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Tamper barrier enclosure with corner protection 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B65D-085/30
출원번호 US-0868596 (2004-06-15)
발명자 / 주소
  • Clark,Douglas A
  • Heitmann,Kjell A
  • Perreault,Paul G
출원인 / 주소
  • Pitney Bowes Inc.
인용정보 피인용 횟수 : 44  인용 특허 : 35

초록

A tamper protected printed circuit board assembly including a printed circuit board and a tamper wrap attached to the printed circuit board. The tamper wrap includes a plurality of side tabs extending from a main body portion and a plurality of corner protection flaps extending from the side tabs.

대표청구항

What is claimed is: 1. A tamper protected printed circuit board assembly, comprising: a printed circuit board having a top surface, a bottom surface, a plurality of side walls, and a plurality of corner edges, each of said corner edges being located between a respective two of said side walls; and

이 특허에 인용된 특허 (35)

  1. Candelore Brant, Anti-tamper integrated circuit.
  2. Stahlecker Werner,DEX, Apparatus for producing and applying a protective covering to a cut edge of an opening of a container wall.
  3. Ohlbach Ralph C. (417 Green Park Ct. Deerfield IL 60015), Assembly protecting and inventorying printed circuit boards.
  4. Kleijne Theodoor A. (Dreumel NLX) de Bruin Johannes A. J. (Montfoort NLX) Goossens Jan B. (De Bilt NLX), Data security device for protecting stored data.
  5. Petsinger Julie Ann, Electromagnetic shield to prevent surreptitious access to contactless smartcards.
  6. Craig David J. (Livingston GB6), Electronic component transportation container.
  7. MacDonald ; Jr. James D. ; Marcinkiewicz Walter M., Gel structure for combined EMI shielding and thermal control of microelectronic assemblies.
  8. Bumler Heinz (Mnchen DEX) Hoffmann Richard (Gaimersheim DEX) Schirmer Klaus (Ingolstadt DEX) Zeides Otto (Ingolstadt DEX), Housing for installation in motor vehicles.
  9. Johnson Roberta L. (Atlanta GA), Insulated shipping container.
  10. Long Stuart G. (South Laguna CA) Maciocia Michael J. (Ontario CA), Method of making packing material with anti-static coating.
  11. van de Haar Rijk (Joure NLX) Thomassen Johan H. C. (Zeist NLX), Packing method and a blank for use therein.
  12. JP Leon, Postage metering system.
  13. Mori,Hiroyuki; Tsukada,Yutaka; Yamanaka,Kimihiro, Printed circuit board and electronic package using same.
  14. Koyama, Yasuhiro; Bando, Takeshi; Iida, Yukiko; Saitou, Ikuya, Process and apparatus for manufacturing packages.
  15. Kasper Kevin (Elm Grove WI) Nigro Paul (Norridge IL), RFI shielded, multiple part container and components thereof.
  16. Imer Rodney Haydn,ESX, Rectangular thin film pack.
  17. Schenk Robert J. (28 Valley View Ter. Wayne NJ 07470), Removable rigid support structure for circuit cards.
  18. Kleijne Theodoor A. (Dreumel NLX), Security device for sensitive data.
  19. Kleijne Theodoor A. (Dreumel NLX) Goossens Jan B. (De Bilt NLX), Security device for stored sensitive data.
  20. Kleijne Theodoor A. (ZA Dreumel NLX), Security device for the secure storage of sensitive data.
  21. Hiroyuki Tomooka JP, Security sensor having disturbance detecting capability.
  22. Stoltz Dennis J. (Austell GA), Self-centering laminated process for corrugated containers and blank therefor.
  23. Ohlbach Ralph C. (417 Green Park Ct. Deerfield IL 60015), Shipping container for printed circuit boards and other items.
  24. Perreault,Paul G; Clark,Douglas A; Heitmann,Kjell A, System and method for installing a tamper barrier wrap in a PCB assembly, including a PCB assembly having improved heat sinking.
  25. Rivenberg Howard Christopher (Mercer NJ) Levine Aaron William (Mercer NJ) Desai Nitin Vithalbhai (Mercer NJ), Tamper detection device.
  26. Comerford Liam D. (Carmel NY) Ledermann Peter G. (Pleasantville NY) Levy Lawrence I. (Yorktown Heights NY) White Steve R. (New York NY), Tamper resistant packaging for information protection in electronic circuitry.
  27. Tuttle John R. ; Wood ; Jr. Clifton W. ; McCabe Arthur Barney, Tamper resistant smart card and method of protecting data in a smart card.
  28. MacPherson Hugh,GBX, Tamper respondent enclosure.
  29. Sinha, Arvind Kumar, Tamper-proof enclosure for a circuit card.
  30. Simpson Carolyn N. (1946 E. 6400 South Salt Lake City UT 84121) Perry John A. (1838 Wasatch Dr. Salt Lake City UT 84104), Tamper-proof wrap.
  31. Weingart Steve H. (Peekskill NY), Tamper-resistant packaging for protection of information stored in electronic circuitry.
  32. Farquhar, Donald S.; Feger, Claudius; Markovich, Voya; Papathomas, Konstantinos I.; Poliks, Mark D.; Shaw, Jane M.; Szeparowycz, George; Weingart, Steve H., Tamper-responding encapsulated enclosure having flexible protective mesh structure.
  33. Piosenka Gerald V. (Scottsdale AZ) Harrison David M. (Mesa AZ) Chandos Ronald V. (Tempe AZ), Tamperproof arrangement for an integrated circuit device.
  34. Piosenka Gerald V. (Scottsdale AZ) Harrison David M. (Mesa AZ) Chandos Ronald V. (Tempe AZ), Tamperproof arrangement for an integrated circuit device.
  35. David Leonard Stevens, Thermally conductive case for electrical components and method of manufacture therefor.

