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Pulse echo ultrasonic test chamber for tray production system 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01N-029/00
출원번호 US-0842087 (2004-05-10)
발명자 / 주소
  • Busch,Ralph E.
출원인 / 주소
  • Sonix, Inc.
인용정보 피인용 횟수 : 5  인용 특허 : 70

초록

A method and apparatus for retaining a part in a carrier during an ultrasonic scan. The part is positioned above a first opening in a lower chamber while air is drawn out of a second opening in the lower chamber to apply suction to the lower surface of the part. An ultrasonic transducer is housed in

대표청구항

What is claimed is: 1. A method for ultrasonic scanning of an object in a scanning station, the scanning station having upper and lower chambers, the upper chamber being positioned above the lower chamber and vertically spaced therefrom, the method comprising: moving the object between the upper an

이 특허에 인용된 특허 (70)

  1. Kessler Lawrence W. (418 Warren Road Glenview IL 60025), Acoustic examination methods and apparatus.
  2. Kessler Lawrence W. (Glenview IL) Yuhas Donald E. (Wood Dale IL), Acoustic imaging system and method.
  3. Oravecz, Michael G.; Basterfield, Alan, Acoustic micro imaging method and apparatus for capturing 4D acoustic reflection virtual samples.
  4. Kessler, Lawrence W.; Adams, Thomas E.; Oravecz, Michael G., Acoustic micro imaging method providing improved information derivation and visualization.
  5. Dransfeld Klaus (Ermatingen CHX) Fischer Ulrich (Wetzlar DEX) Guethner Peter (Konstanz DEX) Heitmann Knut (Wetzlar DEX), Acoustic screen scan microscope for the examination of an object in the short-range field of a resonant acoustic oscilla.
  6. Lee Yong J. (2600 E. Renner Rd. ; Apt. 285 Richardson TX 75082) Khuri-Yakub Butrus T. (4151 Donald Dr. Palo Alto CA 94306) Saraswat Krishna C. (12356 Parker Ranch Rd. Saratoga CA 95070), Acoustic temperature and film thickness monitor and method.
  7. Stanke Fred E. ; Khuri-Yakub Butrus T. ; Pham Hung ; Hasan Talat, Apparatus and method for characterizing semiconductor wafers during processing.
  8. Kirkpatrick, John, Apparatus and method for securely carrying a substrate.
  9. Kao, Chung-En, Apparatus and method for self-centering a wafer in a sputter chamber.
  10. Tsui, Ching Man Stanley; Chow, Eric; Bilan, Jr., Curito M., Apparatus and method for testing semiconductor devices.
  11. Eckert Charles E. (Plum Borough PA), Apparatus and method for ultrasonic detection of inclusions in a molten body.
  12. Chang Chi-Wei,TWX ; Lee Chung-Yi,TWX, Apparatus for detecting wafer edge defects and method of using.
  13. Wanesky William R. (Wescosville PA), Apparatus for transferring an oriented array of articles.
  14. Bunkenburg Joachim (Victor NY) Hammond Peter M. (Rochester NY), Apparatus for treating wafers utilizing megasonic energy.
  15. Daniel M. Erickson ; Daniel W. Micek ; Michael G. Oravecz, Automated acoustic micro imaging system and method.
  16. Cichanski Frank J. (Elgin IL), Balanced scanning mechanism.
  17. Ulrich, Franz W.; Bourn, Charles T.; Tonkin, Steven W., Circuit for machine-vision system.
  18. Kessler Lawrence W. (Buffalo Grove IL) Erickson Daniel M. (Schiller Park IL) Micek Daniel W. (Norridge IL) Billone John (DesPlaines IL), Controlled-immersion inspection.
