IPC분류정보
국가/구분 |
United States(US) Patent
등록
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국제특허분류(IPC7판) |
|
출원번호 |
US-0865659
(2004-06-09)
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발명자
/ 주소 |
|
출원인 / 주소 |
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
3 인용 특허 :
19 |
초록
▼
A system for controlling temperature includes an atomizer that forms micron-sized hydrogen-bonded refrigerant droplets within a chamber. A vacuum pump is coupled to the chamber to lower its interior pressure. Under these conditions, the refrigerant droplets evaporate while lowering the temperature o
A system for controlling temperature includes an atomizer that forms micron-sized hydrogen-bonded refrigerant droplets within a chamber. A vacuum pump is coupled to the chamber to lower its interior pressure. Under these conditions, the refrigerant droplets evaporate while lowering the temperature of its immediate surrounding. In one embodiment, the atomizer includes a pump that forces a hydrogen-bonded liquid refrigerant through a nozzle.
대표청구항
▼
What is claimed is: 1. A compression cycle refrigeration system for controlling temperature, comprising: a chamber; a vacuum pump coupled to the chamber, the vacuum pump lowering pressure within the chamber; a supply of a liquid hydrogen-bonded refrigerant; an atomizer coupled between the supply an
What is claimed is: 1. A compression cycle refrigeration system for controlling temperature, comprising: a chamber; a vacuum pump coupled to the chamber, the vacuum pump lowering pressure within the chamber; a supply of a liquid hydrogen-bonded refrigerant; an atomizer coupled between the supply and the chamber, the atomizer outputting micron-sized refrigerant droplets into the chamber, wherein the refrigerant droplets evaporate to form a gaseous refrigerant by absorbing heat from its surrounding; and another chamber coupled between the vacuum pump and the supply, said another chamber being a heat exchanger including a conduit carrying a medium into and out from the heat exchanger to absorb heat from the gaseous refrigerant; wherein the medium is an ambient air, the vacuum pump compresses the gaseous refrigerant into said another chamber, and the gaseous refrigerant condenses inside said another chamber to form the liquid hydrogen-bonded refrigerant by loosing heat to its surrounding and is returned to the supply. 2. The system of claim 1, wherein the pressure within the chamber is reduced to 10-2 mbar or less. 3. The system of claim 1, wherein the refrigerant droplets have diameters of about 10 microns. 4. The system of claim 1, wherein the refrigerant droplets have diameters of 50 microns or less. 5. The system of claim 4, wherein the atomizer is selected from the group consisting of an ultrasonic atomizer, a piezoelectric atomizer, and an electric discharge atomizer. 6. The system of claim 4, wherein the atomizer includes: a nozzle; and a pump coupled between the supply and the nozzle, wherein the pump forces the liquid hydrogen-bonded refrigerant through the nozzle to form the micron-sized refrigerant droplets. 7. The system of claim 6, wherein the nozzle comprises pinholes. 8. The system of claim 7, wherein the pinholes have a diameter of 20 microns or less. 9. The system of claim 6, wherein the nozzle further comprises a heater to heat the nozzle. 10. The system of claim 1, wherein the liquid hydrogen-bonded refrigerant is in its liquid state at 25° C. and 1 atmosphere, and the chamber is cooled to-20°C. or less. 11. The system of claim 1, wherein the liquid hydrogen-bonded refrigerant is water. 12. The system of claim 1, wherein the hydrogen-bonded refrigerant is selected from the group consisting of alcohol and alcohol/water mixture. 13. The system of claim 12, wherein the alcohol/water mixture comprises a 70:30 mixture of ethyl alcohol and water. 14. The system of claim 1, wherein the chamber is another heat exchanger including another conduit carrying another medium into and out from said another heat exchanger to cool said another medium, and said another medium is transported away to cool a space. 15. The system of claim 1, wherein another medium is moved over the outer surface of the chamber to cool said another medium, and said another medium is transported away to cool a space. 16. The system of claim 1, wherein the supply is further coupled to the chamber to the chamber to collect any refrigerant droplets that do not evaporate. 17. A method for a compression cycle refrigeration system for controlling temperature, comprising: reducing pressure within a chamber with a vacuum pump; atomizing a liquid hydrogen-bonded refrigerant to form micron-sized hydrogen-bonded refrigerant droplets within the chamber, wherein the refrigerant droplets evaporate to form a gaseous refrigerant by absorbing heat from its surrounding; compressing the gaseous refrigerant into another chamber; condensing the gaseous refrigerant in said another chamber to form the liquid hydrogen-bonded refrigerant, wherein said condensing the gaseous refrigerant comprises passing a medium into and out of said another chamber through a conduit to heat the medium and the medium is an ambient air; and returning the liquid hydrogen-bonded refrigerant for use in said atomizing. 18. The method of claim 17, wherein the pressure within the chamber is reduced to 10-2 mbar or less. 19. The methods of claim 17, wherein the refrigerant droplets have diameters of about 10 microns. 20. The method of claim 17, wherein the refrigerant droplets have diameters of 50 microns or less. 21. The method of claim 20, wherein said atomizing comprises a method selected from the group consisting of an ultrasonic atomizing method, a piezoelectric atomizing method, and an electric discharge atomizing method. 22. The method of claim 20, wherein said atomizing comprises pumping the liquid hydrogen-bonded refrigerant through a nozzle. 23. The method of claim 22, wherein the nozzle comprises pinholes, the pinholes comprising a diameter of 20 microns or less. 24. The method of claim 23, further comprising heating the nozzle. 25. The method of claim 17, wherein the liquid hydrogen-bonded refrigerant is in its liquid state at 25° C. and 1 atmosphere, and the chamber is cooled to-20° C. or less. 26. The method of claim 17, wherein the liquid hydrogen-bonded refrigerant is water. 27. The method of claim 17, wherein the liquid hydrogen-bonded refrigerant is selected from the group consisting of alcohol and alcohol/water mixture. 28. The method of claim 27, wherein the alcohol/water mixture comprises a 70:30 mixture of ethyl alcohol and water. 29. The method of claim 17, futher comprising passing another medium into and out of the chamber to cool said another medium and said another medium is transported away to cool a space. 30. The method of claim 17, further comprising passed another medium over the chamber to cool said another medium is transported away to cool a space.
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