이 특허를 인용한 특허 (44)

  1. Pham, Cuong V.; Chubin, David E.; Clarke, Robert A.; Kuan, Aaron D., Anti-tamper mesh.
  2. Fisher, Michael J.; Long, David C.; Merte, Donald; Weiss, Robert; Weiss, Thomas, Applying pressure to adhesive using CTE mismatch between components.
  3. Brodsky, William L.; Dragone, Silvio; Krabbenhoft, Roger S.; Long, David C.; Oggioni, Stefano S.; Peets, Michael T.; Santiago-Fernandez, William, Circuit boards and electronic packages with embedded tamper-respondent sensor.
  4. Brodsky, William L.; Dragone, Silvio; Krabbenhoft, Roger S.; Long, David C.; Oggioni, Stefano S.; Peets, Michael T.; Santiago-Fernandez, William, Circuit boards and electronic packages with embedded tamper-respondent sensor.
  5. Brodsky, William L.; Busby, James A.; Cohen, Edward N.; Isaacs, Phillip Duane, Circuit layouts of tamper-respondent sensors.
  6. Brodsky, William L.; Busby, James A.; Cohen, Edward N.; Isaacs, Phillip Duane, Circuit layouts of tamper-respondent sensors.
  7. Isaacs, Phillip D.; Peets, Michael T.; Wei, Xiaojin, Electronic package with heat transfer element(s).
  8. Bartley, Gerald; Becker, Darryl; Doyle, Matthew S.; Jeanson, Mark, Embossed printed circuit board for intrusion detection.
  9. Brodsky, William L.; Dangler, John R.; Dreiss, Zachary T.; Long, David C.; Peets, Michael T.; Santiago-Fernandez, William; Weiss, Thomas, Enclosure with inner tamper-respondent sensor(s).
  10. Brodsky, William L.; Dangler, John R.; Dreiss, Zachary T.; Long, David C.; Peets, Michael T.; Santiago-Fernandez, William; Weiss, Thomas, Enclosure with inner tamper-respondent sensor(s).
  11. Fisher, Michael J.; Long, David C.; Peets, Michael T.; Weiss, Thomas, Enclosure with inner tamper-respondent sensor(s) and physical security element(s).
  12. Fisher, Michael J.; Long, David C.; Peets, Michael T.; Weiss, Thomas, Enclosure with inner tamper-respondent sensor(s) and physical security element(s).
  13. Fisher, Michael J.; Long, David C.; Peets, Michael T.; Weiss, Thomas, Enclosure with inner tamper-respondent sensor(s) and physical security element(s).
  14. Isaacs, Phillip D.; Peets, Michael T.; Wei, Xiaojin, Manufacturing electronic package with heat transfer element(s).
  15. Dangler, John R.; Isaacs, Phillip Duane; Long, David C., Method of fabricating tamper-respondent sensor.
  16. Busby, James A.; Isaacs, Phillip Duane; Santiago-Fernandez, William, Multi-layer stack with embedded tamper-detect protection.
  17. Busby, James A.; Isaacs, Phillip Duane; Santiago-Fernandez, William, Multi-layer stack with embedded tamper-detect protection.
  18. Busby, James A.; Isaacs, Phillip Duane; Santiago-Fernandez, William, Multi-layer stack with embedded tamper-detect protection.
  19. Busby, James A.; Isaacs, Phillip Duane; Santiago-Fernandez, William, Multi-layer stack with embedded tamper-detect protection.
  20. Busby, James A.; Isaacs, Phillip Duane; Santiago-Fernandez, William, Multi-layer stack with embedded tamper-detect protection.
  21. Brodsky, William L.; Dangler, John R.; Isaacs, Phillip Duane; Long, David C.; Peets, Michael T., Overlapping, discrete tamper-respondent sensors.
  22. Busby, James A.; Dragone, Silvio; Fisher, Michael J.; Gaynes, Michael A.; Long, David C.; Rodbell, Kenneth P.; Santiago-Fernandez, William; Weiss, Thomas, Tamper-proof electronic packages formed with stressed glass.
  23. Busby, James A.; Dragone, Silvio; Fisher, Michael J.; Gaynes, Michael A.; Long, David C.; Rodbell, Kenneth P.; Santiago-Fernandez, William; Weiss, Thomas, Tamper-proof electronic packages formed with stressed glass.
