The invention relates to using the heat generated during thermal treatment of one or more glass sheets to melt solder. In one nonlimiting embodiment, a lead providing external access to an electrical conductive arrangement, e.g. a conductive member between and connected to spaced bus bars between la
The invention relates to using the heat generated during thermal treatment of one or more glass sheets to melt solder. In one nonlimiting embodiment, a lead providing external access to an electrical conductive arrangement, e.g. a conductive member between and connected to spaced bus bars between laminated sheets has an end portion of a connector, e.g. a lead soldered to each of the bus bars during thermal processing of the sheets, e.g. during the lamination of the sheets during a windshield manufacturing process. In another nonlimiting embodiment, the connector is soldered to the electrically conductive arrangement during the annealing of glass blanks following the heating and shaping of the glass blanks. Soldering the leads during the annealing or laminating process eliminated possible thermal damage to the sheet by having the sheet heated during the soldering operation instead of only a small surface portion of the sheet at and eliminates the cost of a separated soldering operation.
대표청구항▼
What is claimed is: 1. A method of soldering a connector to an electrically conductive arrangement, comprising: providing a first sheet having a major surface, a peripheral edge and an electrically conductive arrangement on the major surface, the conductive arrangement comprising a preselected cont
What is claimed is: 1. A method of soldering a connector to an electrically conductive arrangement, comprising: providing a first sheet having a major surface, a peripheral edge and an electrically conductive arrangement on the major surface, the conductive arrangement comprising a preselected contact area; providing a connector having a first portion and a second portion, the first portion spaced from the second portion; providing the first portion of the connector over the contact area with a layer of solder between the first portion of the connector and the preselected contact area, the solder having a melting temperature wherein the layer of solder is in contact with the first portion of the connector and the preselected contact area, and is not soldered to at least one component selected from the group of the first portion of the connector and the preselected contact area; positioning a second sheet having a peripheral edge over the first portion of the connector and the preselected contact area to provide a subassembly, the second portion of the connector extending beyond the peripheral edge of at least one of the sheets; heating the subassembly having the layer of solder in contact with the first portion of the connector and the preselected contact area, and not soldered to at least one component selected from the group of the first portion of the connector and the preselected contact area, the subassembly heated in a heating chamber having a temperature greater than the melting temperature of the solder to melt the layer of solder, and cooling the subassembly to solidify the melted layer of solder to solder the first portion of the connector and the preselected contact area together and provide electrical contact to the conductive arrangement at least through the second portion of the connector. 2. The method according to claim 1 wherein prior to the practice of the heating step further comprising the step of providing an interlayer sheet between the first and second sheets and over the first end portion of the connector and the preselected contact area, and wherein after the practice of the heating and the cooling steps the first and second sheets and the interlayer sheet are secured together to provide a laminate. 3. A method of soldering a connector to an electrically conductive arrangement, comprising: providing a first sheet having a major surface, a peripheral edge and an electrically conductive arrangement on the major surface, the conductive arrangement wherein the conductive arrangement comprises a pair of bus bars spaced from one another and defined as a first bus bar and a second bus bar with each of the bus bars having a contact area; providing a first lead and a second lead, each of the leads having a first portion and a second portion with the first portion of a lead spaced from the second portion of the respective lead; providing the first portion of the first lead over the contact area of the first bus bar with a layer of solder defined as a first layer of solder between the first portion of the first lead and the contact area of the first bus bar and the first portion of the second lead over the contact area of the second bus bar with a layer of solder defined as a second layer of solder between the first portion of the second lead and the contact area of the second bus bar, the first and second layers of solder each having a melting temperature wherein the first layer of solder is in contact with the first portion of the first lead and the contact area of the first bus bar, and is not soldered to at least one component selected from the group of the first portion of the first lead and the contact area of the first bus bar; providing a subassembly having a second sheet and an interlayer sheet between the first and second sheets, the second sheet having a peripheral edge, wherein the second sheet having the peripheral edge is positioned over the first portion of the first lead and the first portion of the second lead