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An electrosurgical device coated with powder coatings including a silicone resin and siloxane additive without fluoropolymers. In the powder coatings, the silicone resin is methyl phenyl silicone or phenyl silicone or methyl polysiloxane or phenyl alkyl polysiloxane resin and the additive is either

An electrosurgical device coated with powder coatings including a silicone resin and siloxane additive without fluoropolymers. In the powder coatings, the silicone resin is methyl phenyl silicone or phenyl silicone or methyl polysiloxane or phenyl alkyl polysiloxane resin and the additive is either methyl alkyl polysiloxane or dimethyl polysiloxane. This coating is applied to the surfaces of an electrosurgical device minimize the build-up of charred tissue on the surfaces of the electrosurgical device.

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The invention claimed is: 1. An electrosurgical medical device comprising: a conductive substrate, said substrate including a tissue engaging area; and a powder coating applied to at least the tissue engaging area of said substrate, said powder coating characterized by nonstick and release properti

The invention claimed is: 1. An electrosurgical medical device comprising: a conductive substrate, said substrate including a tissue engaging area; and a powder coating applied to at least the tissue engaging area of said substrate, said powder coating characterized by nonstick and release properties and heat stability from 250째 F. to about 900째 F., wherein said powder coating includes a powdered silicone resin selected from the group consisting of a phenyl polysiloxane powder resin, a methyl polysiloxane powder resin, a methyl phenyl polysiloxane powder resin, a phenyl silicone powder, a methyl phenyl silicone and a phenyl alkyl polysiloxane powder resin and said powder coating includes a polysiloxane additive selected from the group consisting of a methyl alkyl polysiloxane, a dimethyl polysiloxane and a methyl phenyl siloxane. 2. The electrosurgical medical device of claim 1 wherein the polysiloxane additive is between about 0.5% to about 10% parts per weight of the powder coating. 3. The electrosurgical medical device of claim 1 wherein the silicone resin is from about 5% to 75% parts per weight of the powder coating. 4. The electrosurgical medical device of claim 1, wherein the substrate includes a metal. 5. The electrosurgical medical device of claim 1 wherein the powder coating includes epoxy cresol novolac. 6. The electrosurgical medical device of claim 5, wherein the epoxy cresol novolac is from about 1% to about 50% parts per weight of the powder coating. 7. The electrosurgical medical device of claim 5, wherein the substrate includes a metal. 8. The electrosurgical medical device of claim 1, wherein the powder coating includes o-cresol novolac. 9. The electrosurgical medical device of claim 8, wherein the o-cresol novolac is from about 1% to about 40% parts per weight of the powder coating. 10. The electrosurgical medical device of claim 8, wherein the substrate includes a metal. 11. The electrosurgical medical device of claim 1, wherein the powder coating includes a solid bisphenol-A/epichlorohydrin epoxy resin. 12. The electrosurgical medical device of claim 11, wherein the solid bisphenol-A/epichlorohydrin epoxy resin is from about 1% to about 50% parts per weight of the powder coating. 13. The electrosurgical medical device of claim 11, wherein the substrate includes a metal. 14. An electrosurgical device including an electrode, a handle connected to the electrode and an electrical source in communication with the handle to transfer electrical energy to the electrode for contacting tissue in a body during an electrosurgical procedure, said electrode comprising: a conductive substrate; and at least one epoxy modified rigid silicone powder coating applied to said substrate. 15. The electrosurgical device of claim 14, wherein the epoxy modified rigid silicone powder coating includes a rigid silicone resin and a polysiloxane additive. 16. The electrosurgical device of claim 15, wherein the silicone resin is selected from the group consisting of: a phenyl polysiloxane powder resin, a methyl polysiloxane powder resin, a methyl phenyl siloxane powder resin, a phenyl silicone powder, a methyl phenyl silicone and a phenyl alkyl polysiloxane powder resin. 17. The electrosurgical device of claim 15, wherein the polysiloxane additive is selected from the group consisting of: a methyl alkyl polysiloxane, a dimethyl polysiloxane and a methyl phenyl siloxane. 18. The electrosurgical device of claim 14, wherein the conductive substrate includes a metal. 19. The electrosurgical device of claim 18, wherein the metal includes stainless steel. 20. The electrosurgical device of claim 14, wherein at least a portion of the conductive substrate includes an electrically insulative material, which is applied to the surface of the conductive substrate. 