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Cooling of electronics by electrically conducting fluids

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28D-015/00
출원번호 US-0768767 (2004-01-30)
발명자 / 주소
  • Ghoshal,Uttam
  • Miner,Andrew Carl
출원인 / 주소
  • NanoCoolers, Inc.
대리인 / 주소
    Zagorin O'Brien Graham LLP
인용정보 피인용 횟수 : 40  인용 특허 : 31

초록

Apparatus to provide effective removal of heat from a high power density device. The apparatus has a heat spreader and a heat sink structure. The heat spreader is divided into one or more chambers. Electromagnetic pumps are placed inside each chamber in a configuration that facilitates easy circul

대표청구항

What is claimed is: 1. A heat spreader for spreading heat generated by high power density devices, the heat spreader comprising: a. at least one cooling chamber containing liquid metal, the at least one cooling chamber allowing the liquid metal to come in direct contact with the high power density

이 특허에 인용된 특허 (31)

  1. Uttam Shyamalindu Ghoshal, Apparatus for dense chip packaging using heat pipes and thermoelectric coolers.
  2. Fox Leslie R. (Boxborough MA), Apparatus for packaging and cooling integrated circuit chips.
  3. Ono Izumi (Hachioji JPX), Cooling device attached to each surface of electronic parts on a printed-wiring board.
  4. Ghoshal, Uttam; Miner, Andrew Carl, Cooling of electronics by electrically conducting fluids.
  5. Ghoshal, Uttam; Miner, Andrew Carl, Cooling of high power density devices by electrically conducting fluids.
  6. Fenton ; John William ; Lee ; Jerry Stevenson ; Buist ; Richard James, Counter-flow thermoelectric heat pump with discrete sections.
  7. Stone, Paul R.; Strand, David E.; Nelson, Paul E., Determinant passively-located pogo machine.
  8. Bell, Lon E., Efficiency thermoelectrics utilizing convective heat flow.
  9. Ghoshal Uttam Shyamalindu, Electrically-isolated ultra-thin substrates for thermoelectric coolers.
  10. Davidson Daniel F. (Altrincham GB2), Electromagnetic pumps.
  11. Ghoshal Uttam Shyamalindu, Enhanced duty cycle design for micro thermoelectromechanical coolers.
  12. da Silva, Elson Dias, Fluid conduction utilizing a reversible unsaturated siphon with tubarc porosity action.
  13. Batchelder John Samuel, Heat exchange apparatus.
  14. Havey Mort L. ; Hitch William Robert, Heat spreader system for cooling heat generating components.
  15. Batchelder John Samuel, Heat transfer apparatus.
  16. Ghoshal Uttam Shyamalindu, Highly reliable thermoelectric cooling apparatus and method.
  17. Ghoshal, Uttam Shyamalindu, Integrated quantum cold point coolers.
  18. Diaz Rodolfo E., Method and apparatus for an electromagnetic propulsion system.
  19. Ghoshal Uttam Shyamalindu, Method and apparatus for cooling GMR heads for magnetic hard disks.
  20. Cordes, Michael James; Cordes, Steven Alan; Ghoshal, Uttam Shyamalindu; Robinson, Errol Wayne; Speidell, James Louis, Method and apparatus for thermal management of integrated circuits.
  21. Cooper, Emanuel Israel; Cordes, Steven Alan; DiMilia, David R.; Doris, Bruce Bennett; Doyle, James Patrick; Ghoshal, Uttam Shyamalindu; Wanner, Robin Altman, Method and system for forming a thermoelement for a thermoelectric cooler.
  22. Uttam Shyamalindu Ghoshal, Multi-stage thermoelectric microcoolers for cooling write coils and GMR sensors in magnetic heads for disk drives.
  23. Ghoshal Uttam Shyamalindu, Nanoscopic thermoelectric coolers.
  24. Ghoshal, Uttam Shyamalindu, Nanoscopic thermoelectric refrigerators.
  25. Uttam Shyamalindu Ghoshal ; Steven A. Cordes ; David Dimilia ; James P. Doyle ; James L. Speidell, Thermoelectric coolers with enhanced structured interfaces.
  26. Ghoshal Uttam Shyamalindu, Thermoelectric cooling apparatus and method for maximizing energy transport.
  27. Ghoshal Uttam Shyamalindu, Thermoelectric cooling system.
  28. Bell Lon E., Thermoelectric heat exchanger.
  29. Ghoshal, Uttam Shyamalindu, Thermoelectric microcoolers for cooling write coils and GMR sensors in magnetic heads for disk drives.
  30. Bell, Lon E., Thermoelectric power generation utilizing convective heat flow.
  31. Ghoshal, Uttam Shyamalindu, Thermoelectric spot coolers for RF and microwave communication integrated circuits.

