초록 ▼

A composition and process for the precision polishing of substrates such as semi-conductor chips is disclosed. The composition and process make use of soluble or insoluble organic nitro compounds as oxidizers and/or abrasive particles. Nitrogen containing reduction products of the foregoing organic

A composition and process for the precision polishing of substrates such as semi-conductor chips is disclosed. The composition and process make use of soluble or insoluble organic nitro compounds as oxidizers and/or abrasive particles. Nitrogen containing reduction products of the foregoing organic nitro compounds may also be included.

대표청구항 ▼

I claim: 1. A method of polishing a substrate, said method comprising contacting the substrate with a polishing pad and a polishing composition wherein the polishing pad is in motion relative to the substrate and wherein the polishing composition comprises: a. abrasive particulate; b. water; c. org

I claim: 1. A method of polishing a substrate, said method comprising contacting the substrate with a polishing pad and a polishing composition wherein the polishing pad is in motion relative to the substrate and wherein the polishing composition comprises: a. abrasive particulate; b. water; c. organic nitro compounds; wherein the composition also comprises a nitrogen containing compound selected from the group consisting of nitroso compounds, azo compounds, azoxy compounds and diazo compounds. 2. A method according to claim 1 wherein the composition also comprises one or more materials selected from the group consisting of surfactants, emulsifiers, chelators and thickeners. 3. A method according to claim 1 wherein at least a portion of the organic nitro compound in the composition remains insoluble or immiscible in an aqueous portion of the composition. 4. A method according to claim 3 wherein the composition comprises a suspension or an emulsion. 5. A method according to claim 4 wherein the composition also comprises one or more materials selected from the group consisting of surfactants, emulsifiers, chelators and thickeners. 6. A method according to claim 1 wherein the nitrogen containing compound comprises a dye.