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An object of the present invention is to provide a method of transferring an object to be peeled onto a transferring member in a short time without imparting damage to the object to be peeled within a laminate. Also, another object of the present invention is to provide a method of manufacturing a s

An object of the present invention is to provide a method of transferring an object to be peeled onto a transferring member in a short time without imparting damage to the object to be peeled within a laminate. Also, another object of the present invention is to provide a method of manufacturing a semiconductor device in which a semiconductor element manufactured on a substrate is transferred onto a transferring member, typically, a plastic substrate. The methods are characterized by including: forming a peeling layer and an object to be peeled on a substrate; bonding the object to be peeled and a support through a two-sided tape; peeling the object to be peeled from the peeling layer by using a physical method, and then bonding the object to be peeled onto a transferring member; and peeling the support and the two-sided tape from the object to be peeled.

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What is claimed is: 1. A method of transferring a laminate comprising: forming an object over a first substrate with a peeling layer interposed therebetween; bonding a support to the object with a peelable adhesive medium interposed therebetween, wherein the peelable adhesive medium includes a firs

What is claimed is: 1. A method of transferring a laminate comprising: forming an object over a first substrate with a peeling layer interposed therebetween; bonding a support to the object with a peelable adhesive medium interposed therebetween, wherein the peelable adhesive medium includes a first adhesive and a second adhesive with a second substrate interposed therebetween; peeling the object from the first substrate at the peeling layer; bonding the object to a first transferring member; and peeling the support and the peelable adhesive medium from the object. 2. A method of transferring a laminate comprising: forming an object over a first substrate with a peeling layer interposed therebetween; bonding a support to the object with a peelable adhesive medium interposed therebetween, wherein the peelable adhesive medium includes a first adhesive and a second adhesive with a second substrate interposed therebetween; peeling the object from the first substrate at the peeling layer; bonding one side of the object to a first transferring member; peeling the support and the peelable adhesive medium from the object; and bonding the other side of the object to a second transferring member. 3. A method of transferring a laminate comprising: forming an object over a first substrate with a peeling layer interposed therebetween; bonding a support to the object with a peelable adhesive medium interposed therebetween, wherein the peelable adhesive medium includes a first adhesive and a second adhesive with a second substrate interposed therebetween; peeling the object from the first substrate at the peeling layer by physical means; bonding the object to a first transferring member; and peeling the support and the peelable adhesive medium from the object. 4. A method of transferring a laminate comprising: forming an object over a first substrate with a peeling layer interposed therebetween; bonding a support to the object with a peelable adhesive medium interposed therebetween, wherein the peelable adhesive medium includes a first adhesive and a second adhesive with a second substrate interposed therebetween; peeling the object from the first substrate at the peeling layer by physical means; bonding one side of the object to a first transferring member; and peeling the support and the peelable adhesive medium from the object; and bonding the other side of the object to a second transferring member. 5. A method of transferring a laminate according to any one of claims 1 to 4, wherein the object has an oxide layer comprising at least one selected from silicon oxide or metal oxide, and the oxide layer is in contact with the peeling layer. 6. A method of transferring a laminate according to any one of claims 1 to 4, wherein the peeling layer comprises a metal film containing at least one element selected from titanium, aluminum, tantalum, tungsten, molybdenum, copper, chromium, neodymium, iron, nickel, cobalt, ruthenium, rhodium, palladium, osmium, and iridium. 7. A method of transferring a laminate according to any one of claims 1 to 4, wherein the peeling layer comprises a nitride film containing at least one element selected from titanium, aluminum, tantalum, tungsten, molybdenum, copper, chromium, neodymium, iron, nickel, cobalt, ruthenium, rhodium, palladium, osmium, and iridium. 8. A method of transferring a laminate according to any one of claims 1 to 4, wherein the first transferring member comprises a plastic. 9. A method of transferring a laminate according to any one of claims 2 and 4, wherein the second transferring member comprises a plastic. 10. A method of transferring a laminate according to any one of claims 1 to 4, wherein the peelable adhesive medium comprises a two-sided tape. 11. A method of manufacturing a semiconductor device comprising: forming an object comprising a semiconductor element over a first substrate with a peeling layer interposed therebetween; bonding a support to the object with a peelable adhesive medium interposed therebetween, wherein the peelable adhesive medium includes a first adhesive and a second adhesive with a second substrate interposed therebetween; peeling the object from the first substrate at the peeling layer; bonding the object to a first transferring member; and peeling the support and the peelable adhesive medium from the object. 