IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0081028
(2002-02-21)
|
우선권정보 |
EP-01126708(2001-11-08) |
발명자
/ 주소 |
|
출원인 / 주소 |
- F & K Delvotec Bondtechnick GmbH
|
대리인 / 주소 |
Knobbe, Martens, Olson & Bear, LLP
|
인용정보 |
피인용 횟수 :
3 인용 특허 :
8 |
초록
▼
A mechanism for exchanging chip-carrier plates in a hybrid chip-bonding machine having a plurality of chip-carrier plates, a magazine to store the plurality of chip-carrier plates, and a transport arrangement having a first and second clamping device that are disposed on a movable holder is disclose
A mechanism for exchanging chip-carrier plates in a hybrid chip-bonding machine having a plurality of chip-carrier plates, a magazine to store the plurality of chip-carrier plates, and a transport arrangement having a first and second clamping device that are disposed on a movable holder is disclosed. The transport arrangement is designed to remove a selected chip-carrier plate from the magazine and deliver it to a chip processing station. After processing, the selected chip-carrier plate is removed and deposited in the magazine. Movement of the chip-carrier plates is controlled such that the selected chip-carrier plate is positioned at a collection point to be collected from the magazine. Movement of the transport arrangement holder is controlled such that the first and second clamping devices are disposed in a vertical arrangement on the holder and are constructed to individually release or grip a chip-carrier plate in a similar angular position of the holder.
대표청구항
▼
The invention claimed is: 1. A mechanism for exchanging chip-carrier plates for use in a hybrid chip-bonding machine having a chip-detaching system and a common base element, the mechanism comprising: a plurality of chip-carrier plates; a magazine having a plurality of slots to store the plurality
The invention claimed is: 1. A mechanism for exchanging chip-carrier plates for use in a hybrid chip-bonding machine having a chip-detaching system and a common base element, the mechanism comprising: a plurality of chip-carrier plates; a magazine having a plurality of slots to store the plurality of chip-carrier plates, wherein the magazine vertically moves the chip-carrier plates so that a selected chip-carrier plate can be positioned in a release position and an empty slot can be positioned in a receiving position; a transport arrangement having a first and a second clamping device that are disposed on a movable holder in a manner which is attached to a base via an extension arm such that the transport arrangement is designed to remove a selected chip-carrier plate from the magazine in a first angular orientation, deliver the selected chip-carrier plate to a processing station of the chip-detaching system, and after processing remove the selected chip-carrier plate from the processing station and deposit the selected chip-carrier plate in the magazine, wherein the transport mechanism substantially maintains the chip carrier plate in the first angular orientation throughout the whole transport process and wherein the first and second clamping devices are positioned in the transport arrangement so as to substantially simultaneously remove a new selected chip carrier plate from the magazine while depositing the selected chip carrier plate in the magazine and so as to substantially simultaneously remove a selected chip carrier plate from the processing station while depositing the selected chip corner plate in the magazine; a first controller configured to move the chip-carrier plates within the magazine in a manner such that the selected chip-carrier plate is positioned at a collection point to be collected from the magazine; and a second controller configured to move the movable holder of the transport arrangement, wherein the second controller allows for vertical movement of the first and second clamping devices in a predetermined displacement range and also one dimensional longitudinal movement in the direction of the extension arm of the first and second clamping devices along a predetermined displacement range wherein the first and second clamping devices are disposed one above the other in a vertical arrangement on the holder and are constructed so that each can individually release or grip a chip-carrier plate on one and the same angular position of the holder. 2. The mechanism of claim 1, wherein the first and second clamping devices comprise a receiving element with a pneumatically or electrically actuated clamp for the controllable fixation of a chip-carrier plate or the release thereof. 3. The mechanism of claim 1, wherein the chip-carrier plates are constructed as plates with a substantially square outer shape and engagement bores to engage the clamping devices of the transport arrangement as well as a holding device of the chip-detaching system. 4. The mechanism of claim 1, wherein the chip-carrier plates are designed to receive conventional chip carriers selected from the group consisting of a type of the waffle pack, gel pack, and carrier-film frame. 5. The mechanism of claim 1, wherein the first and second clamping devices are attached to a common base element that can be displaced vertically with respect to a housing of the transport arrangement. 