  24. Busby, James A.; Dragone, Silvio; Gaynes, Michael A.; Rodbell, Kenneth P.; Santiago-Fernandez, William, Tamper-proof electronic packages with stressed glass component substrate(s).
  25. Busby, James A.; Dragone, Silvio; Gaynes, Michael A.; Rodbell, Kenneth P.; Santiago-Fernandez, William, Tamper-proof electronic packages with stressed glass component substrate(s).
  26. Campbell, Levi A.; David, Milnes P.; Demetriou, Dustin W.; Ellsworth, Jr., Michael J., Tamper-proof electronic packages with two-phase dielectric fluid.
  27. Campbell, Levi A.; David, Milnes P.; Demetriou, Dustin W.; Ellsworth, Jr., Michael J., Tamper-proof electronic packages with two-phase dielectric fluid.
  28. Brodsky, William L.; Busby, James A.; Isaacs, Phillip Duane; Long, David C., Tamper-respondent assemblies.
  29. Brodsky, William L.; Busby, James A.; Isaacs, Phillip Duane; Long, David C., Tamper-respondent assemblies.
  30. Brodsky, William L.; Busby, James A.; Dreiss, Zachary T.; Fisher, Michael J.; Long, David C.; Santiago-Fernandez, William; Weiss, Thomas, Tamper-respondent assemblies with bond protection.
  31. Brodsky, William L.; Busby, James A.; Dreiss, Zachary T.; Fisher, Michael J.; Long, David C.; Santiago-Fernandez, William; Weiss, Thomas, Tamper-respondent assemblies with bond protection.
  32. Brodsky, William L.; Busby, James A.; Dreiss, Zachary T.; Fisher, Michael J.; Long, David C.; Santiago-Fernandez, William; Weiss, Thomas, Tamper-respondent assemblies with bond protection.
  33. Brodsky, William L.; Busby, James A.; Cohen, Edward N.; Dragone, Silvio; Fisher, Michael J.; Long, David C.; Peets, Michael T.; Santiago-Fernandez, William; Weiss, Thomas, Tamper-respondent assemblies with enclosure-to-board protection.
  34. Brodsky, William L.; Busby, James A.; Cohen, Edward N.; Dragone, Silvio; Fisher, Michael J.; Long, David C.; Peets, Michael T.; Santiago-Fernandez, William; Weiss, Thomas, Tamper-respondent assemblies with enclosure-to-board protection.
  35. Brodsky, William L.; Busby, James A.; Cohen, Edward N.; Dragone, Silvio; Fisher, Michael J.; Long, David C.; Peets, Michael T.; Santiago-Fernandez, William; Weiss, Thomas, Tamper-respondent assemblies with enclosure-to-board protection.
  36. Brodsky, William L.; Busby, James A.; Cohen, Edward N.; Dragone, Silvio; Fisher, Michael J.; Long, David C.; Peets, Michael T.; Santiago-Fernandez, William; Weiss, Thomas, Tamper-respondent assemblies with enclosure-to-board protection.
  37. Dangler, John R.; Long, David C.; Peets, Michael T., Tamper-respondent assemblies with region(s) of increased susceptibility to damage.
  38. Busby, James A.; Fisher, Michael J.; Gaynes, Michael A.; Long, David C.; Weiss, Thomas, Tamper-respondent assemblies with trace regions of increased susceptibility to breaking.
  39. Busby, James A.; Isaacs, Phillip Duane, Tamper-respondent assembly with nonlinearity monitoring.
  40. Busby, James A.; Isaacs, Phillip Duane, Tamper-respondent assembly with nonlinearity monitoring.
  41. Isaacs, Phillip Duane, Tamper-respondent assembly with protective wrap(s) over tamper-respondent sensor(s).
  42. Fisher, Michael J.; Long, David C.; Peets, Michael T.; Weiss, Robert; Weiss, Thomas; Tersigni, James E., Tamper-respondent assembly with vent structure.
  43. Fisher, Michael J.; Long, David C.; Peets, Michael T.; Weiss, Robert; Weiss, Thomas; Tersigni, James E., Tamper-respondent assembly with vent structure.
  44. Dangler, John R.; Isaacs, Phillip Duane; Long, David C., Tamper-respondent sensors with formed flexible layer(s).
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