IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0045157
(2005-01-31)
|
우선권정보 |
JP-2002-223021(2002-07-31) |
발명자
/ 주소 |
- Kobashi,Masahiro
- Handa,Keishin
- Aramaki,Shinji
- Sakai,Yoshimasa
|
출원인 / 주소 |
- Mitsubishi Chemical Corporation
|
대리인 / 주소 |
Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
|
인용정보 |
피인용 횟수 :
5 인용 특허 :
4 |
초록
▼
A field effect transistor comprising, as provided on a support substrate, an insulation layer, a gate electrode and an organic semiconductor layer separated by the insulation layer, a source electrode and a drain electrode provided so as to contact the organic semiconductor layer, wherein elongation
A field effect transistor comprising, as provided on a support substrate, an insulation layer, a gate electrode and an organic semiconductor layer separated by the insulation layer, a source electrode and a drain electrode provided so as to contact the organic semiconductor layer, wherein elongation ε1 (%) at the yield point of the insulation layer is larger than elongation ε 2 (%) at the yield point of the support substrate.
대표청구항
▼
What is claimed is: 1. A field effect transistor comprising an insulation layer, a gate electrode and an organic semiconductor layer separated by the insulation layer, a source electrode and a drain electrode provided so as to contact the organic semiconductor layer, and a support substrate contain
What is claimed is: 1. A field effect transistor comprising an insulation layer, a gate electrode and an organic semiconductor layer separated by the insulation layer, a source electrode and a drain electrode provided so as to contact the organic semiconductor layer, and a support substrate containing a polymer, wherein elongation ε1 (%) at the yield point of the insulation layer is larger than elongation ε2 (%) at the yield point of the support substrate. 2. The field effect transistor according to claim 1, wherein the ratio (ε1/ε2) of elongation ε1 (%) at the yield point of the insulation layer to elongation ε2 (%) at the yield point of the support substrate, is at least 1. 3. The field effect transistor according to claim 1, wherein the ratio (ε1/ε2) of elongation ε1 (%) at the yield point of the insulation layer to elongation ε2 (%) at the yield point of the support substrate, is at most 15. 4. The field effect transistor according to claim 1, wherein the insulation layer has a thickness of from 0.1 to 4 μm. 5. The field effect transistor according to claim 1, wherein the support substrate has a thickness of from 0.01 to 2 mm. 6. The field effect transistor according to claim 1, wherein the gate electrode is provided on the support substrate, and the organic semiconductor layer is provided on the gate electrode via the insulation layer. 7. The field effect transistor according to claim 1, wherein the source electrode and the drain electrode are in contact with the insulation layer. 8. The field effect transistor according to claim 1, wherein the source electrode and the drain electrode are provided on the organic semiconductor layer. 9. The field effect transistor according to claim 1, wherein the source electrode and the drain electrode are provided on the support substrate. 10. The field effect transistor according to claim 1, wherein the support substrate is a plastic substrate selected from the group consisting of a polyester, a polycarbonate, a polyimide, an amorphous polyolefin, a polyether sulfone, an epoxy resin, a polyamide, a polybenzoxazole, a polybenzothiazole, a vinyl polymer, a polyparabanic acid, a polysilsesquioxane and a siloxane. 11. The field effect transistor according to claim 1, wherein the relative dielectric constant in the insulation layer is at least 0.2. 12. The field effect transistor according to claim 1, wherein the electrical conductivity in the insulation layer is at most 10-12 S/cm.
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