6. A method of operating a mechanism for exchanging chip-carrier plates in a hybrid chip-bonding machine, wherein, when a transport arrangement of an exchanging mechanism is in a first working position, comprising the steps of: vertically moving the chip carrier plates in a magazine such that a selected chip carrier plate is positioned in a release position and an empty slot is positioned in a receiving position; removing a selected chip-carrier plate from the release position in a first angular orientation in the magazine by vertically moving a transport arrangement vertically and longitudinally along predetermined one dimensional displacement ranges defined by an extension arm while substantially simultaneously depositing another chip-carrier plate into the receiving position in the magazine, which has been taken out of a processing station, wherein the selected chip carrier plate and the another chip carrier plate are oriented in the magazine so as to be positioned one above the other to thereby facilitate substantially simultaneous removal and depositing in a magazine, and when the transport arrangement is in a second working position, transferring the chip-carrier plates taken from the magazine into the processing station while substantially maintaining the chip carrier plates in the first angular orientation, removing the processed chip-carrier plates from the processing station, such that each transport event from the magazine to the processing station and in the reverse direction is carried out while a chip-carrier plate is being handled in the processing station. 7. The method of claim 6, wherein delivering the selected chip-carrier plate to the processing station further includes the step of returning the selected chip-carrier plate from the processing station to the magazine. 8. The method of claim 6, wherein the transport arrangement moves only in a straight line in both directions between the first and second working positions. 9. The method of claim 6, wherein the steps are performed in the listed order. 10. The method of claim 6, wherein the steps are performed in the reverse of the listed order. 11. A mechanism for exchanging chip-carrier plates in a chip-bonding machine having a processing station, the mechanism comprising: a magazine having a plurality of slots to store the chip-carrier plates, wherein the magazine vertically moves the chip carrier plates so that a selected chip carrier is positioned in a release position and an empty slot is positioned in a receiving position; a transport arrangement having a first and second clamping device that are attached to a base via an extension arm wherein the first and second claming devices are disposed on a movable holder so as to be positioned one above the other in vertical alignment wherein the movable holder moves both vertically and longitudinally in a single dimension defined by the extension arm along predefined ranges such that the transport arrangement is designed to remove a selected chip-carrier plate from the magazine in a first angular orientation, deliver the selected chip-carrier plate to the processing station, and after processing remove the selected chip-carrier plate from the processing station and deposit the selected chip-carrier plate in the magazine in the receiving position while substantially maintaining the chip carrier plate in the first angular orientation throughout the transport process while substantially simultaneously removing another chip carrier plate from the release position; and a first control component that is configured to move the holder of the transport arrangement, wherein the first and second clamping devices are disposed one above the other on the holder and are configured in a manner such that each clamping device individually releases or grips at least one of the chip-carrier plates in a position relative to the holder. 12. The mechanism of claim 11, wherein the mechanism further comprises a second control component. 13. The mechanism of claim 12, wherein the second control component is configured to move the at least one of the chip-carrier plates within the magazine in a manner such that the selected chip-carrier plate is positioned at a collection point to be collected from the magazine. 14. The mechanism of claim 11, wherein the first and second clamping devices comprise a receiving element with an actuated clamp for the controllable fixation or release of at least on of the chip-carrier plates. 15. The mechanism of claim 14, wherein the actuated clamp is a pneumatically actuated clamp. 16. The mechanism of claim 14, wherein the actuated clamp is an electrically actuated clamp. 17. The mechanism of claim 11, wherein the chip-carrier plates are constructed as plates with a substantially square outer shape and engagement device. 18. The mechanism of claim 17, wherein the engagement device is used by the transport arrangement as a holding device. 19. The mechanism of claim 18, wherein the engagement device comprise bores, which are configured to engage the clamping devices of the transport arrangement. 20. The mechanism of claim 11, wherein the chip-carrier plates are designed to receive conventional chip carriers. 21. The mechanism of claim 20, wherein the conventional chip-carriers are carrier types selected from the group consisting of a waffle pack, a gel pack, and a carrier-film frame. 22. The mechanism of claim 11, wherein the mechanism further comprises a common base element and a transport arrangement housing. 23. The mechanism of claim 22, wherein the first and second clamping devices are attached to the common base element. 24. The mechanism of claim 23, wherein the common base element may be displaced vertically with respect to the transport arrangement housing. 25. The mechanism of claim 11, wherein the chip-bonding machine is a hybrid chip-bonding machine. 26. The mechanism of claim 11, wherein the mechanism further comprises a chip-detaching system. 27. The mechanism of claim 26, wherein the chip-detaching system comprises the processing station. 28. The mechanism of claim 11, wherein the first and second clamping devices are disposed one above the other in a vertical arrangement on the holder. 29. The mechanism of claim 11, wherein the first and second clamping devices are configured so that each clamping device individually releases or grips a chip-carrier plate in a substantially similar position relative to the holder. 30. The mechanism of claim 29, wherein the position includes an angular position.
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