Manufacturing apparatus of semiconductor device having introducing section and withdrawing section
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
C23C-016/00
H01L-012/306
C23F-001/00
출원번호
US-0305166
(2002-11-27)
우선권정보
JP-2001-092543(2001-03-28)
발명자
/ 주소
Miyazaki,Kunihiro
출원인 / 주소
Kabushiki Kaisha Toshiba
대리인 / 주소
Finnegan, Henderson, Farabow, Garrett &
인용정보
피인용 횟수 :
1인용 특허 :
12
초록▼
A manufacturing apparatus of a semiconductor device includes an introducing section, a process section, and a withdrawing section. The introducing section introduces a transfer box therein. The process section takes in the semiconductor substrate put in the introducing section and applies a prescrib
A manufacturing apparatus of a semiconductor device includes an introducing section, a process section, and a withdrawing section. The introducing section introduces a transfer box therein. The process section takes in the semiconductor substrate put in the introducing section and applies a prescribed processing to the semiconductor substrate. Further, the withdrawing section is arranged on a surface differing from the surface on which the introducing section is arranged and discharges the transfer box holding the semiconductor substrate withdrawn from the process section of the semiconductor substrate.
대표청구항▼
What is claimed is: 1. A manufacturing system of a semiconductor device, comprising: a first manufacturing apparatus; a second manufacturing apparatus; a third manufacturing apparatus, wherein each of the first, second, and third manufacturing apparatus comprises: an introducing section, a process
What is claimed is: 1. A manufacturing system of a semiconductor device, comprising: a first manufacturing apparatus; a second manufacturing apparatus; a third manufacturing apparatus, wherein each of the first, second, and third manufacturing apparatus comprises: an introducing section, a process section having a surface, the introducing section being provided on the surface of the process section, and a withdrawing section which is arranged on a surface of the process section differing from the surface on which the introducing section is arranged; a first plurality of transfer boxes associated with a first region including the introducing section of the second manufacturing apparatus and the withdrawing section of the first manufacturing apparatus; a second plurality of transfer boxes associated with a second region including the withdrawing section of the second manufacturing apparatus and the introducing section of the third manufacturing apparatus; a first transfer box being selected from the first plurality of transfer boxes, the first transfer box having a first environment therein, a second transfer box being selected from the second plurality of transfer boxes, the second transfer box having a second environment therein, wherein a third environment surrounds at least one of the first, second, and third manufacturing apparatuses, the introducing section of the second manufacturing apparatus being configured to introduce the first transfer box holding the semiconductor substrate therein, the process section of the second manufacturing apparatus being configured to apply a process to the semiconductor substrate, the withdrawing section of the second manufacturing apparatus being configured to withdraw the second transfer box holding the semiconductor substrate after the semiconductor substrate has been discharged from the process section of the second manufacturing apparatus, and wherein the first environment has a cleanliness higher than the third environment while the semiconductor substrate is held in the first transfer box, and the second environment has a cleanliness higher than the third environment while the semiconductor substrate is held in the second transfer box. 2. The manufacturing system of a semiconductor device according to claim 1, further comprising: a reading apparatus which is mounted on the introducing section of said at least one of the first, second, and third manufacturing apparatuses and reads the information on the semiconductor substrate put in the introducing section from a recording medium mounted on the first transfer box; and a writing apparatus which is mounted on the withdrawing section of said at least one of the first, second, and third manufacturing apparatuses and writes the information read by the reading apparatus and the information on the processing performed in the process section in a recording medium attached to the second transfer box withdrawn from the withdrawing section. 3. The manufacturing system of a semiconductor device according to claim 1, wherein the information on the semiconductor substrate includes at least one of a discriminating code of the semiconductor substrate, the situation of the manufacturing process, and a transfer instructing information to the next process step. 4. A manufacturing system of a semiconductor device, comprising: a plurality of manufacturing apparatuses of a semiconductor device each including an introducing section configured to introduce a first transfer box having a first environment therein, the first transfer box holding a semiconductor substrate therein, a process section which takes in the semiconductor substrate put in the introducing section and applies a processing to the semiconductor substrate, and a withdrawing section configured to withdraw a second transfer box having a second environment therein, the second transfer box holding the semiconductor substrate discharged from the process section, the second transfer box differing from the first transfer box, the withdrawing section of at least one of the manufacturing apparatuses being arranged to face the introducing section of the adjacent manufacturing apparatus, and the withdrawing section and the introducing section of at least one of the manufacturing apparatuses being arranged on different surfaces of the manufacturing apparatus, wherein a third environment surrounds at least one of a plurality of manufacturing apparatuses, the first environment has a cleanliness higher than the third environment while the semiconductor substrate is held in the first transfer box, and the second environment has a cleanliness higher than the third environment while the semiconductor substrate is held in the second transfer box. 5. The manufacturing system of a semiconductor device according to claim 4, further comprising: a reading apparatus which is mounted on the introducing section and reads the information on the semiconductor substrate put in the introducing section from a recording medium mounted on the first transfer box; and a writing apparatus which is mounted on the withdrawing section and writes the information read by the reading apparatus and the information on the processing performed in the manufacturing apparatus in a recording medium attached to the second transfer box withdrawn from the withdrawing section. 