to provide the subassembly, wherein the second portion of the first lead and the second portion of the second lead each extend beyond the peripheral edge of at least one of the sheets; positioned over the first portion of the connector and the preselected contact area with the second portion of the connector extending beyond the peripheral edge of at least one of the first and second sheets: heating the subassembly having the first layer of solder in contact with the first portion of the first lead and the contact area of the first bus bar, and not soldered to at least one component selected from the group of the first portion of the first lead and the contact area of the first bus bar to a temperature greater than the melting temperature of the first and second layers of solder to melt the first and second layers of solder, and cooling the subassembly to (a) secure the first and second sheets together to provide a laminate, (b) solidify the melted first layer of solder to solder the first portion of the first lead and the contact area of the first bus bar together, and (c) solidify the melted second layer of solder to solder the first portion of the second lead and the contact area of the second bus bar together, and wherein electrical contact to the first bus bar is provided at least through the second portion of the first lead and electrical contact and to the second bus bar at least through the second portion of the second lead. 4. The method according to claim 3, wherein the conductive arrangement further comprises at least one electrically conductive member extending between and in electrical contact with the first and second bus bars. 5. The method according to claim 4, wherein the first and second sheets are glass sheets having substantially the same surface area and peripheral configuration and the second end portion of the first and second leads extends beyond the peripheral edge of the first and second sheets. 6. The method according to claim 5, wherein during the practice of the step of heating the subassembly, the glass sheets are heated to a temperature above 119° C. and below 170° C. 7. The method according to claim 5, wherein the laminate is a transparency. 8. The method according to claim 7, wherein the transparency is an automotive laminated transparency. 9. A method of soldering a connector to an electrically conductive arrangement, comprising: providing a first glass sheet and a second glass sheet, the glass sheets having substantially the same surface area and peripheral configuration, and a peripheral edge, the first sheet further having a major surface and an electrically conductive arrangement on the major surface, the conductive arrangement comprising a first metal foil bus bar and a second metal foil bus bar spaced from one another with each of the bus bars having a contact area, and at least one at least one electrically conductive member extending between and in electrical contact with the first and second bus bars; providing a first lead and a second lead, each lead having a first portion spaced from a second portion; providing the first portion of the first lead over the contact area of the first bus bar with a first layer of solder between the first portion of the first lead and the contact area of the first bus bar, wherein the first layer of solder is in contact with the first portion of the first lead and the contact area of the first bus bar, and is not soldered to at least one component selected from the group of the first portion of the first lead and the contact area of the first bus bar; providing the first portion of the second lead over the contact area of the second bus bar with a second layer of solder between the first portion of the second lead and the contact area of the second bus bar wherein the first and second layers of solder have a melting temperature; providing a flexible, electrically non-conductive sleeve over a portion of at least one of the leads between the first and second portions of the at least one lead; positioning an interlayer sheet over the first end portion of the first lead and the contact area of the first bus bar; positioning the second sheet over the interlayer sheet to provide a subassembly wherein the second portion of the first lead extends beyond the peripheral edge of the first and second sheets and a portion of the sleeve is between the first and second sheets; heating the subassembly to a temperature greater than the melting temperature of the solder to melt the first and second layers of solder, and cooling the subassembly to solidify the melted layers of solder to solder the first portion of the lead and the contact area of the first bus bar together and provide electrical contact to the conductive arrangement at least through the second portion of the first lead and to secure the first and second sheets together to provide a laminate wherein the laminate is an automotive laminated transparency. 10. The method according to claim 9, wherein providing a flexible, non-electrical sleeve comprises providing a flexible, electrically non-conductive sleeve over a portion of each of the first and second leads between the first and second end portions, and further comprises providing an air barrier between each one of the leads and inner surface of the sleeve, and between each one of the sleeves and adjacent surfaces of the sheets at the position where each one of the sleeves is between the glass sheets. 11. The method according to claim 10, wherein the electrically conductive member is selected from an electrically conductive coating, a wire, a coating responsive to electric stimuli, and an antenna for receiving and/or sending signals. 