check valve comprises a pressure-sensitive device which facilitates water vapor production when a selected temperature is exceeded. 5. The apparatus of claim 1 wherein the electronics are adjacent to a source of water and both are surrounded by a phase change material. 6. The apparatus of claim 1 further comprising: a thermal coupler associated with the solid source of liquid for distributing heat within it to facilitate release of liquid vapor from the it. 7. The apparatus of claim 1, wherein electronics are adjacent to the solid source of liquid and both the electronics and solid source of liquid are substantially thermally insulated. 8. The apparatus of claim 1 further comprising: a thermally conductive material positioned between a device to be cooled and the first desiccant to facilitate thermal coupling between the device and the solid source of liquid. 9. The apparatus of claim 1 wherein the second region is in thermal communication with a tool housing. 10. A method for heating a region in a down hole tool deployed on a wire line tool or a drill stem comprising: releasing vapor from a solid source of liquid positioned in a first region within a down hole tool; providing a second desiccant located in a second region of the tool; sorbing the vapor through a vapor passage between first region and the second region, thereby enabling water vapor generated in the first region to pass from the first region through the vapor passage to the second region, thereby transferring heat from the first region to the second region. 11. The method of claim 10 further comprising: controlling a rate of water vapor production with a check valve located between the first region and the second region. 12. The method of claim 11 further comprising: opening the check valve at a pre-selected vapor pressure facilitating water vapor production in the first region. 13. The method of claim 11, wherein the check valve comprises a pressure-sensitive device which facilitates water vapor production when a selected temperature is exceeded. 14. The method of claim 10, further comprising: substantially surrounding wherein the electronics are adjacent to a source of water and both are surrounded by a phase change material. 15. The method of claim 10 further comprising: distributing heat with a thermal coupler associated with the solid source of liquid to facilitate release of water from it. 16. The method of claim 10, further comprising: thermally insulating the electronics and the solid source of liquid. 17. The method of claim 10 further comprising: positioning a thermally conductive material positioned between a device to be cooled and the solid source of liquid to facilitate thermal coupling between the device and the first desiccant. 18. The method of claim 10 further comprising: positioning the second region in thermal communication with a tool housing. 19. A system for providing sorption cooling apparatus for use in a downhole tool comprising: a surface controller for deploying a down hole tool; a solid source of liquid containing liquid associated with a first region within the tool; a sorbent located in a second region of the tool; and a passage between the first region and the second region for enabling liquid vapor released from the solid source of liquid to pass from the first region to the second region and the sorbent for removing heat from first region. 20. The system of claim 19 further comprising: a check valve located between the first region and the second region for controlling a rate of water vapor production.