Stress release mold for thermal setting compositions and systems thereof
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B29C-033/50
B29C-033/48
B29C-039/36
B29C-039/22
출원번호
US-0172532
(2005-06-30)
발명자
/ 주소
Abbas,Syed Husain
Lang,David John
출원인 / 주소
Conopco, Inc.
인용정보
피인용 횟수 :
1인용 특허 :
6
초록▼
A stress-release mold is described for casting thermosetting compositions especially compositions designed for consumer use. At least one wall of the mold includes a stress-releasing-element characterized by having a more flexible region or regions than the remaining wall or walls of the mold and wh
A stress-release mold is described for casting thermosetting compositions especially compositions designed for consumer use. At least one wall of the mold includes a stress-releasing-element characterized by having a more flexible region or regions than the remaining wall or walls of the mold and wherein the stress-releasing-element includes a region of lower curvature at least partially surrounded by a region of higher curvature. The stress-release mold greatly reduces or eliminates surface defects caused by shrinkage of thermosetting compositions as they cools. A system is also described that includes the inventive mold containing a thermosetting composition wherein the mold also serves as all or part of the package for the composition.
대표청구항▼
The invention claimed is: 1. A mold for casting thermal setting compositions comprising a cavity bounded by a wall or walls; wherein at least one wall includes a stress-releasing-element comprising a region of lower curvature and an at least partially surrounding region of higher curvature and wher
The invention claimed is: 1. A mold for casting thermal setting compositions comprising a cavity bounded by a wall or walls; wherein at least one wall includes a stress-releasing-element comprising a region of lower curvature and an at least partially surrounding region of higher curvature and wherein the average flexibility, FSRE(AVE), of the lower curvature region and/or the surrounding higher curvature region comprising the stress-releasing-element, is greater than the average flexibility of remaining wall or remaining walls of the mold, FRW(AVE). 2. A mold according to claim 1 wherein the wall or walls comprise a polymer or copolymer selected from the group consisting of polycarbonate, polyethylene terephthalate (including atactic forms) and other polyesters, polyvinyl chloride, high density polyethylene, low density polyethylene, linear low density polyethylene, polypropylene, biaxially orientated polypropylene, ethylene-vinyl alcohol copolymers, ethylene vinylacetate copolymers, polystyrene, acrylic/styrene/butadiene copolymers and blends of these polymers and copolymers formed of their constituent monomers. 3. A mold according to claim 1 wherein the wall or walls is a laminated film comprising at least one polymer layer. 4. A mold according to claim 1 wherein a ratio of F SRE(AVE) to FRW(AVE) is greater than about 1.2. 5. A mold according to claim 1 wherein a ratio of F SRE(AVE) to FRW(AVE) is about 1.5 or or greater. 6. A mold according to claim 1 wherein the lower curvature region and/or the at least partially surrounding higher curvature region comprising the stress-releasing-element has an average thickness, T SRE(AVE) that is lower than the average thickness of the remaining wall or walls, TRW(AVE). 7. A mold according to claim 6 wherein a ratio of T SRE(AVE) to TRW(AVE) is less than about 0.92. 8. A mold according to claim 6 wherein a ratio of T SRE(AVE) to TRW(AVE) is about 0.75 or less. 9. A mold according to claim 1 wherein the average thickness of the remaining wall or walls is in the range of from about 100 microns to about 600 microns. 10. A mold according to claim 1 wherein the region of lower curvature is completely surrounded by the region of higher curvature. 11. A mold according to claim 10 wherein the region of lower curvature and the region of higher curvature are concentric. 12. A system comprising a mold containing a shaped thermal setting composition suitable for contact to skin; said mold comprising a cavity bounded by a wall or walls; wherein at least one wall includes a stress-releasing-element comprising a region of lower curvature and an at least partially surrounding region of higher curvature and wherein the average flexibility, FSRE(AVE), of the lower curvature region and/or the surrounding higher curvature region comprising the stress-releasing-element, is greater than the average flexibility of remaining wall or remaining walls of the mold, FRW(AVE); and wherein the mold serves as all or a part of a package for the shaped thermal setting composition at point of sale. 13. A system according to claim 12, wherein the shaped thermal setting composition is suitable for cleansing skin, hair, laundry, or hard surfaces. 14. A system according to claim 12 wherein the shaped thermal setting composition is an aqueous based composition comprising a surfactant selected from the group consisting of anionic, nonionic, amphoteric, and cationic surfactants and mixtures thereof. 15. A system according to claim 14 wherein the aqueous based composition has melting point or softening point of at least about 60° C. 16. A system according to claim 12 wherein the wall or walls of the mold is comprised of a polymer or copolymer selected from the group consisting of polycarbonate, polyethylene terephthalate (including atactic forms) and other polyesters, polyvinyl chloride, high density polyethylene, low density polyethylene, linear low density polyethylene, polypropylene, biaxially orientated polypropylene, ethylene-vinyl alcohol copolymers, ethylene vinylacetate copolymers, polystyrene, acrylic/styrene/butadiene copolymers and blends of these polymers and copolymers formed of their constituent monomers. 17. A system according to claim 12 wherein a ratio of F SRE(AVE) to FRW(AVE) is greater than about 1.2. 18. A system according to claim 12 wherein a ratio of F SRE(AVE) to FRW(AVE) is about 1.5 or greater. 19. A system according to claim 12 wherein the lower curvature region and/or the at least partially surrounding higher curvature region comprising the stress-releasing-element has an average thickness, TSRE(AVE) that is lower than the average thickness of the remaining wall or walls, TRW(AVE). 20. A system according to claim 19 wherein a ratio of T SRE(AVE) to TRW(AVE) is less than about 0.92. 21. A system according to claim 19 wherein a ratio of T SRE(AVE) to TRW(AVE) is about 0.75 or less. 22. A system according to claim 12 wherein the average thickness of the remaining wall or remaining walls is in the range of from about 100 microns to about 600 microns. 23. A system according to claim 12 wherein the thermosetting composition is an aqueous composition comprising a separate included non-aqueous phase selected from the group consisting of dispersed oil, dispersed gas, fibrous material, and mixtures thereof. 24. A system according to claim 12 wherein the thermosetting composition and/or the mold is/are translucent or transparent.
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