6. The manufacturing system of a semiconductor device according to claim 5, wherein the information on the semiconductor substrate includes at least one of a discriminating code of the semiconductor substrate, the situation of the manufacturing process, and a transfer instructing information to the next process step. 7. A manufacturing system of a semiconductor device, comprising: a first manufacturing apparatus of the semiconductor device including a process section which applies a prescribed processing to a semiconductor substrate, and a withdrawing section configured to withdraw a first transfer box holding the semiconductor substrate discharged from the process section, said first transfer box having a first environment therein; a second manufacturing apparatus of a semiconductor device including an introducing section which is arranged to face the withdrawing section of the first manufacturing apparatus and configured to receive the first transfer box holding the semiconductor substrate, a process section which takes in the semiconductor substrate put on the introducing section and applies a prescribed treatment to the semiconductor substrate, and a withdrawing section which is arranged on the surface differing from the surface on which the introducing section is arranged and which is configured to withdraw a second transfer box differing from the first transfer box and holding the semiconductor substrate withdrawn from the process section, said second transfer box having a second environment therein; and a third manufacturing apparatus of a semiconductor device including an introducing section which is arranged to face the withdrawing section of the second manufacturing apparatus and configured to receive the second transfer box holding the semiconductor substrate, and a process section which takes in the semiconductor substrate put on the introducing section and applies a prescribed processing to the semiconductor substrate, the second manufacturing apparatus being configured to put the first transfer box back to the first manufacturing apparatus after taking the semiconductor substrate from the first transfer box into the process section, and the third manufacturing apparatus being configured to put the second transfer box back to the second manufacturing apparatus after taking the semiconductor substrate from the second transfer box into the process section, wherein a third environment surrounds at least one of the first, second, and third manufacturing apparatuses, the first environment has a cleanliness higher than the third environment while the semiconductor substrate is held in the first transfer box, and the second environment has a cleanliness higher than the third environment while the semiconductor substrate is held in the second transfer box. 8. The manufacturing system of a semiconductor device according to claim 7, further comprising: a first manufacturing process stage of a semiconductor device in which a plurality of the first manufacturing apparatuses is arranged; a second manufacturing process stage of a semiconductor device in which a plurality of the second manufacturing apparatuses is arranged; and a third manufacturing process stage of a semiconductor device in which a plurality of the third manufacturing apparatuses is arranged, wherein the first and second manufacturing process stages are configured to reciprocate the first transfer box to each other, and the second and third manufacturing process stages are configured to reciprocate the second transfer box to each other. 9. The manufacturing system of a semiconductor device according to claim 7, wherein the first and second transfer boxes are first and second cleanliness, respectively, at least one of the second manufacturing apparatuses is a cleaning apparatus which washes the semiconductor substrate processed in the first manufacturing apparatus; and the transfer box reciprocated between the second and third manufacturing apparatuses has the second cleanliness higher than the first cleanliness so as to maintain the cleanliness on the surface of the semiconductor substrate after the washing treatment performed in the cleaning apparatus. 10. The manufacturing system of a semiconductor device according to claim 7, wherein each of the second and third manufacturing apparatus further comprises: a reading apparatus which is mounted on the introducing section and reads the information on the semiconductor substrate put in the introducing section from a recording medium mounted on the first transfer box or second transfer box; and the second manufacturing apparatus further comprises a writing apparatus which is mounted on the withdrawing section and writes the information read by the reading apparatus and the information on the processing performed in the process section in a recording medium attached to the second transfer box withdrawn through the withdrawing section. 11. The manufacturing system of a semiconductor device according to claim 7, further comprising a film-deposition apparatus including an introducing section and a process section, wherein the first manufacturing apparatus is a lithography apparatus which applies a lithography treatment to the semiconductor substrate; the second manufacturing apparatus is one of an etching apparatus and an ion implantation apparatus, which respectively applies an etching treatment and an ion implantation treatment on the semiconductor substrate subjected to the lithography treatment, one of the etching apparatus and the ion implantation apparatus having the withdrawing section formed on a surface opposite to the surface on which the introducing section is arranged; the third manufacturing apparatus is a cleaning apparatus which washes the semiconductor substrate subjected to one of the etching treatment and the ion implantation treatment and further comprises a withdrawing section arranged on a surface opposite to the surface on which the introducing section is arranged and configured to withdraw a third transfer box, differing from the second transfer box and holding the semiconductor substrate withdrawn from the process section being withdrawn onto the withdrawing section; the introducing section of the film-deposition apparatus is arranged on the surface facing the withdrawing section of the cleaning section and receives the third transfer box holding the semiconductor substrate washed in the cleaning apparatus; and the process section of the film-deposition apparatus takes in the semiconductor substrate put in the introducing section and applies a film-deposition treatment to the semiconductor substrate.
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