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Foamed mechanical planarization pads made with supercritical fluid 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B29C-044/02
출원번호 US-0180408 (2002-06-24)
발명자 / 주소
  • Kramer,Stephen J
출원인 / 주소
  • Micron Technology, Inc.
대리인 / 주소
    Fish & Neave IP Group Ropes &Gray LLP
인용정보 피인용 횟수 : 39  인용 특허 : 19

초록

Foamed thermoplastic polymeric mechanical planarization polishing pads ("MP pads") made with supercritical fluids are presented. A supercritical fluid foaming agent is dissolved in a thermoplastic polymer. A rapid change in the solubility and volume of the supercritical fluid foaming agent in the t

대표청구항

I claim: 1. A method of fabricating foamed thermoplastic polymeric mechanical planarization polishing pads using supercritical fluid, the method comprising: molding a solid thermoplastic polymer in a mechanical planarization polishing pad mold to form an unfoamed thermoplastic polymeric pad; impreg

이 특허에 인용된 특허 (19)

  1. Tolles Robert D. ; Mear Steven T. ; Prabhu Gopalakrishna B. ; Zuniga Steven ; Chen Hung, CMP polishing pad.
  2. Berman Michael J., Conditioning CMP polishing pad using a high pressure fluid.
  3. Mukaiyama Shigemi (Suzuka JPX) Noro Shoji (Suzuka JPX), Expandable fluorine-contained polymer compositions and foams of fluorine-contained polymer obtained from the composition.
  4. Tupil Srinath P. ; Buchner Klaus,CHX ; Lahmann Patrick M., Lamination of microcellular articles.
  5. Finkelman Alex, Method and apparatus for conditioning a polishing pad.
  6. Burnham Theodore A. ; Cha Sung W. ; Walat Robert H. ; Kim Roland Y. ; Anderson Jere R. ; Stevenson James F. ; Suh Nam P. ; Pallaver Matthew, Method and apparatus for microcellular polymer extrusion.
  7. Blizard Kent ; Tupil Srinath ; Malavich William, Method and apparatus for microcellular polypropylene extrusion, and polypropylene articles produced thereby.
  8. Park Chul B.,CAX ; Suh Nam P. ; Baldwin Daniel F., Method for providing continuous processing of microcellular and supermicrocellular foamed materials.
  9. Shamouillan Shamouil (San Jose CA) Clark Daniel O. (Pleasanton CA), Method of fabricating chemical-mechanical polishing pad providing polishing uniformity.
  10. Xu Jingyi, Methods for manufacturing foam material including systems with pressure restriction element.
  11. Blizard Kent ; Okamoto Kelvin T. ; Anderson Jere R., Microcellular articles and methods of their production.
  12. Blizard Kent ; Okamoto Kelvin T. ; Anderson Jere R., Microcellular articles and methods of their production.
  13. Cha Sung W. (Cambridge MA) Suh Nam P. (Sudbury MA) Baldwin Daniel F. (Medford MA) Park Chul B. (Cambridge MA), Microcellular thermoplastic foamed with supercritical fluid.
  14. Budinger William D. (Kennett Square PA) Jensen Elmer W. (Wilmington DE), Pad material for grinding, lapping and polishing.
  15. Cook Lee Melbourne ; James David B. ; Jenkins Charles William ; Reinhardt Heinz F. ; Roberts John V. H. ; Pillai Raj Raghav, Polishing pads and methods relating thereto.
  16. Roberts John H. V. ; James David B. ; Cook Lee Melbourne, Polishing pads and methods relating thereto.
  17. Sevilla Roland K. ; Kaufman Frank B. ; Anjur Sriram P., Polishing pads for a semiconductor substrate.
  18. Obeng, Yaw S.; Yokley, Edward M., Thermal management with filled polymeric polishing pads and applications therefor.
  19. St. Clair David John ; Erickson James Robert, Waterborne dispersions of epoxidized polydiene block copolymers and amino resins.

