A substrate bonding apparatus for a liquid crystal display device panel includes an upper chamber plate, a lower chamber plate opposing the upper chamber plate, an upper low vacuum chamber provided on the upper chamber plate, a lower low vacuum chamber provided on a rear surface of the lower chamber
A substrate bonding apparatus for a liquid crystal display device panel includes an upper chamber plate, a lower chamber plate opposing the upper chamber plate, an upper low vacuum chamber provided on the upper chamber plate, a lower low vacuum chamber provided on a rear surface of the lower chamber plate, a sealing member provided on the lower chamber plate, the sealing member projecting from a top surface of the lower chamber plate at a predetermined height to contact the upper chamber plate to form a high vacuum chamber therein, at least two holes provided in each of the upper and lower chamber plates, at least two flow shut-off systems shutting off each of the holes, vacuum pumping system for reducing pressures of the upper and lower low vacuum chambers to low vacuum states, and reducing the high vacuum chamber to a high vacuum state, and upper and lower stages provided to upper and lower chamber plates, respectively, within an inside space of the high vacuum chamber to affix first and second substrates of the liquid crystal display device panel, respectively.
대표청구항▼
What is claimed is: 1. A method for fabricating a liquid crystal display device, the method comprising: loading a first substrate onto a stage of an upper chamber plate of an upper low vacuum chamber; loading a second substrate onto a stage of a lower chamber plate of a lower low vacuum chamber, th
What is claimed is: 1. A method for fabricating a liquid crystal display device, the method comprising: loading a first substrate onto a stage of an upper chamber plate of an upper low vacuum chamber; loading a second substrate onto a stage of a lower chamber plate of a lower low vacuum chamber, the lower chamber plate opposing the upper chamber plate; lowering the upper low vacuum chamber to the lower low vacuum chamber; sealing the upper and lower low vacuum chambers using a sealing member provided on the lower chamber plate, the sealing member projecting from a top surface of the lower chamber plate at a predetermined height to contact the upper chamber plate to form a high vacuum chamber therein; reducing a pressure of the high vacuum chamber; bonding the first and second substrates together in the high vacuum chamber; increasing pressures of the high vacuum chamber; raising the upper low vacuum chamber from the lower low vacuum chamber; and removing the bonded first and second substrates from the lower low vacuum chamber. 2. The method according to claim 1, further comprising reducing interior pressures of the upper and lower low vacuum chambers. 3. The method according to claim 2, wherein the reducing interior pressures includes providing at least two holes disposed in each of the upper and lower chamber plates. 4. The method according to claim 3, wherein the reducing interior pressures includes providing at least two flow shut-off systems connected to the at least two holes. 5. The method according to claim 4, wherein the flow shut-off systems include solenoid valves. 6. The method according to claim 3, wherein the at least two holes are provided within center regions of each of the upper and lower chamber plates. 7. The method according to claim 1, wherein the upper chamber plate and the upper low vacuum chamber are moved along upward and downward directions by a first driving system. 8. The method according to claim 1, wherein the upper and lower stages are affixed to the upper and lower chamber plates, respectively, by fixing blocks. 9. The method according to claim 1, further comprising mounting at least one electrostatic chuck on a lower surface of the upper stage and an upper surface of the lower stage to hold the first and second substrates by electrostatic force, and providing at least one hole to hold the first and second substrates with a vacuum suction force. 10. The method according to claim 1, wherein the sealing member includes an O-ring. 11. The method according to claim 1, further comprising providing an interlock system on the upper chamber plate. 12. The method according to claim 11, wherein the interlock system includes a plurality of linear actuators extending through the upper chamber plate. 13. The method according to claim 12, wherein the linear actuators extend into holes formed along a top surface of the lower chamber plate. 14. A method of manufacturing a liquid crystal display (LCD) device, comprising: providing a first substrate; providing a second substrate; dispensing a liquid crystal on either the first or second substrate; forming a seal pattern with a sealant on either the first or second substrate; loading the first substrate onto a stage of an upper chamber plate of an upper low vacuum chamber; loading the second substrate onto a stage of a lower chamber plate of a lower low vacuum chamber, the lower chamber plate opposing the upper chamber plate; lowering the upper low vacuum chamber to the lower low vacuum chamber; reducing a pressure of the high vacuum chamber; bonding the first and second substrates together in the high vacuum chamber, wherein height of the first and second substrates is substantially uniform; increasing the pressures of the high vacuum chamber; raising the upper low vacuum chamber from the lower low vacuum chamber; and removing the bonded first and second substrates from the lower low vacuum chamber, cutting the bonded first and second substrates; wherein the liquid crystal is uniformly filled between the first and second substrates and the liquid crystal substantially does not come into contact with the sealant before curing.
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이 특허에 인용된 특허 (41)
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