이 특허를 인용한 특허 (40)

  1. Lower, Nathan P.; Boone, Alan P.; Wilcoxon, Ross K., Adhesive applications using alkali silicate glass for electronics.
  2. Lower, Nathan P.; Boone, Alan P.; Wilcoxon, Ross K.; Hillman, David D., Alkali silicate glass based coating and method for applying.
  3. Lower, Nathan P.; Boone, Alan P.; Wilcoxon, Ross K.; Hillman, David D., Alkali silicate glass based coating and method for applying.
  4. Sampica, James D.; Barnidge, Tracy J.; Tchon, Joseph L.; Lower, Nathan P.; Wilcoxon, Ross K.; Dudley, Sandra S., Alkali silicate glass for displays.
  5. Lower, Nathan P.; Nemeth, Paul R.; Wilcoxon, Ross K., Antiglare treatment for glass.
  6. Maltezos, George; Johnston, Matthew; Goodwin, David; Scherer, Axel; Walker, Christopher I., Apparatus for thermal cycling.
  7. Sauciuc, Ioan; Mahajan, Ravi, Electromagnetically-actuated micropump for liquid metal alloy.
  8. Sauciuc, Ioan; Mahajan, Ravi, Electromagnetically-actuated micropump for liquid metal alloy enclosed in cavity with flexible sidewalls.
  9. Salat, Jacques; Avenas, Yvan; Meuret, Regis Bernard Albert; Tawk, Mansour, Electronic device with cooling by a liquid metal spreader.
  10. Ouyang, Chien, Enhanced heat pipe cooling with MHD fluid flow.
  11. Lower, Nathan P.; Wilcoxon, Ross K.; Wooldridge, James R.; Dlouhy, David W., Fabrication process for a flexible, thin thermal spreader.
  12. Ouyang,Chien, Feedback controlled magneto-hydrodynamic heat sink.
  13. Lower, Nathan P.; Wilcoxon, Ross K.; Boone, Alan P.; Wyckoff, Nathaniel P.; Hamilton, Brandon C., Glass thick film embedded passive material.
  14. Lower, Nathan P.; Wilcoxon, Ross K.; Boone, Alan P.; Wyckoff, Nathaniel P.; Hamilton, Brandon C., Glass thick film embedded passive material.
  15. Ghoshal, Uttam; Guha, Ayan, Heat pipes and thermoelectric cooling devices.
  16. Gilliland,Don A., Heat sinks for dissipating a thermal load.
  17. Ouyang, Chien; Gross, Kenny C.; Heydari, Ali, Integrated circuit chip cooling using magnetohydrodynamics and recycled power.
  18. Lower, Nathan P.; Wilcoxon, Ross K.; Boone, Alan P., Integrated circuit protection and ruggedization coatings and methods.
  19. Lower, Nathan P.; Wilcoxon, Ross K.; Boone, Alan P., Integrated circuit protection and ruggedization coatings and methods.
  20. Lower, Nathan P.; Boone, Alan P.; Wilcoxon, Ross K., Integrated circuit tampering protection and reverse engineering prevention coatings and methods.
  21. Ouyang, Chien, Magneto-hydrodynamic hot spot cooling heat sink.
  22. Wilcoxon, Ross K.; Lower, Nathan P.; Wooldridge, James R.; Dlouhy, David W.; Strzelczyk, Anthony J., Mechanically compliant thermal spreader with an embedded cooling loop for containing and circulating electrically-conductive liquid.
