초록 ▼

A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated, non-continuous polishing pad oriented at an angle relative to the horizontal to allow planarizing liquids and materials removed from the microelectronic substrate to flow of

A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated, non-continuous polishing pad oriented at an angle relative to the horizontal to allow planarizing liquids and materials removed from the microelectronic substrate to flow off the polishing pad under the force of gravity. Two such polishing pads can be positioned opposite each other in a vertical orientation and can share either a common platen or a common substrate carrier. The polishing pads can be pre-attached to both a supply roll and a take-up roll to form a cartridge which can be easily removed from the apparatus and replaced with another cartridge.

대표청구항 ▼

What is claimed is: 1. A method for removing material from two microelectronic substrates, comprising: inclining a first planarizing surface of a first planarizing medium relative to horizontal and inclining a second planarizing surface of a second planarizing medium relative to horizontal; suppor

What is claimed is: 1. A method for removing material from two microelectronic substrates, comprising: inclining a first planarizing surface of a first planarizing medium relative to horizontal and inclining a second planarizing surface of a second planarizing medium relative to horizontal; supporting a first microelectronic substrate with a first portion of a substrate carrier and supporting a second microelectronic substrate with a second portion of the substrate carrier; positioning the substrate carrier between the first and second planarizing media to engage the first microelectronic substrate with the first planarizing surface and engage the second microelectronic substrate with the second planarizing surface while the planarizing surfaces are inclined relative to horizontal; and moving at least one of the first planarizing medium and the first microelectronic substrate relative to the other and moving at least one of the second planarizing medium and the second microelectronic substrate relative to the other to remove material from the microelectronic substrates while the planarizing media are inclined relative to horizontal. 2. The method of claim 1, further comprising engaging the first planarizing medium with a first support surface of a first platen while engaging the second planarizing medium with a second support surface of a second platen facing generally toward the first platen. 3. The method of claim 1, further comprising: supporting the first planarizing medium with a first platen; and supporting the second planarizing medium with a second platen. 4. The method of claim 1 wherein the first planarizing medium includes an elongated polishing pad, further comprising unrolling a portion of the polishing pad from a supply roll and rolling up a portion of the polishing pad on a take-up roll. 5. The method of claim 1, further comprising positioning the supply roll above the take-up roll. 6. The method of claim 1 wherein moving at least one of the first planarizing medium and the first microelectronic substrate relative to the other and moving at least one of the second planarizing medium and the second microelectronic substrate relative to the other includes activating a single actuator to move the substrate carrier relative to both the first planarizing medium and the second planarizing medium. 7. The method of claim 1 wherein inclining the first and second planarizing surfaces includes inclining the planarizing surfaces to be approximately vertical.