12. A method of manufacturing a semiconductor device comprising: forming an object comprising a semiconductor element over a first substrate with a peeling layer interposed therebetween; bonding a support to the object with a peelable adhesive medium interposed therebetween, wherein the peelable adhesive medium includes a first adhesive and a second adhesive with a second substrate interposed therebetween; peeling the object from the first substrate at the peeling layer; bonding one side of the object to a first transferring member; and peeling the support and the peelable adhesive medium from the object; and bonding the other side of the object to a second transferring member. 13. A method of manufacturing a semiconductor device comprising: forming an object comprising a semiconductor element over a first substrate with a peeling layer interposed therebetween; bonding a support to the object with a peelable adhesive medium interposed therebetween, wherein the peelable adhesive medium includes a first adhesive and a second adhesive with a second substrate interposed therebetween; peeling the object from the first substrate at the peeling layer by physical means; bonding the object to a first transferring member; and peeling the support and the peelable adhesive medium from the object. 14. A method of manufacturing a semiconductor device comprising: forming an object comprising a semiconductor element over a first substrate with a peeling layer interposed therebetween; bonding a support to the object with a peelable adhesive medium interposed therebetween, wherein the peelable adhesive medium includes a first adhesive and a second adhesive with a second substrate interposed therebetween; peeling the object from the first substrate at the peeling layer by physical means; bonding one side of the object to a first transferring member; peeling the support and the peelable adhesive medium from the object; and bonding the other side of the object to a second transferring member. 15. A method of manufacturing a semiconductor device according to any one of claims 11 to 14, wherein the semiconductor element comprises at least one selected from a thin film transistor, an organic thin film transistor, a thin film diode, a photoelectric conversion element, and a resistive element. 16. A method of manufacturing a semiconductor device according to any one of claims 11 to 14, wherein the object has an oxide layer comprising at least one selected from silicon oxide or metal oxide, and the oxide layer is in contact with the peeling layer. 17. A method of manufacturing a semiconductor device according to any one of claims 11 to 14, wherein the peeling layer comprises a metal film containing at least one element selected from titanium, aluminum, tantalum, tungsten, molybdenum, copper, chromium, neodymium, iron, nickel, cobalt, ruthenium, rhodium, palladium, osmium, and iridium. 18. A method of manufacturing a semiconductor device according to any one of claims 11 to 14, wherein the peeling layer comprises a nitride film containing at least one element selected from titanium, aluminum, tantalum, tungsten, molybdenum, copper, chromium, neodymium, iron, nickel, cobalt, ruthenium, rhodium, palladium, osmium, and iridium. 19. A method of manufacturing a semiconductor device according to any one of claims 11 to 14, wherein the first transferring member comprises a plastic. 20. A method of manufacturing a semiconductor device according to any one of claims 12 and 14, wherein the second transferring member comprises a plastic. 21. A method of manufacturing a semiconductor device according to any one of claims 11 to 14, wherein the peelable adhesive medium comprises a two-sided tape. 22. A method of manufacturing a semiconductor device according to any one of claims 11 to 14, wherein the semiconductor device is incorporated into at least one selected from the group consisting of a personal computer, a video camera, a mobile computer, a goggle-type display, a player using a recording medium, a digital camera, a mobile telephone, and an electronic book. 23. A method of transferring a laminate according to any one of claims 3 and 4, wherein the physical means comprises at least one selected from the group consisting of a human hand, a wind pressure of a gas sprayed from a nozzle, and an ultrasound. 24. A method of transferring a laminate according to any one of claims 1 to 4, wherein the step of peeling the support and the peelable adhesive medium from the object is conducted by first peeling the support from the peelable adhesive medium, and then peeling the peelable adhesive medium from the object. 25. A method of transferring a laminate according to any one of claims 1 to 4, wherein the first adhesive includes a heat-peeling adhesive, and the second adhesive includes an ultraviolet-peeling adhesive. 26. A method of manufacturing a semiconductor device according to any one of claims 13 and 14, wherein the physical means comprises at least one selected from the group consisting of a human hand, a wind pressure of a gas sprayed from a nozzle, and an ultrasound. 27. A method of manufacturing a semiconductor device according to any one of claims 11 to 14, wherein the step of peeling the support and the peelable adhesive medium from the object is conducted by first peeling the support from the peelable adhesive medium, and then peeling the peelable adhesive medium from the object. 28. A method of manufacturing a semiconductor device according to any one of claims 11 to 14, wherein the first adhesive includes a heat-peeling adhesive, and the second adhesive includes an ultraviolet-peeling adhesive.