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A molecularly flexible dielectric electronic substrate for receiving an electronic device has a modulus of elasticity less tan about 500,000 psi. The molecularly flexible dielectric substrate comprises one or more sheets or layers of a molecularly flexible dielectric adhesive having a modulus of ela

A molecularly flexible dielectric electronic substrate for receiving an electronic device has a modulus of elasticity less tan about 500,000 psi. The molecularly flexible dielectric substrate comprises one or more sheets or layers of a molecularly flexible dielectric adhesive having a modulus of elasticity less than about 500,000 psi and having patterned metal foil electrical conductors thereon. The molecularly flexible dielectric adhesive may have a low glass transition temperature and the ability to withstand soldering.

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What is claimed is: 1. A molecularly flexible dielectric electronic substrate having a modulus of elasticity less than about 500,000 psi, said molecularly flexible dielectric electronic substrate comprising: a first layer of molecularly flexible dielectric adhesive having a modulus of elasticity le

What is claimed is: 1. A molecularly flexible dielectric electronic substrate having a modulus of elasticity less than about 500,000 psi, said molecularly flexible dielectric electronic substrate comprising: a first layer of molecularly flexible dielectric adhesive having a modulus of elasticity less than about 500,000 psi, having a glass transition temperature less than about 0째 C., and having the ability to withstand soldering at a temperature of about 220째 C.; a metal foil on a first surface of said first layer of molecularly flexible dielectric adhesive, wherein said metal foil is patterned to define a pattern of electrical conductors having a plurality of contact sites for receiving a plurality of contacts of an electronic device; and a plurality of electrically conductive vias through said first layer of molecularly flexible dielectric adhesive, said plurality of electrically conductive vias being in a pattern for providing electrical connection between ones of said pattern of electrical conductors on the first surface of said first layer of molecularly flexible dielectric adhesive and corresponding contact sites on a second surface of said first layer of molecularly flexible dielectric adhesive opposite the first surface thereof. 2. The molecularly flexible dielectric electronic substrate of claim 1 wherein said plurality of contact sites are in a pattern corresponding to a pattern of contacts of an electronic device. 3. The molecularly flexible dielectric electronic substrate of claim 1 further comprising an electronic device having a plurality of contacts soldered to corresponding ones of the contacts sites of the patterned metal foil on said molecularly flexible dielectric adhesive layer. 4. The molecularly flexible dielectric electronic substrate of claim 1 wherein said molecularly flexible dielectric adhesive has a modulus of elasticity less than about 100,000 psi. 5. The molecularly flexible dielectric electronic substrate of claim 1 wherein said molecularly flexible dielectric adhesive has a modulus of elasticity less than about 20,000 psi. 6. The molecularly flexible dielectric electronic substrate of claim 1 further comprising a plated electrically conductive layer on at least the contact sites of said metal foil. 7. A molecularly flexible dielectric electronic substrate comprising: at least one layer of molecularly flexible dielectric adhesive having a modulus of elasticity less than about 500,000 psi, having a glass transition temperature less than about 0째 C., and baying the ability to withstand soldering at a temperature of about 220째 C.; a metal foil on one surface of said layer of molecularly flexible dielectric adhesive, wherein said metal foil is patterned to define a pattern of electrical conductors having a plurality of contact sites for receiving the contacts of an electronic device; an electronic device having a plurality of contacts soldered to corresponding contacts sites of the patterned metal foil on said molecularly flexible dielectric adhesive layer; and a protective enclosure surrounding said electronic device and attached at least along its periphery to said molecularly flexible dielectric adhesive layer. 8. A molecularly flexible dielectric electronic substrate comprising: at least one layer of molecularly flexible dielectric adhesive having a modulus of elasticity less than about 500,000 psi, having a glass transition temperature less than about 0째 C., and having the ability to withstand soldering at a temperature of about 220째 C.; a metal foil on one surface of said layer of molecularly flexible dielectric adhesive, wherein said metal foil is patterned to define a pattern of electrical conductors having a plurality of contact sites for receiving the contacts of an electronic device; an electronic device having a plurality of contacts soldered to corresponding contacts sites of the patterned metal foil on said molecularly flexible dielectric adhesive layer; and an underfill adhesive bonding said electronic device and said molecularly flexible dielectric adhesive layer. 9. The molecularly flexible dielectric electronic substrate of claim 8 wherein said underfill adhesive includes molecularly flexible dielectric adhesive having a modulus of elasticity less than about 500, 000 psi. 10. A molecularly flexible dielectric electronic substrate comprising: a first layer of molecularly flexible dielectric adhesive having a modulus of elasticity less than about 500,000 psi, having a glass transition temperature less than about 0째 C., and having the ability to withstand soldering at a temperature of about 220째 C.; a first metal foil on a first exposed surface of said first layer of molecularly flexible dielectric adhesive, wherein said first metal foil is patterned to define a pattern of first electrical conductors having a plurality of contact sites for receiving the contacts of an electronic device; a second metal foil on a second exposed surface of said first layer of molecularly flexible dielectric adhesive opposing the first surface thereof, wherein said metal foil is patterned to define a pattern of second electrical conductors; and a plurality of electrically conductive vias through said first layer of molecularly flexible dielectric adhesive, said plurality of electrically conductive vias being in a pattern for providing electrical connection between ones of said first electrical conductors and ones of said second electrical conductors. 