  23. Ghoshal, Uttam; Guha, Ayan; Borak, James, Method and apparatus for switched thermoelectric cooling of fluids.
  24. Hyde, Roderick A.; Ishikawa, Muriel Y.; Myhrvold, Nathan P.; Wood, Jr., Lowell L., Method and system for providing fuel in a nuclear reactor.
  25. Hyde, Roderick A.; Ishikawa, Muriel Y.; Myhrvold, Nathan P.; Wood, Jr., Lowell L., Method and system for providing fuel in a nuclear reactor.
  26. Boone, Alan P.; Lower, Nathan P.; Wilcoxon, Ross K., Method for providing near-hermetically coated integrated circuit assemblies.
  27. Boone, Alan P.; Lower, Nathan P.; Wilcoxon, Ross K., Method for providing near-hermetically coated integrated circuit assemblies.
  28. Wilcoxon, Ross K.; Lower, Nathan P.; Boone, Alan P., Method for providing near-hermetically coated, thermally protected integrated circuit assemblies.
  29. Lower, Nathan P.; Brower, David M.; Wilcoxon, Ross K., Method of reinforcing a hermetic seal of a module.
  30. Fawcett, Adrian; Tracy, David; Simmons, Kevin Daley, Optical system for multiple reactions.
  31. Loewen, Eric Paul; Cundiff, Weston Matthew; Strege, Seth, Passive system of powering and cooling with liquid metal and method thereof.
  32. Lower, Nathan P.; Wilcoxon, Ross K.; Yao, Qizhou; Dlouhy, David W.; Chihak, John A., System and method for a substrate with internal pumped liquid metal for thermal spreading and cooling.
  33. Ahlfeld, Charles E.; Gilleland, John Rogers; Hyde, Roderick A.; Ishikawa, Muriel Y.; McAlees, David G.; Myhrvold, Nathan P.; Whitmer, Charles; Wood, Jr., Lowell L.; Odedra, Ashok, System and method for operating a modular nuclear fission deflagration wave reactor.
  34. Ahlfeld, Charles E.; Gilleland, John Rogers; Hyde, Roderick A.; Ishikawa, Muriel Y.; McAlees, David G.; Myhrvold, Nathan P.; Whitmer, Charles; Wood, Jr., Lowell L.; Odedra, Ashok, System and method for operating a modular nuclear fission deflagration wave reactor.
  35. Cripe, David W.; McCoy, Bryan S.; Lower, Nathan P.; Wilcoxon, Ross K., System and method for proportional cooling with liquid metal.
  36. Maltezos, George; Johnston, Matthew; Goodwin, David; Scherer, Axel; Walker, Christopher I., Thermal cycling apparatus.
  37. Maltezos, George; Johnston, Matthew; Goodwin, David; Scherer, Axel; Walker, Christopher I., Thermal cycling method.
  38. Maltezos, George; Johnston, Matthew; Goodwin, David; Scherer, Axel; Walker, Christopher I., Thermal cycling system.
  39. Wilcoxon, Ross K.; Dlouhy, David W.; Lower, Nathan P.; Wooldridge, James R., Thermal spreader assembly with flexible liquid cooling loop having rigid tubing sections and flexible tubing sections.
  40. Lower, Nathan P.; Wilcoxon, Ross K.; Wooldridge, James R., Thin, solid-state mechanism for pumping electrically conductive liquids in a flexible thermal spreader.
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