초록 ▼

A printed wiring board including solder pads excellent in frequency characteristic is provided. To do so, each solder pad 73 is formed by providing a single tin layer 74 on a conductor circuit 158 or a via 160. Therefore, a signal propagation rate can be increased, as compared with a printed wiring

A printed wiring board including solder pads excellent in frequency characteristic is provided. To do so, each solder pad 73 is formed by providing a single tin layer 74 on a conductor circuit 158 or a via 160. Therefore, a signal propagation rate can be increased, as compared with a printed wiring board of the prior art on which two metal layers are formed. In addition, due to lack of nickel layers, manufacturing cost can be decreased and electric characteristics can be enhanced.

대표청구항 ▼

The invention claimed is: 1. A printed wiring board manufacturing method for providing a single noble metal layer on a conductor circuit of a printed wiring board, said conductor circuit comprising copper and being exposed through an opening of an organic resin insulating layer to form a solder pad

The invention claimed is: 1. A printed wiring board manufacturing method for providing a single noble metal layer on a conductor circuit of a printed wiring board, said conductor circuit comprising copper and being exposed through an opening of an organic resin insulating layer to form a solder pad, the printed wiring board manufacturing method comprising: immersing the printed wiring board having said conductor circuit exposed from the organic resin insulating layer in an etchant of one of sulfuric acid--hydrogen peroxide, cuprous chloride and ferrous chloride, so as to etch said conductor circuit exposed from the organic resin insulating layer; activating said conductor circuit using acid so as to eliminate an oxide film of the conductor circuit exposed from the organic resin insulating layer; and providing said single noble metal layer on said conductor circuit by noble metal substitutional plating. 2. The printed wiring board manufacturing method according to claim 1, wherein noble metal constituting said single noble metal layer is soft gold. 3. A printed wiring board manufacturing method for providing a single noble metal layer on a conductor circuit of a printed wiring board, said conductor circuit comprising copper and being exposed through an opening of an organic resin insulating layer to form a BGA (ball grid array) comprising of a solder bump, the printed wiring board manufacturing method comprising: immersing the printed wiring board having said conductor circuit exposed from the organic resin insulating layer in an etchant of one of sulfuric acid--hydrogen peroxide, cuprous chloride and ferrous chloride, so as to etch said conductor circuit exposed from the organic resin insulating layer; activating said conductor circuit using acid so as to eliminate an oxide film of said conductor circuit exposed from the organic resin insulating layer; and providing said single noble metal layer on said conductor circuit by noble metal substitutional plating. 4. The printed wiring board manufacturing method according to claim 3, wherein noble metal constituting said single noble metal layer is soft gold. 5. A printed wiring board manufacturing method for providing a single noble metal layer on a conductor circuit of a printed wiring board, said conductor circuit comprising copper and being exposed through an opening of an organic resin insulating layer to attach a conductive connection pin with a conductive adhesive intervening, the printed wiring board manufacturing method comprising: immersing the printed wiring board having said conductor circuit exposed from the organic resin insulating layer in an etchant of one of sulfuric acid--hydrogen peroxide, cuprous chloride and ferrous chloride, so as to etch said conductor circuit exposed from the organic resin insulating layer; activating said conductor circuit using acid; and providing said single noble metal layer on said conductor circuit by noble metal substitutional plating. 6. The printed wiring board manufacturing method according to claim 5, wherein noble metal constituting said single noble metal layer is soft gold.