초록 ▼

To obtain an adhesive having both a high initial adhesive capacity and high heat resistance, a fusible adhesive which can be cross-linked by radiation and a low tendency to creep is provided. The adhesive contains 0 to 40 weight percent of at least one elastomer which cannot be cross-linked by radia

To obtain an adhesive having both a high initial adhesive capacity and high heat resistance, a fusible adhesive which can be cross-linked by radiation and a low tendency to creep is provided. The adhesive contains 0 to 40 weight percent of at least one elastomer which cannot be cross-linked by radiation, 15 to 40 weight percent of at least one compound containing at least two olefinic double bonds, and 20 to 85 weight percent of at least one tackifier. The adhesive is especially suitable for use on high speed labeling machines.

대표청구항 ▼

What is claimed is: 1. A low-creep radiation-crosslinkable hotmelt pressure-sensitive adhesive composition comprising: (A) 0 to 40% by weight of at least one natural or synthetic, non-radiation-crosslinkable elastomer as component (A); (B) 15 to 40% by weight of at least one radiation-crosslinkable

What is claimed is: 1. A low-creep radiation-crosslinkable hotmelt pressure-sensitive adhesive composition comprising: (A) 0 to 40% by weight of at least one natural or synthetic, non-radiation-crosslinkable elastomer as component (A); (B) 15 to 40% by weight of at least one radiation-crosslinkable compound containing at least two olefinic double bonds selected from the group consisting of component (B1), component (B2) and component (B3), wherein (B1) component (B1) is at least one diolefin homopolymer and/or copolymer having olefinic double bonds along the main chain and having a percentage content of recurring diolefin units being 50 to 100% by weight selected from the group consisting of homo-or copolymers of ,1, 3-pentadiene, 2-ethyl-1 3-butadiene, 2-propyl-1,3-butadiene, 2-isopropyl-1,3-butadiene, 2-hexyl-1,3-butadiene, 2,3-dimethyl-1,3-butadiene, 2,3-diethyl-1,3-butadiene, 2-methyl-1,3-pentadiene, 2-methyl-1,3-hexadiene, 2-methyl-1,3-octadiene, 2-methyl-1,3-decadiene, 2,3-dimethyl-1,3-pentadiene, 2,3-dimethyl-1,3-hexadiene, 2,3-dimethyl-1,3-octadiene, 2,3-dimethyl-1,3-decadiene, 2-methyl-1,3-cyclopentadiene, 2-methyl-1,3-cyclohectadiene, 2, 3-dimethyl-1,3-cyclopentadiene, 2,3-dimethyl-1,3-cyclohexadiene, 2-chloro-1,3-butadiene, 2,3-dichloro-1,3-butadiene, 1-fluoro-1,3-butadiene, 2-chloro-1,3-pentadiene, 2-chloro-1,3-cyclopentadiene and 2-chloro-1,3-cyclohexadiene; (B2) component (B2) is at least one compound having olefinic double bonds in the side chains and having a percentage content of recurring diolefin units of 50 to 100% by weight and a percentage content of vinylic double bonds of from 5 to 100%, based on the total number of olefinic double bonds in component (B2), selected from the group consisting of i) homopolymers and/or alternating copolymers and/or statistical gradient copolymers of 1,3-butadiene, 2-methyl-1,3-butadiene (isoprene), 1,3-pentadiene and/or cyclopentadiene; and ii) homo-and/or copolymers of monomers selected from the group consisting of 1,3-butadiene, 2-methyl-1,3-butadiene, 1,3-pentadiene and/or cyclopentadiene which contain at least one functional group selected from the group consisting of hydroxyl groups, amino groups, epoxide groups, isocyanate groups, carboxyl groups, carboxylic anhydride groups, mercapto groups, silane groups and hydrosilyl groups; (B3) component (B3) is at least one acrylate or methacrylate ester with a (meth)acrqlate functionality of at least two selected from the group consisting of acrylate and methacrylate esters of aromatic polyols, aliphatic polyols, cycloaliphatic polyols, and polyether alcohols; and (C) 20 to 85% by weight of at least one tackifying resin as component (C); wherein said adhesive composition is solid at 20 degrees C and does not contain any sulfur-group-containing crosslinker. 2. A low-creep radiation-crosslinkable hotmelt pressure-sensitive adhesive as claimed in claim 1, wherein at least one of component (B1) or component (B2) is present in said adhesive and is modified by at least one radiation-crosslinkable functional group other than olefinic double bonds. 3. A low-creep radiation-crosslinkable hotmelt pressure-sensitive adhesive composition as claimed in claim 1, wherein component (B2) is present in said adhesive comDosttion and is a copolymer obtained i) by reaction of two or more monomers selected from the group consisting of 1,3-butadiene, 2-methyl-1,3-butadiene, 1,3-pentadiene and cyclopentadiene or ii) by reaction of one or more monomers selected from the group consisting of 1,3-butadiene, 2-methyl-1,3-butadiene, 1,3-pentadiene and cyclopentadiene with one or more monomers selected from the group consisting of 2,3-dimethyl-1,3-butadiene, 1,4-pentadiene, 2,3-pentadiene, ethylene, propylene, butylene, hexene, octene, acrylesters, aciylonitrile, vinyl esters, and vinyl nitrile. 4. A low-creep radiation-crosslinkable hotmelt pressure-sensitive adhesive composition as claimed in claim 1, wherein component (A) is present in said adhesive composition and is selected from the group consisting of acrylates, polyester urethanes, ethylene acrylates, butyl rubbers; natural rubber; ethylene/propylene copolymers; ethylene/vinyl acetate copolymers, styrene copolymers and mixtures thereof. 5. A low-creep radiation-crosslinkable hotmelt pressure-sensitive adhesive as claimed in claim 1, wherein component (A) is present in said adhesive and is comprised of at least one styrene block polymer. 