초록 ▼

The present invention is for a grinding device, such as a surface grinding disc or an annular grinding wheel, constructed from a plurality of abrasive segments arranged in an array thereon, wherein the plurality of abrasive segments are embedded in a matrix composition, and wherein the device is aba

The present invention is for a grinding device, such as a surface grinding disc or an annular grinding wheel, constructed from a plurality of abrasive segments arranged in an array thereon, wherein the plurality of abrasive segments are embedded in a matrix composition, and wherein the device is abapted to perform a "dry machining" operation. The abrasive segments may be resin bonded or vitrified and may include diamond or other superhard or superabrasive particles, such as, for example, cubic boron nitride ("cBN"), dispersed therein. Both the abrasive segments and the matrix composition include a dry lubricant, such as hexagonal boron nitride, molybdenum disulfide or graphite, dispersed therein. The abrasive segments further include a melt phase metal composition, such as bronze or other copper alloys, to aid in heat dissipation.

대표청구항 ▼

We claim: 1. A grinding device especially adapted to perform dry machining, the grinding device comprising: a plurality of grinding segments and a matrix surrounding at least one of said plurality of grinding segments, said at least one of said plurality of grinding segments comprising a resin bond

We claim: 1. A grinding device especially adapted to perform dry machining, the grinding device comprising: a plurality of grinding segments and a matrix surrounding at least one of said plurality of grinding segments, said at least one of said plurality of grinding segments comprising a resin bond material and a superabrasive material provided in an amount between 10% and 43.75% by volume of the total composition of the grinding segment dispersed throughout the resin bond material, said at least one grinding segment comprising a refractory non-grinding abrasive grain material provided in an amount less than 10% by volume of the total composition of the grinding segment, a heat-dissipative melt-phase metal material comprising a copper tin alloy provided in an amount between 30% and 68% by volume of the total composition of the grinding segment to enhance heat dissipation through the grinding segments, and a dry lubricant material provided in an amount at least 1% by volume of the total composition of the grinding segment to inhibit the generation of heat due to friction; and said matrix comprising an epoxy resin, said matrix further comprising a dry lubricant provided in an amount between 1% and 5% by weight of the total composition of the matrix to inhibit the generation of heat due to friction, a porosity filler provided in an amount between 3% and 15% by weight of the total composition of the matrix, and a refractory non-grinding abrasive grain provided in an amount between 10% and 70% by weight of the total composition of the matrix for the purpose of wear retardation, whereby the grinding device is adapted to perform dry machining operations without the use of more than a nominal quantity of coolant or other lubricant. 2. The grinding device of claim 1, wherein said superabrasive material of said grinding segment is diamond. 3. The grinding device of claim 1, wherein said superabrasive material of said grinding segment is cubic boron nitride. 4. The grinding device of claim 1, wherein said superabrasive material of said grinding segment is provided in an amount of 12% (by volume) of the total composition of the grinding segment. 5. The grinding device of claim 1, wherein said refractory material of said grinding segment is boron carbide. 6. The grinding device of claim 1, wherein said refractory material of said grinding segment is provided in an amount of 2.2% of the total composition of the grinding segment. 7. The grinding device of claim 1, wherein a grain size of the refractory material of said grinding segment is less than or equal to a grain size of superabrasive material. 8. The grinding device of claim 1, wherein a grain size of the refractory material of said grinding segment is between 220 mesh and 1000 mesh. 9. The grinding device of claim 1, wherein the melt-phase material of said grinding segment is bronze. 10. The grinding device of claim 1, wherein the melt-phase material of said grinding segment is provided in an amount of 34.3% of the total composition of the grinding segment. 11. The grinding device of claim 1, wherein the dry lubricant of said grinding segment is hexagonal boron nitride. 12. The grinding device of claim 1, wherein the dry lubricant of said grinding segment is molybdenum disulphide. 13. The grinding device of claim 1, wherein the dry lubricant of said grinding segment is graphite. 14. The grinding device of claim 1, wherein the dry lubricant of said grinding segment is coke. 15. The grinding device of claim 1, wherein the dry lubricant of said grinding segment is a lithium sterate. 16. The grinding device of claim 1, wherein the dry lubricant of said grinding segment is provided in an amount of 2.2% (by volume) of the total composition of the grinding segment. 17. The grinding device of claim 1, wherein said resin bond material of said grinding segment is a polyimide resin. 18. The grinding device of claim 1, wherein said dry lubricant of said matrix is molybdenum disulphide. 19. The grinding device of claim 1, wherein said dry lubricant of said matrix is provided in an amount of 1.7% (by weight) of the total composition of the matrix. 20. The grinding device of claim 1, wherein said porosity filler of said matrix is a ceramic material shaped into spheroids. 21. The grinding device of claim 20, wherein said porosity filler of said matrix is a 14/40 ceramic bubble material. 22. The grinding device of claim 1, wherein said porosity filler of said matrix is provided in an amount of 7% (by weight) of the total composition of the matrix. 23. The grinding device of claim 1, wherein said refractory material of said matrix is aluminum oxide. 24. The grinding device of claim 1, wherein said refractory material of said matrix is silicon carbide. 25. The grinding device of claim 1, wherein said refractory material of said matrix is boron carbide. 26. The grinding device of claim 1, wherein said refractory material of said matrix is zirconium carbide. 27. The grinding device of claim 1, wherein said refractory material of said matrix is provided in an amount of 56.3% (by weight) of the total composition of the matrix. 28. The grinding device of claim 1, wherein a grain size of the refractory material of the matrix is equal to or smaller than a grain size of the superabrasive material of the grinding segment. 29. The grinding device of claim 1, wherein the epoxy resin is a two-part epoxy with reactive dilutant and anti-foam additives.