  19. Box William A. (Bethel Park PA) Rusiecki Eugene R. (Monroeville PA), Cross-flow ultrasonic transducer head.
  20. Oravecz, Michael G.; Pen, Lei; Kessler, Lawrence W.; Guo, Zhiqi, Frequency domain processing of scanning acoustic imaging signals.
  21. Mallard Richard L., Immersion testing porous semiconductor processing components.
  22. Fushimi Koji (Gifu JPX) Nishioka Shigeo (Nagoya JPX) Konishi Kazuhiro (Nagoya JPX), Immersion type automatic ultrasonic testing aparatus for detecting flaws of balls.
  23. Potts Roger F. (Georgetown CAX), Machine for cleaning receptacles.
  24. Villarreal Danine (San Antonio TX) Sayka Anthony (Austin TX), Magnetic sensing robotics for automated semiconductor wafer processing systems.
  25. Enjoji Susumu (Ootawara JPX) Kikuchi Yushichi (Tochigi JPX) Hara Kiyoshi (Ootawara JPX), Mechanical type ultrasonic scanner.
  26. Shwartzman, Stanley, Megasonic cleaning apparatus and method.
  27. Yang Ji Cheng,SGX ; Sua Goh Jing,SGX, Method and apparatus for nondestructive inspection and defect detection in packaged integrated circuits.
  28. Kessler Lawrence W. (Buffalo Grove IL) Micek Daniel W. (Norridge IL) Billone John (Des Plaines IL), Method and apparatus for ultrasonic inspection of electronic components.
  29. Brautigan David R. ; Merckle Charles D., Method and apparatus for ultrasonic testing of aluminum billet.
  30. Cichanski Frank J. (Elgin IL), Method and system for dual phase scanning acoustic microscopy.
  31. Kliesch Wilfried (Hagen DEX), Method of and device for coupling an ultrasonic probe to a test piece.
  32. Edwards Bill R. (14 Mada Palla Ct. Derby KS 67037), Method of determining foreign material in food products using ultrasonic sound.
  33. Tanaka Hiroki (Nagoya JPX) Tsuchida Shin (Nagoya JPX), Method of producing hardened aluminum alloy sheets having superior thermal stability.
  34. Berntsen Robert G. (Asker NOX), Method, apparatus and transducer for measurement of dimensions.
  35. Khuri-Yakub Butrus T. (Santa Clara County CA) Reinholdtsen ; Paul A. (Seattle WA), Near field scanning acoustic microscope and method.
  36. Teslawski Georg (Menlo Park CA) Corl Paul D. (Mountain View CA), Neonate ultrasonic scanner.
  37. Lehmann Mark D. ; Raines Dorman ; Stamps Charles A., Plasma etching apparatus and method and apparatus for verifying a wafer.
  38. Isenberg Heinz H. (Braunschweig DEX) Vogt Gran (Burgwedel-Wettmar DEX) Althaus P. Gerhard (Garbsen DEX), Process and device for the ultrasonic testing for welds between plastics packaging and cover foils.
  39. Otsuki Masashi,JPX ; Endo Shigeki,JPX, Product holder.
  40. Roth Don J. (Lakewood OH), Pulse-echo ultrasonic imaging method for eliminating sample thickness variation effects.
  41. Evert Donald A. (Littleton CO), Purging and expansion mechanism.
  42. Gonzalez-Martin Jose R. ; Karlsrud Chris, Robot assisted method of polishing, cleaning and drying workpieces.
  43. Daniel M. Erickson ; Bryan P. Schackmuth, Scanning acoustic microscope system and method for handling small parts.
  44. Ohta, Kazuya, Semiconductor device mounting jig.
  45. Ries Karl (Mulheim DEX) Hannoschock Kurt (Sonsbeck DEX) Simoneit Gunter (Mulheim DEX), System for inspecting tubes or pipes by means for ultrasonics.
  46. Satya, Akella V. S.; Pinto, Gustavo A.; Adler, David L.; Long, Robert Thomas; Richardson, Neil; Weiner, Kurt H.; Walker, David J.; Mantalas, Lynda C., Test structures and methods for inspection of semiconductor integrated circuits.