21. The electrosurgical device of claim 20, wherein only a portion of the conductive substrate underneath the insulative material includes the substantially uniform coating. 22. The electrosurgical device of claim 14, wherein a plurality of anti-microbial particles are interspersed in said powder coating. 23. The electrosurgical device of claim 22, wherein the anti-microbial particles include at least one of the group consisting of: silver particles and ceramic particles. 24. The electrosurgical device of claim 14, wherein a wet bonding material applied to the surface of the substrate and the powder coating is applied to the wet bonding material. 25. The electrosurgical device of claim 24, wherein the wet bonding material includes a primer. 26. An electrosurgical device comprising: a conductive substrate including a proximal end and a distal end; a handle connected to the proximal end of said substrate; at least one electrical transfer member connected to the handle, which transfers electrical energy from an electrical source through the handle to the conductive substrate; and at least one layer of epoxy modified rigid silicone powder applied to the surface of the substrate. 27. The electrosurgical device of claim 26, wherein the epoxy modified rigid silicone powder includes a rigid silicone resin and a polysiloxane additive. 28. The electrosurgical device of claim 27, wherein the silicone resin is selected from the group consisting of: a phenyl polysiloxane powder resin, a methyl polysiloxane powder resin, a methyl phenyl siloxane powder resin, a phenyl silicone powder, a methyl phenyl silicone and a phenyl alkyl polysiloxane powder resin. 29. The electrosurgical device of claim 27, wherein the polysiloxane additive is selected from the group consisting of: a methyl alkyl polysiloxane, a dimethyl polysiloxane and a methyl phenyl siloxane. 30. The electrosurgical device of claim 26, wherein the conductive substrate includes a metal. 31. The electrosurgical device of claim 30, wherein the metal includes stainless steel. 32. The electrosurgical device of claim 26, wherein the epoxy modified rigid silicone powder includes a plurality of anti-microbial particles. 33. The electrosurgical device of claim 32, wherein the anti-microbial particles include at least one of the group consisting of: silver particles and ceramic particles. 34. The electrosurgical device of claim 26, wherein at least a portion of the conductive substrate includes an electrically insulative material, which is applied to the surface of the conductive substrate. 35. The electrosurgical device of claim 34, wherein only a portion of the conductive substrate underneath the insulative material is coated with the epoxy modified rigid silicone powder. 36. The electrosurgical device of claim 26, wherein a wet bonding material applied to the surface of the substrate and the epoxy modified rigid silicone powder is applied to the wet bonding material. 37. The electrosurgical device of claim 36, wherein the wet bonding material includes a primer. 38. The electrosurgical device of claim 36, which includes a single substantially uniform layer of epoxy modified rigid silicone powder applied to the surface of the substrate. 39. A method of coating an electrosurgical device including a conductive substrate, said method comprising the steps of: (a) evenly applying an epoxy modified rigid silicone powder coating to a surface of the conductive substrate; and (b) at least partially curing the epoxy modified rigid silicone powder coating. 40. The method of claim 39, which includes the step of applying wet bonding material to the surface of the conductive substrate prior to step (a). 41. The method of claim 40, wherein the wet bonding material includes a primer. 42. The method of claim 39, wherein the epoxy modified rigid silicone powder coating includes a plurality of anti-microbial particles. 43. The method of claim 42, wherein the anti-microbial particles include at least one of the group consisting of: silver particles and ceramic particles. 44. The method of claim 39, which includes the step of applying an electrically insulative material to at least a portion of the surface of the conductive substrate. 45. The method of claim 44, wherein the step of applying the substantially uniform coating to the surface of the conductive substrate further includes applying the substantially uniform coating to only a portion of the surface of the conductive substrate underneath the insulative material. 46. The method of claim 39, wherein the epoxy modified rigid silicone powder coating includes a rigid silicone resin and a polysiloxane additive 47. The method of claim 46, wherein the silicone resin is selected from the group consisting of: a phenyl polysiloxane powder resin, a methyl polysiloxane powder resin, a methyl phenyl siloxane powder resin, a phenyl silicone powder, a methyl phenyl silicone and a phenyl alkyl polysiloxane powder resin. 48. The method of claim 46, wherein the polysiloxane additive is selected from the group consisting of: a methyl alkyl polysiloxane, a dimethyl polysiloxane and a methyl phenyl siloxane.