12. The method according to claim 10 wherein the electrically conductive member is an electrically conductive coating comprising an infrared reflecting film and a dielectric film, and the coating terminates short of the peripheral edge of the first sheet to provide a non-conductive area along the marginal edge portions of the first sheet and the ends of at least one of the bus bars extends into the nonconductive area. 13. The method according to claim 12, further comprising positioning a bus bar extension extending from the second bus bar to the first bus bar within the nonconductive area, and soldering an end of the bus bar extension to the first portion of the second lead. 14. The method according to claim 13, wherein the bus bar extension is an electrically conductive ceramic material bonded to a major surface of the first sheet within the nonconductive area. 15. The method according to claim 1, wherein the layer of solder comprises the following ingredients by weight percent: tin less than 50 indium more than 50. 16. A method of soldering a connector to an electrically conductive arrangement, comprising providing a first sheet having a major surface, a peripheral edge and an electrically conductive arrangement on the major surface, the conductive arrangement comprising a preselected contact area; providing a connector having a first portion and a second portion, the first portion spaced from the second portion; providing the first portion of the connector over the contact area with a layer of solder between the first portion of the connector and the preselected contact area, the solder having a melting temperature and the composition of the solder comprises the following ingredients by weight percent: tin 29.70-30.30 indium 64.35-65.65 silver 4.05-4.95 copper 0.25-0.75 wherein the layer of solder is in contact with the first portion of the connector and the preselected contact area, and is not soldered to at least one component selected from the group of the first portion of the connector and the preselected contact area; positioning a second sheet having a peripheral edge over the first portion of the connector and the preselected contact area to provide a subassembly, the second portion of the connector extending beyond the peripheral edge of at least one of the sheets; heating the subassembly to a temperature greater than the melting temperature of the solder to melt the layer of solder, and cooling the subassembly to solidify the melted layer of solder to solder the first portion of the connector and the preselected contact area together and provide electrical contact to the conductive arrangement at least through the second portion of the connector. 17. The method according to claim 1 wherein the composition of the solder comprises the following ingredients: 46-60 weight percent indium and 40-54 weight percent tin. 18. The method according to claim 17 wherein the solder has a eutectic temperature of no greater than 250° F. 19. The method according to claim 1 wherein the first portion of the connector is tinned with solder. 20. The method according to claim 1 wherein the second sheet is a plastic sheet, and the plastic sheet and the first sheet are heated during the practice of the heating step, and further comprising the step of biasing the heated first sheet and heated plastic sheet toward one another, wherein during the practice of the cooling step the first sheet and the plastic sheet are laminated together. 21. The method according to claim 2 wherein the first and second sheets are glass sheets, and further comprising the step of biasing the heated first and second sheets toward one another against the interlayer sheet, and during the practice of the cooling step the first and second glass sheets and the interlayer sheet are laminated together to provide the laminate. 22. The method according to claim 3 wherein the first and second sheets are glass sheets, and further comprising the step of biasing the heated first and second glass sheets toward one another against the interlayer sheet and during the practice of the cooling step the first and second glass sheets and the interlayer sheet are laminated together to provide the laminate. 23. The method according to claim 3 wherein the step of heating the subassembly is practiced by heating the subassembly having the second layer of solder in contact with the first portion of the second lead and the contact area of the second bus bar, and not soldered to at least one component selected from the group of the first portion of the second lead and the contact area of the second bus bar, the subassembly heated to a temperature greater than the melting temperature of the second layer of solder to melt the second layer of solder. 24. The method according to claim 15 wherein no more than 5% by weight of the solder composition is ingredients other than indium and tin. 25. The method according to claim 1 wherein the laminate is an automotive transparency. 26. The method according to claim 2 wherein the heating chamber is an autoclave. 27. The method according to claim 3, wherein the layer of solder comprises the following ingredients by weight percent: tin less than 50 indium more than 50. 28. The method according to claim 27 wherein no more than 5% by weight of the solder composition is ingredients other than indium and tin. 29. The method according to claim 1 wherein the heating and cooling step are part of a laminating cycle.
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