이 특허를 인용한 특허 (39)

  1. Sulfridge, Marc, Conductive interconnect structures and formation methods using supercritical fluids.
  2. Sulfridge, Marc, Conductive interconnect structures and formation methods using supercritical fluids.
  3. Sulfridge, Marc, Conductive interconnect structures and formation methods using supercritical fluids.
  4. Prissok, Frank; Braun, Frank, Foams based on thermoplastic polyurethanes.
  5. Okamoto, Akio; Miyamoto, Kazuaki, Method for injection expansion molding of thermoplastic resin.
  6. Chong, Chin Hui; Lee, Choon Kuan, Method of manufacturing an interposer.
  7. Kirby, Kyle K., Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods.
  8. Kirby, Kyle K., Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods.
  9. Sulfridge, Marc, Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods.
  10. Sulfridge, Marc, Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods.
  11. Sulfridge, Marc, Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods.
  12. Oliver,Steven D.; Kirby,Kyle K.; Hiatt,William M., Methods for forming interconnects in vias and microelectronic workpieces including such interconnects.
  13. Rigg,Sidney B.; Watkins,Charles M.; Kirby,Kyle K.; Benson,Peter A.; Akram,Salman, Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices.
  14. Hiatt, William M.; Kirby, Kyle K., Microelectronic devices and methods for filing vias in microelectronic devices.
  15. Hiatt, William M.; Kirby, Kyle K., Microelectronic devices and methods for filling vias in microelectronic devices.
  16. Kirby, Kyle K.; Akram, Salman; Hembree, David R.; Rigg, Sidney B.; Farnworth, Warren M.; Hiatt, William M., Microelectronic devices and methods for forming interconnects in microelectronic devices.
  17. Kirby, Kyle K.; Akram, Salman; Hembree, David R.; Rigg, Sidney B.; Farnworth, Warren M.; Hiatt, William M., Microelectronic devices and methods for forming interconnects in microelectronic devices.
  18. Clark, Douglas; Oliver, Steven D.; Kirby, Kyle K.; Dando, Ross S., Microelectronic workpieces and methods and systems for forming interconnects in microelectronic workpieces.
  19. Rigg, Sidney B.; Watkins, Charles M.; Kirby, Kyle K.; Benson, Peter A.; Akram, Salman, Microelectronics devices, having vias, and packaged microelectronic devices having vias.
  20. Lee, Teck Kheng; Lim, Andrew Chong Pei, Microfeature workpiece substrates having through-substrate vias, and associated methods of formation.
  21. Hiatt, William M.; Dando, Ross S., Microfeature workpieces and methods for forming interconnects in microfeature workpieces.
  22. Borthakur, Swarnal, Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods.
  23. Borthakur, Swarnal, Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods.
  24. Borthakur, Swarnal, Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods.
  25. Tuttle, Mark E., Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods.
  26. Tuttle, Mark E., Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods.
  27. Sandler, Jan Kurt Walter; Bellin, Ingo; Djuric, Dejan; Kolter, Karl; Ruckdäschel, Holger, Nanoporous foamed active compound-containing preparations based on pharmaceutically acceptable thermoplastically workable polymers.
  28. Lee, Teck Kheng, Partitioned through-layer via and associated systems and methods.
  29. Lee, Teck Kheng, Partitioned through-layer via and associated systems and methods.
  30. Lee, Teck Kheng, Partitioned through-layer via and associated systems and methods.
  31. Chong,Chin Hui; Lee,Choon Kuan, Slanted vias for electrical circuits on circuit boards and other substrates.
  32. Watkins, Charles M.; Hiatt, William M., System and methods for forming apertures in microfeature workpieces.
  33. Watkins, Charles M.; Hiatt, William M., Systems and methods for forming apertures in microfeature workpieces.
  34. Watkins, Charles M.; Hiatt, William M., Systems and methods for forming apertures in microfeature workpieces.
  35. Watkins, Charles M.; Hiatt, William M., Systems and methods for forming apertures in microfeature workpieces.
  36. Watkins, Charles M.; Hiatt, William M., Systems and methods for forming apertures in microfeature workpieces.
  37. Akram, Salman; Watkins, Charles M.; Hiatt, William M.; Hembree, David R.; Wark, James M.; Farnworth, Warren M.; Tuttle, Mark E.; Rigg, Sidney B.; Oliver, Steven D.; Kirby, Kyle K.; Wood, Alan G.; Velicky, Lu, Through-wafer interconnects for photoimager and memory wafers.
  38. Akram, Salman; Watkins, Charles M.; Hiatt, William M.; Hembree, David R.; Wark, James M.; Farnworth, Warren M.; Tuttle, Mark E.; Rigg, Sidney B.; Oliver, Steven D.; Kirby, Kyle K.; Wood, Alan G.; Velicky, Lu, Through-wafer interconnects for photoimager and memory wafers.
  39. Akram, Salman; Watkins, Charles M.; Hiatt, William M.; Hembree, David R.; Wark, James M.; Farnworth, Warren M.; Tuttle, Mark E.; Rigg, Sidney B.; Oliver, Steven D.; Kirby, Kyle K.; Wood, Alan G.; Velicky, Lu, Through-wafer interconnects for photoimager and memory wafers.
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