11. The molecularly flexible dielectric electronic substrate of claim 10 further comprising: a second layer of molecularly flexible dielectric adhesive having a modulus of elasticity less than about 500,000 psi, having a glass transition temperature less than about 0째 C., and having the ability to withstand soldering at a temperature of about 220째 C., wherein said second layer of molecularly flexible dielectric adhesive adheres to the second surface of said first layer of molecularly flexible dielectric adhesive with said patterned second metal foil therebetween; a third metal foil oh an exposed surface of said second layer of molecularly flexible dielectric adhesive, wherein said third metal foil is patterned to define a pattern of third electrical conductors; and a plurality of second electrically conductive vias through said second layer of molecularly flexible dielectric adhesive, said plurality of second electrically conductive vias being in a pattern for providing electrical connection between ones of said second electrical conductors and ones of said third electrical conductors. 12. The molecularly flexible dielectric electronic substrate of claim 10 wherein said molecularly flexible dielectric adhesive has a modulus of elasticity less than about 100,000 psi. 13. The molecularly flexible dielectric electronic substrate of claim 10 wherein said molecularly flexible dielectric adhesive has a modulus of elasticity less than about 20,000 psi. 14. The molecularly flexible dielectric electronic substrate of claim 10 in combination with at least one electronic device having a plurality of contacts thereon connected to at least certain ones of the contact sites of said first electrical conductors. 15. The molecularly flexible dielectric electronic substrate of claim 10 wherein said conductive vias are built up of plated metal. 16. The molecularly flexible dielectric electronic substrate of claim 10 further comprising a plated electrically conductive layer an at least the contact sites of said first metal foil. 17. The molecularly flexible dielectric electronic substrate of claim 11 wherein said conductive vias are built up of plated metal. 18. The molecularly flexible dielectric electronic substrate of claim 11 wherein said molecularly flexible dielectric adhesive has a modulus of elasticity less than about 100,000 psi. 19. The molecularly flexible dielectric electronic substrate of claim 11 wherein said molecularly flexible dielectric adhesive has a modulus of elasticity less than about 20,000 psi. 20. A method for making a molecularly flexible electronic substrate for receiving an electronic device comprising: providing a sheet of metal foil; providing on one a first surface of the sheet of metal foil a first layer of a molecularly flexible dielectric adhesive having a modulus of elasticity less than about 500,000 psi, having a glass transition temperature less than about 0째 C., and having the ability to withstand soldering at a temperature of about 220째 C., the first layer of molecularly flexible dielectric adhesive having a plurality of via openings therein; building up electrically conductive material on the first surface of the metal foil to fill the plurality of via openings in the first layer of molecularly flexible dielectric adhesive, thereby forming a plurality of electrically conductive vias therein; wherein the plurality of electrically conductive vias are in a pattern for providing electrical connection between the metal foil and corresponding contact sites on a second surface of the first layer of molecularly flexible dielectric adhesive opposite the first surface thereof; patterning the metal foil to form a pattern of contacts and conductors electrically connected to the electrically conductive vias in the first molecularly flexible dielectric adhesive layer; and plating at least one of the electrically conductive vias and the contacts of the patterned metal foil to provide external contacts. 21. The method of claim 20 further comprising: providing a second metal foil on the second surface of the first layer of molecularly flexible dielectric adhesive opposing the first surface thereof, wherein the second metal foil electrically connects to the plurality of electrically conductive vias in the first molecularly flexible dielectric adhesive layer; and patterning the second metal foil to form a pattern of contacts and conductors electrically connected to ones of the plurality of electrically conductive vias in the first molecularly flexible dielectric adhesive layer. 22. The method of claim 20 further comprising: after said patterning the metal foil, providing on the surface of the electrical conductors of the patterned sheet of metal foil not having the first layer of molecularly flexible dielectric adhesive thereon a second layer of a molecularly flexible dielectric adhesive having a modulus of elasticity less than about 500,000 psi, having a glass transition temperature less than about 0째 C., and having the ability to withstand soldering at a temperature of about 220째 C., the at-least second layer of molecularly flexible dielectric adhesive having a plurality of via openings therein; and building up electrically conductive material on the metal foil to fill the plurality of via openings in the second layer of molecularly flexible dielectric adhesive, thereby forming a plurality of electrically conductive vias therein. 23. The method of claim 20 further comprising electrically connecting contacts of at least one electronic device to corresponding ones of the plurality of electrically conductive vias.