6. A low-creep radiation-crosslinkable hotmelt pressure-sensitive adhesive composition comprising: -5 to 20% by weight of at least one elastomer selected from the group consisting of styrene block copolymers, ethylene/vinyl acetate copolymers and mixtures thereof as component (A); -15 to 40% by weight of at least one radiation-crosslinkable compound selected from the group consisting of butadiene homopolymers with a 1,2-vinyl content of 30 to 90%, alternating and statistical gradient copolymers of butadiene with a 1,2-vinyl content of 30 to 90% and (meth)acrylate esters of polyother alcohols as component (B); -20 to 85% by weight of at least one tackifying resin as component (C); -0.1 to 10% by weight of at least one photoinitiator as component (D); -0 to 30% by weight of at least one plasticizer as component (F); and -0.1 to 1% by weight of at least one antioxidant as component (H); wherein said adhesive composition is solid at 20 degrees C and does not contain depolymerizod polymer any sulfur-group-containing crosslinker. 7. A low-creep radiation-crosslinkable hotmelt pressure-sensitive adhesive as claimed in claim , wherein at least one of component (B1) or component (B2) is present in said adhesive and is modified by at least one radiation-crosslinkable functional group other than olefinic double bonds selected from the group consisting of acrylate groups, methacrylate groups and epoxide groups. 8. A low-creep radiation-crosslinkable hotmelt pressure-sensitive adhesive ags claimed in claim 1, wherein component (A) is present in said adhesive and is selected from the group consisting of styrene/diene block copolymers, styrene/ethylene/butylene block copolymers and styrenelethyfenelpropylene/styrene block copolymers. 9. A low-creep radiation-crosslinkable hotmelt pressure-sensitive adhesive as claimed in claim 1, wherein component (B2) is present in said adhesive and is selected from the group consisting of home-and copolymers of monomers selected from the group consisting of 1, 3-butadiene, 2-methyl-1,3-butadiene, 1,3-pentadiene and cyclopentadiene which contain two or three functional groups. 10. A low-creep radiation-crosslinkable hotmelt pressure-sensitive adhesive as claimed in claim 1, wherein component (B2) is present in said adhesive and is selected from the group consisting of homo-and copolymers of monomers selected from the group consisting of 1, 3-butadiene, 2-methyl-1,3-butadiene, 1,3-pentadiene and cyclopentadiene which contain two or three functional groups selected from the group consisting of hydroxyl groups, amino groups, epoxide groups, isocyanate groups carboxyl groups, carboxylic anhydride groups, mercapto groups, silane groups and hydrosilyl groups. 11. A low-creep radiation-crosslinkable hotmelt pressure-sensitive adhesive as claimed in claim 1, wherein component (B3) is present in said adhesive and is selected from the group consisting of dipropylene glycol diacrylate, tnpropylene glycol diacrylate, tetrapropylene glycol diacylate, neopentyl glycol propoxylate di(meth) acrylates, trimethyloipropane tri(meth)acryiate, trimethyloipropane monoethoxytri(meth)acrylate and pentaerythritol triacrylate. 12. A low-creep radiation-crosslinkable hotmelt pressure-sensitive adhesive composition as claimed in claim 1, wherein component (C) comprises a terpene hydrocarbon resin. 13. A low-creep radiation-crosslinkable hotmeft pressure-sensitive adhesive composition as claimed in claim 1, additionally compnsing at least one photoinitiator. 14. A low-creep radiation-crosslinkable hotmelt pressure-sensitive adhesive as claimed in claim 1, wherein component (A) is comprised of at least one styrene black polymer, component (B) is comprised of at least one of polybutadiene, polyisoprene or a (meth) acrylate ester of a polyol selected from the group consisting of aromatic polyols, aliphatic polyols, cycloaliphatic polyols, and polyether alcohols, and said adhesive additionally comprises at least one photoinitiator. 15. A low-creep radiation-crosslinkable hotmelt pressure-sensitive adhesive composition as claimed in claim 1 additionally comprising at least one non-elastomeric polymer selected from the group consisting of ethylene/n-butyl acrylate copolymers, ethylene/(meth) acrylic acid copolymers, amorphous polyolefins, polyamides, and polyphenylene oxide. 16. A low-creep radiation-crosslinkable hotmelt pressure-sensitive adhesive composition as claimed in claim 1 additionally comprising at least one adhesion promoter. 17. A process for attaching a label to an article selected from the group consisting of hollow plastic containers, aerosol cans, and contour bottles, said process comprising joining said label to said article using a radiation-crosslinkable hotmelt pressure-sensitive adhesive therfore and exposing said adhesive to radiation selected from the group consisting of UV radiation and electron beam radiation. 18. A process as claimed in claim 17 wherein at least one of either said label or said article is comprised of plastic. 19. A process for attaching a label to a substrate, said process comprising joining said label to said substrate using a radiation-crosslinkable hotmelt pressure-sensitive adhesive in accordance with claim 1 and exposing said adhesive to radiation selected from the group consisting of UV radiation and electron beam radiation. 20. A process as claimed in claim 19 wherein at least one of either said label or said substrate is comprised of plastic. 21. A process for attaching a label to a substrate, said process comprising joining said label to said substrate using a radiation-crosslinkabte hotmelt pressure-sensitive adhesive in accordance with claim 6 and exposing said adhesive to radiation selected from the group consisting of UV radiation and electron beam radiation. 22. A process as claimed in claim 21 wherein both said label and said substrate are comprised of plastic.