  47. Hsu Nelson N. ; Xiang Dan,CNX ; Blessing Gerald V., Time and polarization resolved acoustic microscope.
  48. Taenzer Jon C. (Palo Alto CA), Transducer drive for ultrasonic imaging.
  49. Kessler, Lawrence; Billone, John, Tray-fed scanning acoustic microscope system and method for immobilizing parts during inspection.
  50. Nagura Masato (Chofu JPX) Takahashi Toshiaki (Tachikawa JPX) Hara Kazuhiko (Yokohama JPX), Ultrasonic apparatus.
  51. Iinuma Kazuhiro (Yokohama JPX), Ultrasonic diagnosing apparatus.
  52. Nagasaki Tatsuo (Musashino JPX), Ultrasonic diagnosis apparatus.
  53. Reeves R. Dale (5644 Westheimer #431 Houston TX 77056) Dehoff Thomas M. (3206 Gary Spring TX 77380), Ultrasonic flaw detection device.
  54. Takishita Yoshihiko (Ibaraki JPX) Sasaki Souji (Hitachi JPX), Ultrasonic flaw detector.
  55. Ries Karl (Mulheim DT) Hannoschock Kurt (Sonsbeck DT) Simoneit Gunter (Mulheim DT), Ultrasonic immersion type testing.
  56. Brunty Troy W. (Kent WA) Young Fred D. (Bellevue WA), Ultrasonic inspection system for laminated stiffeners.
  57. Good Morris S. (Richland WA) Schuster George J. (Kennewick WA) Skorpik James R. (Kennewick WA), Ultrasonic material hardness depth measurement.
  58. Karaki Kouichi (Hino JPX) Sakai Mitsugu (Hachioji JPX) Sasaki Yasuo (Hachioji JPX), Ultrasonic microscope apparatus.
  59. Karaki Koichi (Hino JPX) Sakai Mitsugu (Hachiooji JPX) Sasaki Yasuo (Hachiooji JPX), Ultrasonic microscope having a focusing mechanism.
  60. Glenn, William E., Ultrasonic scanning method and apparatus.
  61. Love Gordon R. (Greenville SC), Ultrasonic testing of multilayer ceramic capacitors.
  62. Beck Kenneth H. (Newtown PA) Coates Darrell W. (Lawrenceville NJ), Ultrasonic transducer coupler for flaw detection systems.
  63. Meyers Paul F. (San Juan Capistrano CA), Ultrasound probe with bubble trap.
  64. Lambert Donald L., Universal shipping tray.
  65. Sakamoto Eiji (Sagamihara JPX) Ebinuma Ryuichi (Machida JPX) Hara Shinichi (Yokohama JPX) Marumo Mitsuji (Sagamihara JPX), Vacuum chuck.
  66. Dunaway Thomas J. ; Cullinan Deborah A., Vacuum die bond for known good die assembly.
  67. Kleinman Yossie (Rehovot ILX), Vacuum holder particulary useful as a vacuum table.
  68. Thomas Michael E. (Milpitas) Sekigahama Satoshi (Fremont) von Salza Brown Richard (San Jose CA), Wafer carrier.
  69. Leidy, Robert K.; Sonntag, Paul D., Wafer chuck having a removable insert.
  70. Getchel, Paul A.; Cole, Sr., Kenneth M.; Lyden, Henry A., Workpiece chuck.

이 특허를 인용한 특허 (5)

  1. Keeton, Paul Ivan John; Kalavagunta, Sushma, Method and apparatus for automated ultrasonic inspection.
  2. Busch, Ralph; McKeon, James, Method and apparatus for coupling ultrasound between an integral ultrasonic transducer assembly and an object.
  3. Tapia, William J.; Georgeson, Gary E.; Fogarty, Michael D.; Anderson, David W., System and method of ultrasonic inspection.
  4. McKeon, James C. P., Ultrasonic inspection using acoustic modeling.
  5. Malhan, Vishal; Ramamurthy, Gautham; Talikoti, Vijay Tippanna; John, Latha; Menon, Deepa; Hegde, Krishna R.; Venkanna, Ramesh, Wireless telemetry using voltage and pulse intervals.
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