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Thermal spreading resistance, associated with small geometry electronic features that generate heat on a semiconductor, may be reduced through the addition of a thermally conductive fluid. For example, a dielectric fluid may be used within a volume between a semiconductor package and the semiconduct

Thermal spreading resistance, associated with small geometry electronic features that generate heat on a semiconductor, may be reduced through the addition of a thermally conductive fluid. For example, a dielectric fluid may be used within a volume between a semiconductor package and the semiconductor substrate. Therefore, direct thermal cooling may be employed to reduce the thermal spreading resistance often encountered in MMIC power amplifier devices. Furthermore, exemplary methods to achieve this sealing are described herein.

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We claim: 1. A semiconductor package comprising: a semiconductor substrate having a first side and a second side opposite said first side, wherein said semiconductor substrate comprises a heat source; a heatsink configured on said first side of said semiconductor substrate, wherein said heatsink is

We claim: 1. A semiconductor package comprising: a semiconductor substrate having a first side and a second side opposite said first side, wherein said semiconductor substrate comprises a heat source; a heatsink configured on said first side of said semiconductor substrate, wherein said heatsink is configured to remove heat from said semiconductor substrate; a package configured on said second side of said semiconductor substrate and forming a volume between said package and said semiconductor substrate; and a heat transfer fluid within said volume, wherein a combined thermal conductance is improved by 25 to 500%, over the thermal conductance of air, due to the addition of said heat transfer fluid. 2. A semiconductor package comprising: a semiconductor substrate having a first side and a second side opposite said first side, wherein said semiconductor substrate comprises a heat source; a heatsink configured on said first side of said semiconductor substrate, wherein said heatsink is configured to remove heat from said semiconductor substrate; a package configured on said second side of said semiconductor substrate and forming a volume between said package and said semiconductor substrate; and a heat transfer fluid within said volume, wherein said semiconductor package comprises a MMIC power amplifier. 3. The semiconductor package of claim 2, wherein said MMIC power amplifier is configured to be biased such that a maximum power output of said MMIC power amplifier is increased by 10 to 40% with respect to the same MMIC power amplifier without said heat conductive fluid. 4. An electronic configuration for removing heat from small dissipating electronic features on a semiconductor comprising: a semiconductor device located on a substrate, said semiconductor device being defined by a first area on said substrate; a heatsink configured in proximity to said substrate and configured to remove heat from said substrate, wherein said heatsink is defined by a second area on said substrate, and wherein the ratio of said first area divided by said second area is less than 0.001; and a heat transfer fluid in direct contact with said substrate, wherein said heat transfer fluid is configured to remove heat from said semiconductor device, and wherein said heat transfer fluid is electrically non-conductive. 5. The electronic configuration of claim 4, wherein the small dissipating electronic feature is a field effect transistor in a MMIC power amplifier. 6. A method of manufacturing a semiconductor package, the method comprising the steps of: semiconductor substrate, wherein said package creates a volume, wherein said package is capable of retaining a fluid in proximity to said semiconductor; adding a thermal transfer fluid within said packages, attaching a heatsink to said semiconductor; adding a hermetic component lid to said package and configuring said hermetic component lid with a shaped preform of solder; wherein said adding step further comprises inserting a hypodermic needle though an opening in said hermetic component lid and adding said thermal transfer fluid through said hypodermic needle; and sealing said thermal transfer fluid within said package by heating said preform of solder.